Patent Application
20180056296
The present disclosure generally relates to apparatuses, systems and methods for thermocycler devices.
Thermal cycling in support of Polymerase Chain Reaction (PCR) is a ubiquitous technology found in over 90% of molecular biology laboratories worldwide.
To amplify DNA (Deoxyribose Nucleic Acid) using the PCR process, involves cycling a specially constituted liquid reaction mixture through several different temperature incubation periods. The reaction mixture is comprised of various components including the DNA to be amplified and at least two primers sufficiently complementary to the sample DNA to be able to create extension products of the DNA being amplified. A key to PCR is the concept of thermal cycling: alternating steps of denaturing DNA, annealing short primers to the resulting single strands, and extending those primers to make new copies of double-stranded DNA. In thermal cycling the PCR reaction mixture is repeatedly cycled from high temperatures of around 95° C. for denaturing the DNA, to lower temperatures of approximately 50° C. to 70° C. for primer annealing and extension.
In some previous automated PCR instruments, sample tubes are inserted into sample wells on a metal block. To perform the PCR process, the temperature of the metal block is cycled according to prescribed temperatures and times specified by the user in a PCR protocol. The cycling is controlled by a computer and associated electronics. As the metal block changes temperature, the samples in the various tubes experience similar changes in temperature. However, in these previous instruments differences in sample temperature can be generated by non-uniformity of temperature from region to region within the sample metal block. Temperature gradients exist within the material of the block, causing some samples placed on the block to have different temperatures than others at particular times in the cycle. These differences in temperature and delays in heat transfer can cause the yield of the PCR process to differ from sample vial to sample vial. To perform the PCR process successfully and efficiently and to enable specialized applications (such as quantitative PCR), these temperature errors must be minimized as much as possible. The problems of minimizing non-uniformity in temperature at various points on the sample block become particularly acute when the size of the region containing samples becomes large as in a standard 8 by 12 microtiter plate.
Apparatuses, systems, and methods for providing thermal uniformity throughout a thermocycler sample block are disclosed.
In one aspect, a thermal block assembly including a sample block and two or more thermoelectric devices, is disclosed. The sample block has a top surface configured to receive a plurality of reaction vessels and an opposing bottom surface. The thermoelectric devices are operably coupled to the sample block, wherein each thermoelectric device includes a housing for a thermal sensor and a thermal control interface with a controller. Each thermoelectric device is further configured to operate independently from each other to provide a substantially uniform temperature profile throughout the sample block.
In another aspect, a thermoelectric device including a first thermal conducting layer, a second thermal conducting layer, a plurality of Peltier elements and a thermal sensor, is disclosed. The Peltier elements are comprised of a semiconductor material and are sandwiched in between the first and the second thermal conducting layers. The thermal sensor is housed in between the first and the second thermal conducting layers.
In another aspect, a thermoelectric device including a first thermal conducting layer, a second thermal conducting layer, a plurality of Peltier elements and an open channel, is disclosed. The first and second thermal conducting layers have inner and outer surfaces. The plurality of Peltier elements comprised of semiconductor material that are adjacent to the inner surface of the first and second thermal conducting layers. The open channel is carved out of the first thermal conducting layer and the plurality of Peltier elements exposing the inner surface of the second thermal conducting layer. The open channel is configured to contain a thermal sensor.
In another aspect, a method for controlling sample block temperature is disclosed. A block assembly with a sample block and two or more thermoelectric devices (each housing a unique thermal sensor), is provided. The two or more thermoelectric devices are paired to their respective unique thermal sensors to form a thermal unit. The temperature of each thermal unit is independently controlled with a controller to provide a substantially uniform temperature profile throughout the sample block.
In another aspect, a thermal cycler system with a sample block assembly and controller, is disclosed. In various embodiments, the sample block assembly includes a sample block and two or more thermoelectric devices (each hosing a unique thermal sensor) in thermal communication with the sample block. In various embodiments, the sample block is configured to receive a plurality of reaction vessels. In various embodiments, the controller includes a computer processing unit with machine executable instructions and two or more communication ports. In various embodiments, each port is operably connected to one of the two or more thermoelectric devices and their respective thermal sensor. In various embodiments, the machine executable instructions are configured to individually adjust the temperature of each thermoelectric device based on the temperature measurements from their respective thermal sensor to provide a substantially uniform temperature profile throughout the sample block.
In another aspect, a thermal block assembly with two or more sample blocks, two or more sets of thermoelectric devices, a thermal control interface, and a controller, is disclosed. Each sample block has a top surface configured to receive a plurality of reaction vessels and an opposing bottom surface. Each set of thermo electric devices is operably coupled to each sample block. The thermal control interface is in communications with the controller.
In another aspect, a thermal block assembly with at least one sample block, at least one set of thermoelectric devices, a thermal control interface and a controller, is disclosed. The sample block has a top surface configured to receive a plurality of reaction vessels and an opposing bottom surface. The thermoelectric device is operable coupled to the sample block. The thermal control interface is in communications with the controller.
These and other features are provided herein.
For a more complete understanding of the principles disclosed herein, and the advantages thereof, reference is now made to the following descriptions taken in conjunction with the accompanying drawings, in which:
It is to be understood that the figures presented herein are not necessarily drawn to scale, nor are the objects in the figures necessarily drawn to scale in relationship to one another. The figures are depictions that are intended to bring clarity and understanding to various embodiments of apparatuses, systems, and methods disclosed herein. Moreover, it should be appreciated that the drawings are not intended to limit the scope of the present teachings in any way.
Embodiments of apparatuses, systems and methods for providing thermal uniformity throughout a thermocycler sample block are described in this specification. The section headings used herein are for organizational purposes only and are not to be construed as limiting the described subject matter in any way.
Reference will be made in detail to the various aspects of the disclosure, examples of which are illustrated in the accompanying drawings. Wherever possible, the same reference numbers will be used throughout the drawings to refer to the same or like parts.
In this detailed description of the various embodiments, for purposes of explanation, numerous specific details are set forth to provide a thorough understanding of the embodiments disclosed. One skilled in the art will appreciate, however, that these various embodiments may be practiced with or without these specific details. In other instances, structures and devices are shown in block diagram form. Furthermore, one skilled in the art can readily appreciate that the specific sequences in which methods are presented and performed are illustrative and it is contemplated that the sequences can be varied and still remain within the spirit and scope of the various embodiments disclosed herein.
All literature and similar materials cited in this application, including but not limited to, patents, patent applications, articles, books, treatises, and internet web pages are expressly incorporated by reference in their entirety for any purpose. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as is commonly understood by one of ordinary skill in the art to which the various embodiments described herein belongs. When definitions of terms in incorporated references appear to differ from the definitions provided in the present teachings, the definition provided in the present teachings shall control.
It will be appreciated that there is an implied “about” prior to the temperatures, concentrations, times, number of bases, coverage, etc. discussed in the present teachings, such that slight and insubstantial deviations are within the scope of the present teachings. In this application, the use of the singular includes the plural unless specifically stated otherwise. Also, the use of “comprise”, “comprises”, “comprising”, “contain”, “contains”, “containing”, “include”, “includes”, and “including” are not intended to be limiting. It is to be understood that both the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present teachings.
While the present teachings are described in conjunction with various embodiments, it is not intended that the present teachings be limited to such embodiments. On the contrary, the present teachings encompass various alternatives, modifications, and equivalents, as will be appreciated by those of skill in the art.
Further, in describing various embodiments, the specification may have presented a method and/or process as a particular sequence of steps. However, to the extent that the method or process does not rely on the particular order of steps set forth herein, the method or process should not be limited to the particular sequence of steps described. As one of ordinary skill in the art would appreciate, other sequences of steps may be possible. Therefore, the particular order of the steps set forth in the specification should not be construed as limitations on the claims. In addition, the claims directed to the method and/or process should not be limited to the performance of their steps in the order written, and one skilled in the art can readily appreciate that the sequences may be varied and still remain within the spirit and scope of the various embodiments.
Some of the embodiments described herein, can be practiced using various computer system configurations including hand-held devices, microprocessor systems, microprocessor-based or programmable consumer electronics, minicomputers, mainframe computers and the like. The embodiments can also be practiced in distributing computing environments where tasks are performed by remote processing devices that are linked through a network.
It should also be understood that the embodiments described herein can employ various computer-implemented operations involving data stored in computer systems. These operations are those requiring physical manipulation of physical quantities. Usually, though not necessarily, these quantities take the form of electrical or magnetic signals capable of being stored, transferred, combined, compared, and otherwise manipulated. Further, the manipulations performed are often referred to in terms, such as producing, identifying, determining, or comparing.
Any of the operations that form part of the embodiments described herein can be useful as machine operations. The embodiments, described herein, can also relate to a device or an apparatus for performing these operations. The apparatuses, systems and methods described herein can be specially constructed for the required purposes or it may be a general purpose computer selectively activated or configured by a computer program stored in the computer. In particular, various general purpose machines may be used with computer programs written in accordance with the teachings herein, or it may be more convenient to construct a more specialized apparatus to perform the required operations.
Certain embodiments can also be embodied as computer readable code on a computer readable medium. The computer readable medium is any data storage device that can store data, which can thereafter be read by a computer system. Examples of the computer readable medium include hard drives, network attached storage (NAS), read-only memory, random-access memory, CD-ROMs, CD-Rs, CD-RWs, magnetic tapes, and other optical, FLASH memory and non-optical data storage devices. The computer readable medium can also be distributed over a network coupled computer systems so that the computer readable code is stored and executed in a distributed fashion.
Generally, in the case of PCR, it can be desirable to change the sample temperature between the required temperatures in the cycle as quickly as possible for several reasons. First the chemical reaction has an optimum temperature for each of its stages and as such less time spent at non-optimum temperatures can mean a better chemical result is achieved. Secondly a minimum time is usually required at any given set point which sets minimum cycle time for each protocol and any time spent in transition between set points adds to this minimum time. Since the number of cycles is usually quite large, this transition time can significantly add to the total time needed to complete the amplification.
The absolute temperature that each reaction tube attains during each step of the protocol is critical to the yield of product. As the products are frequently subjected to quantization, the product yield from tube to tube must be as uniform as possible and therefore both the steady-state and dynamic thermal non-uniformity (TNU) must be excellent (i.e., minimized) throughout the block.
One skilled in the art will understand that many factors may contribute to a degraded TNU. Ambient effects, homogeneity of the sample block material, thermal interfaces between elements of a thermal block assembly, heated cover uniformity and efficiencies of the heating and cooling devices are some of the more common factors.
Additionally, TNU is dependent on the difference in temperature between the sample block and any elements or structures proximate to the sample block. In a typical construction of a sample block assembly, the sample block is physically mounted in an instrument and mechanically connected to elements of the instrument that may be at room temperature or ambient. The greater the difference in temperature is between the sample block and the ambient temperature elements of the instrument the greater the heat loss is from the block to the ambient elements. This heat loss is particularly evident at the edges and the corners of the sample block. Accordingly, TNU degrades as the temperature difference between the sample block and the ambient elements increase. For example, TNU is typically worse at 95° C. than it would be at 60° C.
One skilled in the art will also be familiar with common remedies used to improve a degraded TNU. Remedies such as heated cover geometries to enclose the sample block, electric edge heaters around the perimeter of the block and isolation of the sample block from ambient are all well known in the art.
Heat-pumping into and out of the samples can be accomplished by using various types of thermoelectric devices, including but not limited to, Peltier thermoelectric devices. In various embodiments, these Peltier devices can be constructed of pellets of n-type and p-type semiconductor material that are alternately placed in parallel to each other and are electrically connected in series. Examples of semiconductor materials that can be utilized to form the pellets in a Peltier device, include but are not limited to, bismuth telluride, lead telluride, bismuth selenium and silicon germanium. However, it should be appreciated that the pellets can be formed from any semiconductor material as long as the resulting Peltier device exhibits thermoelectric heating and cooling properties when a current is run through the Peltier device. In various embodiments, the interconnections between the pellets can be made with copper which can be bonded to a substrate. Examples of substrate materials that can be used include but are not limited to copper, aluminum, Aluminum Nitride, Beryllium Oxide, Polyimide or Aluminum Oxide. In various embodiments the substrate material can include Aluminum Oxide also known as Alumina. It should be understood, however, that the substrate can include any material that exhibits thermally conductive properties.
TNU of the sample block and therefore the samples can be critical to PCR performance. The concept of TNU is well known in the art as being a measured quantity usually obtained through the use of a TNU test fixture and thermal protocol (or procedure). Such a test fixture can include multiple temperature sensors that are individually inserted into a plurality of sample wells that are defined on the top surface of a sample block. In various embodiments, an array of 4 wells up to at least 384 wells can be defined on the top surface of a sample block. The actual wells selected for TNU measurements are frequently determined during the design of the sample block assembly and may represent those regions of the sample block that are most thermally diverse.
As discussed above, TNU can be measured through the use of a TNU protocol (or procedure). The protocol can be resident on a hand held device or a computer either of which is capable of executing machine-code. The protocol can dictate the ramp up and/or ramp down temperature or temperatures settings during which the TNU is to be measured. The thermal protocol may or may not include additional parameters depending on the type of TNU being measured. Dynamic TNU characterizes the thermal non-uniformity throughout the sample block while transitioning from one temperature to another. Static TNU characterizes the thermal non-uniformity of the sample block during a steady-state condition. The steady-state condition is usually defined as a hold time or dwell time. Further, the time lapsed during the hold time when the measurement is taken is also important due to the uniformity of the block improving with time.
For example, a TNU protocol can specify taking temperature measurements while cycling sample block temperatures between 95° C. and 60° C. The protocol can further specify the measurements being taken 30 seconds after the hold time or dwell time begins. At each temperature and time period all sensors in the fixture are read, and the results are stored in a memory.
The TNU is then calculated from the temperature readings obtained from the sensors. There are multiple methods of analyzing the temperature data. For example, one method for calculating TNU can involve identifying the warmest temperature and the coolest temperature recorded from all the sensors at a specific temperature point, for example 95° C. The TNU can then be calculated by subtracting the coolest temperature from the warmest temperature. This method can be referred to as the difference TNU.
Another example of calculating TNU can involve identifying the warmest temperature and the coolest temperature recorded from all the sensors at a specific temperature point, for example 95° C. The TNU can then be calculated by subtracting the coolest temperature from the warmest temperature, and then dividing the difference by two. This method can be referred to as the average difference TNU.
An industry standard, set in comparison with gel data, can express a TNU so defined as a difference of about 1.0° C., or an average difference of 0.5° C. Gel data refers to an analysis technique used in evaluating the results of DNA amplification through the use of electrophoresis in an agarose gel. This technique is well known to one skilled in the art of microbiology.
One of the most significant factors affecting the uniformity is variations in thermoelectric device performance between devices. The most difficult point at which to achieve good uniformity is during a constant temperature cycle that is set far away from ambient temperature. In practice, this would be setting a thermocycler at a constant temperature at approximately 95° C. or greater. Two or more thermoelectric devices can be matched under these conditions to make a set of devices, wherein they individually produce substantially the same temperature for a given input current. The thermoelectric devices can be matched to within 0.2° C. in any given set.
Many applications for heating and cooling a sample block utilize multiple Peltier devices. This is most common when the number of samples is large, for example 96 samples, 384 samples or greater than 384 samples. In these situations Peltier devices are typically connected thermally in parallel and electrically in series to provide each device with the same amount of electrical current, with the expectation that each device will produce substantially the same temperature across the block.
The electrical current can be provided by an electronic circuit frequently referred to, for example, as a controller, amplifier, power amplifier or adjustable power supply. Such a controller may also utilize a thermal sensor to indicate the temperature of a region of a sample block to provide thermal feedback. Thermal sensor devices such as thermistors, platinum resistance devices (PRT), resistance temperature detectors (RTD), thermocouples, bimetallic devices, liquid expansion devices, molecular change-of-state, silicon diodes, infrared radiators and silicon band gap temperature sensors are some of the well known devices capable of indicating the temperature of an object. In some embodiments the thermal sensor can be proximate to a Peltier device and in thermal communication with the sample block region. In representative systems of conventional art utilizing multiple Peltier devices, the number of Peltier devices used is typically an even number. For example, thermocycler systems with two, four, six or eight Peltier devices are well known in the art. In multiple device implementations the Peltiers can be grouped. For example, four devices can be a group of four devices or two groups of two devices. Six devices can be one group of six devices, two groups of 3 devices or 3 groups of two devices. Likewise eight devices can be one group of eight devices, two groups of four devices or four groups of two devices. The grouping is frequently dependent upon the application. For example, gradient enabled thermocycler systems typically utilize multiple groupings of two devices. In all conventional implementations of thermocylers with multiple Peltier devices, the individual devices within any group are typically electrically connected in series and thus not individually controlled.
As depicted herein, thermal block assembly 20 can be comprised of sample block 21, Peltier devices 22a and 22b, a first sensor 23, a second sensor 24 and a controller 27. The configuration shown in
It should be understood, however, that although the independent control of the Peltier devices is a desired feature, the depicted arrangement of the elements in
One skilled in the art may recognize that carving out a portion of first thermal conducting layer 31 and Peltier elements 35 to form open channel 32 can adversely impact the TNU across a sample block. This can be caused by the absence of Peltier elements 35 in the region of open channel 32. This potential negative effect on TNU will be discussed later in this disclosure.
As depicted herein, sample block assembly 400 can be comprised of sample block 410 and Peltier devices 420a and 420b. Peltier devices 420a and 420b can have substantially the same construction and features as those depicted in
Referring to thermal sensor 13 of
As depicted herein, sample block assembly 500 can be comprised of a sample block 410 and Peltier devices 420a and 420b.
In various embodiments, independent thermal control modules 570 and 580 can be independent modules each comprising a computer processor capable of executing machine-code suitable for independent thermal control of a Peltier device and associated thermal sensor. Similar to the embodiments depicted in
In various embodiments, the thermal block assembly depicted in block diagrams of
In some embodiments, the thermal block assembly can include more than one sample block. An example of such a sample block assembly is shown as
As depicted herein, sample block assembly 800 can be comprised of sample block 810 and sample block 820. Sample block 810 can be in thermal contact with Peltier device 815 and sample block 820 can be in thermal contact with Peltier device 825. In the embodiment shown in
In various embodiments, the sample block assembly of
According to various embodiments each unique physical thermal unit can be controlled independently as previously presented. The independent control capability can be accomplished through the use of various controller configurations including but not limited to multi-channel power amplifiers and multi-module power amplifiers. In either case a single channel or module can be used to control a single unique physical thermal unit. In various embodiments, unique physical thermal units can be combined to form virtual channels. Virtual channels can be formed by selectively controlling multiple physical channels or modules to the same temperature setpoint to thermally control multiple thermal units. For example, a controller can have six physical channels or modules. A six channel or module controller can combine unique physical thermal units into different sized virtual channels capable of providing a substantially uniform temperature across different sized sample blocks. In various embodiments, for example, six physical channels or modules can be used to provide substantially uniform temperature across a 96 well sample block configured as an 8×12 well rectangular array. In various embodiments the six physical channels or modules can be combined to form 2 virtual channels each virtual channel being the combination of 3 adjacent physical channels or modules. Such a configuration can provide a substantially uniform temperature across two 48 well sample blocks or two 96 well sample blocks. In various embodiments each 48 well sample block can be configured as an 8×6 rectangular well array. In various embodiments each 48 well sample block can be configured as 4×12 well rectangular well array. In various embodiments the six physical channels or modules can be combined to form three virtual channels. Such a configuration can provide a substantial uniform temperature across three 32 well sample blocks. In various embodiments each 32 well sample block can be configured as a 4×8 rectangular well array. It should be understood that the number of physical channels or modules is not limited to six, and that any number of channels or modules either greater than six or less than six are included in the present teachings.
According to various embodiments a thermocycler system can include a thermal block assembly and a base unit configured with a controller. In various embodiments the thermal block assembly can be removable from the base unit and replaced with a different thermal block assembly. Each thermal block assembly can be configured with a different sample block format. Sample block formats can be configured with different numbers of sample wells including but not limited to 16 wells, 32 wells, 48 wells, 96 wells or 384 wells.
In various embodiments the format of the sample block can be encoded in the sample block assembly. Encoding implementations including, but not limited to, hardware jumpers, resistive terminators, pull-up resistors, pull-down resistors or data written to a memory device can provide suitable encoding. In various embodiments the encoded sample block format can be communicated to the base unit and controller or to an externally connected computer device.
According to various embodiments the base unit or external computer device can be capable of decoding the block format communicated from the sample block assembly. In various embodiments the base unit or external computer device can be capable of determining what virtual channel configuration corresponds to the sample block format. In various embodiments the controller can combine the physical channels of the controller appropriately to result in the required virtual channel configuration.
In step 1306, the temperature of each of the thermal units can be independently controlled with a controller to maintain a substantially uniform temperature throughout the sample block. In various embodiments, the controller can be a multi-channel controller, similar to what has previously been described above. In various embodiments, the controller can be a multi-module controller, also similar to what has been described above.
As discussed above, an industry standard set in comparison with gel data, expresses TNU as either a difference of about 1.0° C., or an average difference of 0.5° C. The TNU values are calculated values based on sample block temperature measurements. In various embodiments temperature measurements are acquired from a set of thermal sensors located in specific wells of a sample block. In various embodiments the specific well locations of the sensors in the sample block are determined during the design phase of the sample block assembly and can represent the regions of the sample block that are most thermally diverse. As presented previously the temperature measurements are acquired through the use of a protocol (procedure) that can be resident on a hand held device or other computing device either of which is capable of executing machine-code. In various embodiments the protocol (procedure) can include thermal cycling parameters such as setpoint temperatures and dwell (hold) times. In various embodiments the thermal measurements can be taken during the transition (ramp) from one setpoint temperature to a second setpoint temperature to determine a dynamic TNU. In another embodiment the thermal measurements can be taken during the dwell (hold) time to determine a static TNU. In either case, the protocol (procedure) can include at what point in the dwell (hold) time or transition (ramp) time a measurement would be read.
For example, a TNU protocol can specify taking temperature measurements while cycling sample block temperatures between 95° C. and 60° C. The protocol can further specify the measurements being taken 30 seconds after the hold time or dwell time begins. At each temperature and time period all sensors in the fixture are read, and the results are stored in a memory.
The TNU is then calculated from the temperature readings obtained from the sensors. There are multiple methods of analyzing the temperature data. For example, one method for calculating TNU can involve identifying the warmest temperature and the coolest temperature recorded from all the sensors at a specific temperature point, for example 95° C. and 60° C. In various embodiments static TNU can be measured 30 seconds after the sample block reaches the setpoint temperature. The TNU can then be calculated by subtracting the coolest temperature from the warmest temperature. This method can be referred to as the difference TNU.
Another example of calculating TNU can involve identifying the warmest temperature and the coolest temperature recorded from all the sensors at a specific temperature point, for example 95° C. and 60° C. In various embodiments static TNU can be measured 30 seconds after the sample block reaches the setpoint temperature. The TNU can then be calculated by subtracting the coolest temperature from the warmest temperature, and then dividing the difference by two. This method can be referred to as the average difference TNU.
It should be noted that the TNU calculated from the sample block temperature measurements is not independent from setpoint temperature. As presented previously, heat loss from the sample block is greater when the temperature difference between the sample block and the ambient temperature is highest. A higher sample block setpoint, therefore, will inherently have a higher TNU. As a result, for example, the calculated TNU at a setpoint of 95° C. will be greater than the TNU calculated at a lower temperature, such as 60° C.
Also discussed above is that in certain system design configurations, thermal block assemblies can be subject to heat loss from the edges and corners of the sample block. Additionally the inclusion of open channel 32 in
According to various embodiments, there are several examples of edge heaters commercially available. For example, Thermafoil™ Heater (Minco Products, Inc., Minneapolis, Minn.), HEATFLEX Kapton™ Heater (Heatron, Inc., Leavenworth, Kans.), Flexible Heaters (Watlow Electric Manufacturing Company, St. Louis, Mo.), and Flexible Heaters (Ogden Manufacturing Company, Arlington Heights, Ill.).
According to various embodiments, the edge heaters can be vulcanized silicone rubber heaters, for example Rubber Heater Assemblies (Minco Products, Inc.), SL-B FlexibleSilicone Rubber Heaters (Chromalox, Inc., Pittsburgh, Pa.), Silicone Rubber Heaters (TransLogic, Inc., Huntington Beach, Calif.), Silicone Rubber Heaters (National Plastic Heater Sensor & Control Co., Scarborough, Ontario, Canada).
According to various embodiments, the edge heater can be coupled to the edge surface with a variety of pressure sensitive adhesive films. It is desirable to provide uniform thickness and lack of bubbles. Uniform thickness provides uniform contact and uniform heating. Bubbles under the edge heater can cause localized overheating and possible heater burnout. Typically, pressure-sensitive adhesives cure at specified temperature ranges. Examples of pressure-sensitive adhesive films include Minco #10, Minco #12, Minco #19, Minco #17, and Ablefilm 550k (AbleStik Laboratories, Rancho Dominguez, Calif.).
According to various embodiments, the edge heater can be coupled to the edge surface with liquid adhesives. Liquid adhesives are better suited for curved surfaces than pressure sensitive adhesives. Liquid adhesives can include 1-part pastes, 2-part pastes, RTV, epoxies, etc. Bubbles can substantially be avoided by special techniques such as drawing vacuum on the adhesive after mixing, or perforating heaters to permit the bubbles to escape. Examples of liquid adhesives include Minco #6, GE #566 (GE Silicones, Wilton, Conn.), Minco 25 #15, Crest 3135 AlB (Lord Chemical, Cary, N.C.).
According to various embodiments, the edge heater can be coupled to the edge surface by tape or shrink bands. Shrink bands can be constructed of Mylar or Kapton. Instead of an intermediate adhesive layer, the adhesive layer is moved to the top of the pasting heater. Examples of shrink bands and stretch tape include Minco BM3, Minco BK4, and Minco #20. According to various embodiments, the pasting heater can be laminated onto the edge surface, for example by films. According to various embodiments, edge heaters can be mechanically attached to the heating surface. For example, an edge heater with eyelets have be attached with a lacing cord, Velcro hooks and loops, metallic fasteners with springs, and independent fasteners with straps.
According to various embodiments, the heat supplied by an edge heater can be uniformly distributed or non-uniformly distributed. In various embodiments a non-uniform heat distribution can be more effective to compensate for non-uniform heat loss from a sample block to ambient as presented previously. The non-uniform heat loss can result from the corners of the sample block losing heat more rapidly than the longer edges of the sample block. In various embodiments non-uniform heat distribution can be provided by varying the heat density throughout the edge heater. This technique can, for example, compensate for non-uniform heat loss between the edges of a sample block and the corners as presented above.
According to various embodiments the heat distribution can be such that heat can be applied to specific areas of the block and no heat provided to other areas. This technique can, for example, compensate for features or regions of a sample block assembly that can be void of a heat source.
According to various embodiments one or more edge heaters can be used as presented above. Depending on the heat required, an edge heater can be affixed to one edge of a sample block. An additional edge heater can be affixed to an opposing edge surface or an adjacent edge surface of the sample block or both edge surfaces.
According to various embodiments individual edge heaters can be affixed to any or all four edge surfaces of a rectangular sample block. The use of multiple edge heaters can enable independent control of each edge heater to compensate for varying heat loss from the sample block during the execution of a thermal protocol (or procedure).
These effects are illustrated in the thermal plots shown in
Surface plot 1110 shows a slope in temperature on the left side of the plot while Surface plot 1120 shows a slope in temperature on the right side. One skilled in the art, by referring to
The surface plots of
One skilled in the art will notice that the inclusion of the edge heater has a positive effect for both the TNU at the high temperature and the TNU at the low temperature. Additionally, by comparing the surface plots of
Similar to the surface plots of
One skilled in the art will notice that the inclusion of the thermoelectric devices with the open channel which enables the capability of independent discrete thermal control of the thermoelectric devices has a positive effect for both the TNU at the high temperature and the TNU at the low temperature. Additionally, by comparing the surface plots of
While the foregoing embodiments have been described in some detail for purposes of clarity and understanding, it will be clear to one skilled in the art from a reading of this disclosure that various changes in form and detail can be made without departing from the true scope of the invention. For example, all the techniques, apparatuses and systems described above can be used in various combinations.
This application claims priority to U.S. application No. 61/878,464, filed Sep. 16, 2013, which disclosures are herein incorporated by reference in their entirety.
| Number | Date | Country | |
|---|---|---|---|
| 61878464 | Sep 2013 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 14917400 | Mar 2016 | US |
| Child | 15640241 | US |
