Patent Grant
10327343
Many activities require secure electronic communications. To facilitate secure electronic communications, an encryption/decryption system may be implemented on an electronic assembly or printed circuit board assembly that is included in equipment connected to a communications network. Such an electronic assembly is an enticing target for malefactors since it may contain codes or keys to decrypt intercepted messages, or to encode fraudulent messages. To prevent this, an electronic assembly may be mounted in an enclosure, which is then wrapped in a security sensor and encapsulated with polyurethane resin. A security sensor may be, in one or more embodiments, a web or sheet of insulating material with circuit elements, such as closely-spaced, conductive lines fabricated on it. The circuit elements are disrupted if the sensor is torn, and the tear can be sensed in order to generate an alarm signal. The alarm signal may be conveyed to a monitor circuit in order to reveal an attack on the integrity of the assembly. The alarm signal may also trigger an erasure of encryption/decryption keys stored within the electronic assembly.
Provided herein, in one or more aspects, is an assembly apparatus comprising a pressure cure fixture. The pressure cure fixture is sized to reside within a container, and facilitate applying pressure to an adhesive disposed over an inner surface of the container. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container. When heated, the pressure cure fixture expands greater than the container and imparts the pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container. Within the assembly apparatus, the container is an electronic enclosure, and the surface-mount element includes a tamper-respondent sensor.
In one or more other aspects, an assembly apparatus is provided which includes a pressure cure fixture sized to reside within an electronic enclosure, and facilitate applying pressure to an adhesive disposed over an inner surface of the electronic enclosure. The pressure cure fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the electronic enclosure, and is sized to correspond, at least in part, to an inner space of the electronic enclosure while allowing for the adhesive and a tamper-respondent sensor to be disposed between the pressure cure fixture and the inner surface of the electronic enclosure. When heated, the fixture expands greater than the electronic enclosure and imparts the pressure to the tamper-respondent sensor and the adhesive to facilitate securing the tamper-respondent sensor to the inner surface of the electronic enclosure. Further, the inner surface includes an inner-sidewall of the electronic enclosure, and the tamper-respondent sensor includes an inner-sidewall tamper-respondent sensor sized to cover the inner-sidewall of the electronic enclosure, and wherein the adhesive includes an adhesive sheet layer, at least one side of the adhesive sheet layer including a pressure-sensitive adhesive.
In one or more further aspects, a fabrication method is provided which includes providing an assembly apparatus. Providing the assembly apparatus includes: providing a pressure cure fixture sized to reside within a container and facilitate applying pressure to an adhesive disposed over an inner surface of the container during curing, the pressure cure fixture being formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and being sized to correspond, at least in part, to an inner space of the container while allowing for the adhesive and a surface-mount element to be disposed between the pressure cure fixture and the inner surface of the container; and wherein heating the container with the pressure cure fixture, surface-mount element and adhesive disposed therein expands the pressure cure fixture greater than the container and imparts pressure to the surface-mount element and the adhesive to facilitate securing the surface-mount element to the inner surface of the container, wherein the adhesive is a first adhesive, the pressure cure fixture is a first pressure cure fixture, the material of the first pressure cure fixture is a first material, and the surface-mount element is a first surface-mount element, and wherein the assembly apparatus further comprises a second pressure cure fixture to facilitate adhering a second surface-mount element to the inner surface of the container after the first surface-mount element has been adhered to the inner surface of the container, the second pressure cure fixture being formed of a second material with a higher coefficient of thermal expansion (CTE) than the container, the second pressure cure fixture being sized to correspond, at least in part, to the inner space of the container while allowing for the first surface-mount element, the second surface-mount element and a second adhesive to be disposed between the second pressure cure fixture and the inner surface of the container, wherein when heated, the second pressure cure fixture expands greater than the container and imparts pressure to the second surface-mount element and the second adhesive to facilitate securing the second surface-mount element to the inner surface of the container.
Additional features and advantages are realized through the techniques of the present invention. Other embodiments and aspects of the invention are described in detail herein and are considered a part of the claimed invention.
One or more aspects of the present invention are particularly pointed out and distinctly claimed as examples in the claims at the conclusion of the specification. The foregoing and other objects, features, and advantages of the invention are apparent from the following detailed description taken in conjunction with the accompanying drawings in which:
Aspects of the present invention and certain features, advantages, and details thereof, are explained more fully below with reference to the non-limiting example(s) illustrated in the accompanying drawings. Descriptions of well-known materials, fabrication tools, processing techniques, etc., are omitted so as not to unnecessarily obscure the invention in detail. It should be understood, however, that the detailed description and the specific example(s), while indicating aspects of the invention, are given by way of illustration only, and are not by way of limitation. Various substitutions, modifications, additions, and/or arrangements, within the spirit and/or scope of the underlying inventive concepts will be apparent to those skilled in the art for this disclosure. Note further that reference is made below to the drawings, which are not drawn to scale for ease of understanding, wherein the same reference numbers used throughout different figures designate the same or similar components. Also, note that numerous inventive aspects and features are disclosed herein, and unless otherwise inconsistent, each disclosed aspect or feature is combinable with any other disclosed aspect or feature as desired for a particular application, for instance, for establishing a secure volume about an electronic component or electronic assembly to be protected.
Reference is first made to
In one or more implementations, a tamper-proof electronic package such as depicted is configured or arranged to detect attempts to tamper-with or penetrate into electronic assembly enclosure 110. Accordingly, electronic assembly enclosure 110 also includes, for instance, a monitor circuit which, if tampering is detected, activates an erase circuit to erase information stored within the associated memory, as well as the encryption and/or decryption module within the communications card. These components may be mounted on, and interconnected by, a multilayer circuit board, such as a printed circuit board or other multilayer substrate, and be internally or externally powered via a power supply provided within the electronic assembly enclosure.
In the embodiment illustrated, and as one example only, electronic assembly enclosure 110 may be surrounded by a tamper-respondent sensor 120, an encapsulant 130, and an outer, thermally conductive enclosure 140. In one or more implementations, tamper-respondent sensor 120 may include a tamper-respondent laminate that is folded around electronic assembly enclosure 110, and encapsulant 130 may be provided in the form of a molding. Tamper-respondent sensor 120 may include various detection layers, which are monitored through, for instance, a ribbon cable by the enclosure monitor, against sudden violent attempts to penetrate enclosure 110 and damage the enclosure monitor or erase circuit, before information can be erased from the encryption module. The tamper-respondent sensor may be, for example, any such article commercially available or described in various publications and issued patents, or any enhanced article such as disclosed herein.
By way of example, tamper-respondent sensor 120 may be formed as a tamper-respondent laminate comprising a number of separate layers with, for instance, an outermost lamination-respondent layer including a matrix of, for example, diagonally-extending or sinusoidally-extending, conductive or semi-conductive lines printed onto a regular, thin insulating film. The matrix of lines forms a number of continuous conductors which would be broken if attempts are made to penetrate the film. The lines may be formed, for instance, by printing carbon-loaded Polymer Thick Film (PTF) ink onto the film and selectively connecting the lines on each side, by conductive vias, near the edges of the film. Connections between the lines and an enclosure monitor of the communications card may be provided via, for instance, one or more ribbon cables. The ribbon cable itself may be formed of lines of conductive ink printed onto an extension of the film, if desired. Connections between the matrix and the ribbon cable may be made via connectors formed on one edge of the film. As noted, the laminate may be wrapped around the electronic assembly enclosure to define the tamper-respondent sensor 120 surrounding enclosure 110.
In one or more implementations, the various elements of the laminate may be adhered together and wrapped around enclosure 110, in a similar manner to gift-wrapping a parcel, to define the tamper-respondent sensor shape 120. The assembly may be placed in a mold which is then filled with, for instance, cold-pour polyurethane, and the polyurethane may be cured and hardened to form an encapsulant 130. The encapsulant may, in one or more embodiments, completely surround the tamper-respondent sensor 120 and enclosure 110, and thus form a complete environmental seal, protecting the interior of the enclosure. The hardened polyurethane is resilient and increases robustness of the electronic package in normal use. Outer, thermally conductive enclosure 140 may optionally be provided over encapsulant 130 to, for instance, provide further structural rigidity to the electronic package.
Note that, as an enhancement, within a sealed electronic package, such as the tamper-proof electronic package depicted in
Hollow spacers 213 may be placed below dimples 206 in top metal shell 204, and rivets 214 provided, extending through openings in dimples 206, through hollow spacers 213 and through openings in printed circuit board 210 to base metal shell 202 in order to fixedly secure electronic assembly 208 within the enclosure formed by base and top metal shells 202, 204. A security mesh or tamper-respondent sensor 216 is wrapped around the top, base, and four sides of the enclosure formed by base and top metal shells 202, 204. As illustrated, in one or more embodiments, top metal shell 204 may have an opening through which a bus 220 extends. One end of bus 220 may be connected to conductors (not shown) on printed circuit board 210, and the other end may be connected to conductors (not shown) on a printed circuit board 222. As bus 220 passes through the opening, the bus extends between an inner edge region 223 of the security mesh 216 and an overlapping, outer edge region 224 of the security mesh 216. A group of wires 226 connect, in one embodiment, security mesh 216 to conductors on printed circuit board 210. Circuitry on printed circuit board 210 is responsive to a break or discontinuity in security sensor array 216, in which case, an alarm signal may be emitted on bus 220, and also encryption/decryption keys stored within electronic assembly 208 may be erased.
In one or more implementations, liquid polyurethane resin may be applied to security mesh 216 and cured. An outer, thermally conductive enclosure 228, such as a copper enclosure, may be filled with liquid polyurethane resin with the electronic assembly and inner enclosure and security mesh suspended within it. Upon curing the resin, the electronic assembly and inner enclosure and security mesh become embedded in a polyurethane block or encapsulant 230, as shown. The enclosure 228 is mounted on the printed circuit board 222, which can be accomplished using, for instance, legs 240 which extend through slots in printed circuit board 222 and terminate in flanges 242, which are then bent out of alignment with the slots. Bus 220 may be connected, by way of printed circuit board 222 to connectors 244 located along, for instance, one edge of printed circuit board 222.
When considering tamper-proof packaging, the electronic package needs to maintain defined tamper-proof requirements, such as those set forth in the National Institutes of Standards and Technology (NIST) Publication FIPS 140-2, which is a U.S. Government Computer Security Standard, used to accredit cryptographic modules. The NIST FIPS 140-2 defines four levels of security, named Level 1 to Level 4, with Security Level 1 providing the lowest level of security, and Security Level 4 providing the highest level of security. At Security Level 4, physical security mechanisms are provided to establish a complete envelope of protection around the cryptographic module, with the intent of detecting and responding to any unauthorized attempt at physical access. Penetration of the cryptographic module enclosure from any direction has a very high probability of being detected, resulting in the immediate zeroization of all plain text critical security parameters (CSPs). Security Level 4 cryptographic modules are useful for operation in physically unprotected environments. Security Level 4 also protects a cryptographic module against a security compromise due to environmental conditions or fluctuations outside of the module's normal operating ranges for voltages and temperature. Intentional excursions beyond the normal operating ranges may be used by an attacker to thwart the cryptographic module's defenses. The cryptographic module is required to either include specialized environmental protection features designed to detect fluctuations and zeroize critical security parameters, or to undergo rigorous environmental failure testing to provide reasonable assurance that the module will not be affected by fluctuations outside of the normal operating range in a manner that can compromise the security of the module.
To address the demands of ever-improving anti-intrusion technology, and the higher-performance encryption/decryption functions being provided, enhancements to the tamper-proof, tamper-evident packaging for the electronic assembly at issue are desired. Numerous enhancements are described hereinbelow to, for instance, tamper-respondent assemblies and tamper-respondent sensors. Note that the numerous inventive aspects described herein may be used singly, or in any desired combination. Additionally, in one or more implementations, the enhancements to tamper-proof electronic packaging described herein may be provided to work within defined space limitations for existing packages. For instance, one or more of the concepts described may be configured to work with peripheral component interconnect express (PCIe) size limits, and the limitations resulting from being capsulated in, for instance, an insulating encapsulant.
Thus, disclosed hereinbelow with reference to
As noted, as intrusion technology continues to evolve, anti-intrusion technology needs to continue to improve to stay ahead. In one or more implementations, the above-summarized tamper-respondent sensor 300 of
In one or more aspects, disclosed herein is a tamper-respondent sensor 300 with circuit lines 301 having reduced line widths W1 of, for instance, 200 μm, or less, such as less than or equal to 100 μm, or even more particularly, in the range of 30-70 μm. This is contrasted with conventional trace widths, which are typically on the order of 350 μm or larger. Commensurate with reducing the circuit line width W1, line-to-line spacing width Ws 303 is also reduced to less than or equal to 200 μm, such as less than or equal to 100 μm, or for instance, in a range of 30-70 μm. Advantageously, by reducing the line width W1 and line-to-line spacing Ws of circuit lines 301 within tamper-respondent sensor 300, the circuit line width and pitch is on the same order of magnitude as the smallest intrusion instruments currently available, and therefore, any intrusion attempt will necessarily remove a sufficient amount of a circuit line(s) to cause resistance to change, and thereby the tamper intrusion to be detected. Note that, by making the circuit line width of the smaller dimensions disclosed herein, any cutting or damage to the smaller-dimensioned circuit line will also be more likely to be detected, that is, due to a greater change in resistance. For instance, if an intrusion attempt cuts a 100 μm width line, it is more likely to reduce the line width sufficiently to detect the intrusion by a change in resistance. A change in a narrower line width is more likely to result in a detectable change in resistance, compared with, for instance, a 50% reduction in a more conventional line width of 350 μm to, for instance, 175 μm. The smaller the conductive circuit line width becomes, the more likely that a tampering of that line will be detected.
Note also that a variety of materials may advantageously be employed to form the circuit lines. For instance, the circuit lines may be formed of a conductive ink (such as a carbon-loaded conductive ink) printed onto one or both opposite sides of one or more of the flexible layers 302 in a stack of such layers. Alternatively, a metal or metal alloy could be used to form the circuit lines, such as copper, silver, intrinsically conductive polymers, carbon ink, or nickel-phosphorus (NiP), or Omega-Ply®, offered by Omega Technologies, Inc. of Culver City, Calif. (USA), or Ticer™ offered by Ticer Technologies, Chandler, Ariz. (USA). Note that the process employed to form the fine circuit lines or traces on the order described herein is dependent, in part, on the choice of material used for the circuit lines. For instance, if copper circuit lines are being fabricated, then additive processing, such as plating up copper traces, or subtractive processing, such as etching away unwanted copper between trace lines, may be employed. By way of further example, if conductive ink is employed as the circuit line material, fine circuit lines on the order disclosed herein can be achieved by focusing on the rheological properties of the conductive ink formulation. Further, rather than simple pneumatics of pushing conductive ink through an aperture in a stencil with a squeegee, the screen emulsion may be characterized as very thin (for instance, 150 to 200 μm), and a squeegee angle may be used such that the ink is sheared to achieve conductive ink breakaway rather than pumping the conductive ink through the screen apertures. Note that the screen for fine line width printing such as described herein may have the following characteristics in one specific embodiment: a fine polyester thread for both warp and weave on the order of 75 micrometers; a thread count between 250-320 threads per inch; a mesh thickness of, for instance, 150 micrometers; an open area between threads that is at least 1.5× to 2.0× the conductive ink particle size; and to maintain dimensional stability of the print, the screen snap-off is kept to a minimum due the screen strain during squeegee passage.
In one or more implementations, circuit lines 301 of tamper-respondent sensor 300 are electrically connected to define one or more resistive networks. Further, the circuit lines may include one or more resistive circuit lines by selecting the line material, line width W1 and line length L1, to provide a desired resistance per line. As one example, a “resistive circuit line” as used herein may comprise a line with 1000 ohms resistance or greater, end-to-end. In one specific example, a circuit line width of 50 μm, with a circuit line thickness of 10 μm may be used, with the line length L1 and material selected to achieve the desired resistance. At the dimensions described, good electrical conductors such as copper or silver may also be employed and still form a resistive network due to the fine dimensions noted. Alternatively, materials such as conductive ink or the above-noted OmegaPly® or Ticer™ may be used to define resistive circuit lines.
In a further aspect, the flexible layer 302 itself may be further reduced in thickness from a typical polyester layer by selecting a crystalline polymer to form the flexible layer or substrate. By way of example, the crystalline polymer could comprise polyvinylidene difluoride (PVDF), or Kapton, or other crystalline polymer material. Advantageously, use of a crystalline polymer as the substrate film may reduce thickness of the flexible layer 302 to, for instance, 2 mils thick from a more conventional amorphous polyester layer of, for instance, 5-6 mils. A crystalline polymer can be made much thinner, while still maintaining structural integrity of the flexible substrate, which advantageously allows for far more folding, and greater reliability of the sensor after folding. Note that the radius of any fold or curvature of the sensor is necessarily constrained by the thickness of the layers comprising the sensor. Thus, by reducing the flexible layer thickness to, for instance, 2 mils, then in a four tamper-respondent layer stack, the stack thickness can be reduced from, for instance, 20 mils in the case of a typical polyester film, to 10 mils or less with the use of crystalline polymer films.
By way of further example,
Referring collectively to
Tamper-proof electronic package 400 further includes an enclosure 420, such as a pedestal-type enclosure, mounted to multilayer circuit board 410 within, for instance, a continuous groove (or trench) 412 formed within an upper surface of multilayer circuit board 410. In one or more embodiments, enclosure 420 may comprise a thermally conductive material and operate as a heatsink for facilitating cooling of the one or more electronic components 402 within the secure volume. A security mesh or tamper-respondent sensor 421, such as the above-described tamper-respondent sensors of
As depicted in
As noted with reference to
Note that the embodiment depicted in
By way of further example,
As illustrated, one or more external signal lines or planes 505 enter secure volume 401 between, in this embodiment, two tamper-respondent mat layers 500, and then electrically connect upwards into the secure volume 401 through one or more conductive vias, arranged in any desired location and pattern. In the configuration depicted, the one or more tamper-respondent frames 501 are disposed at least inside of the area defined by continuous groove 512 accommodating the base of enclosure 520. Together with security sensor 421 associated with enclosure 420, tamper-respondent frames 501 define secure volume 401 where extending, in part, into multilayer circuit board 410. With secure volume 401 defined, at least in part, within multilayer circuit board 410, the external signal line(s) 505 may be securely electrically connected to, for instance, the one or more electronic components 402 (
Added security may be provided by extending tamper-respondent mat layers 500 (and if desired, tamper-respondent frames 501) outward past continuous groove 412 accommodating enclosure 420. In this manner, a line of attack may be made more difficult at the interface between enclosure 420 and multilayer circuit board 410 since the attack would need to clear tamper-respondent mat layers 500, the bottom edge of tamper-respondent sensor 421 associated with enclosure 420, as well as the tamper-respondent frames 501 of the embedded tamper-respondent sensor.
Variations on the multilayer circuit board 410 of
Note also that, once within the secure volume is defined within multilayer circuit board 410, conductive vias within the secure volume between layers of multilayer circuit board 410 may be either aligned, or offset, as desired, dependent upon the implementation. Alignment of conductive vias may facilitate, for instance, providing a shortest connection path, while offsetting conductive vias between layers may further enhance security of the tamper-proof electronic package by making an attack into the secure volume through or around one or more tamper-respondent layers of the multiple tamper-respondent layers more difficult.
The tamper-respondent layers of the embedded tamper-respondent sensor formed within the multilayer circuit board of the electronic circuit or electronic package may include multiple conductive traces or lines formed between, for instance, respective sets of input and output contacts or vias at the trace termination points. Any number of conductive traces or circuits may be employed in defining a tamper-respondent layer or a tamper-respondent circuit zone within a tamper-respondent layer. For instance, 4, 6, 8, etc., conductive traces may be formed in parallel (or otherwise) within a given tamper-respondent layer or circuit zone between the respective sets of input and output contacts to those conductive traces.
In one or more implementations, the multilayer circuit board may be a multilayer wiring board or printed circuit board formed, for instance, by building up the multiple layers of the board.
As illustrated in
A first photoresist 604 is provided over build-up 600, and patterned with one or more openings 605, through which the overlying conductive layer 603 may be etched. Depending on the materials employed, and the etch processes used, a second etch process may be desired to remove portions of trace material layer 602 to define the conductive traces of the subject tamper-respondent layer. First photoresist 604 may then be removed, and a second photoresist 604′ is provided over the conductive layer 603 features to remain, such as the input and output contacts. Exposed portions of conductive layer 603 are then etched, and the second photoresist 604′ may be removed, with any opening in the layer being filled, for instance, with an adhesive (or pre-preg) and a next build-up layer is provided, as shown. Note that in this implementation, most of overlying conductive layer 603 is etched away, with only the conductive contacts or vias remaining where desired, for instance, at the terminal points of the traces formed within the layer by the patterning of the trace material layer 602. Note that any of a variety of materials may be employed to form the conductive lines or traces within a tamper-respondent layer. Nickel-phosphorous (NiP) is particularly advantageous as a material since it is resistant to contact by solder, or use of a conductive adhesive to bond to it, making it harder to bridge from one circuit or trace to the next during an attempt to penetrate into the protected secure volume of the electronic circuit. Other materials which could be employed include OhmegaPly®, offered by Ohmega Technologies, Inc., of Culver City, Calif. (USA), or Ticer™, offered by Ticer Technologies of Chandler, Ariz. (USA).
The trace lines or circuits within all of the tamper-respondent layers, and in particular, the tamper-respondent circuit zones, of the embedded tamper-respondent sensor, along with the tamper-respondent sensor 421 (
Note that advantageously, different tamper-respondent circuit zones on different tamper-respondent layers may be electrically interconnected into, for instance, the same comparator circuit, Wheatstone bridge, or similar monitor circuitry. Thus, any of a large number of interconnect configurations may be possible. For instance, if each of two tamper-respondent mat layers contains 30 tamper-respondent circuit zones, and each of two tamper-respondent frames contains 4 tamper-respondent circuit zones, then, for instance, the resultant 68 tamper-respondent circuit zones may be connected in any configuration within the secure volume to create the desired arrangement of circuit networks within the secure volume being monitored for changes in resistance or tampering. Note in this regard, that the power supply or battery for the tamper-respondent sensor may be located external to the secure volume, with the sensor being configured to trip and destroy any protected or critical data if the power supply or battery is tampered with.
By way of example, an isometric view of one embodiment of a tamper-respondent assembly, or tamper-proof electronic package, is depicted in
In one or more implementations, the tamper-respondent assembly may incorporate or include an air path to adjust air pressure within the secure volume of the assembly to equalize with air pressure external to the assembly. By way of example, an air vent may be provided through electronic enclosure 700, and this air vent may be in fluid communication with a vent structure disposed between the electronic enclosure and the multilayer circuit board. For instance, the vent structure may comprise a low profile vent structure sandwiched between overlapping regions of a tamper-respondent sensor covering an inner-sidewall surface of the electronic enclosure. The vent structure includes at least one air passage coupling in fluid communication the secure volume defined by the assembly and the air vent in electronic enclosure 700. Note that in this context “in fluid communication” refers to air or gas communication being established between the secure volume provided by the tamper-respondent assembly, and the air vent through the electronic enclosure.
As illustrated, in one or more implementations, the tamper-respondent electronic circuit structure associated with electronic enclosure 700 may include an inner-sidewall tamper-respondent sensor 810 and an inner main surface tamper-respondent sensor 820, along with a security band or element 830. In the illustrated example, inner-sidewall tamper-respondent sensor 810 may be formed with an integrated flex ribbon cable or extension 811 to facilitate electrical connection of the at least one resistive network within inner-sidewall tamper-respondent sensor 810 to appropriate monitor circuitry (not shown) disposed within, for instance, the secure volume defined, at least in part, by the tamper-respondent assembly of
Note that, in the example provided in
Referring collectively to
In the depicted configuration, multiple corner tabs 1010 are provided, with at least one corner tab 1010 being provided at the at least one inner-sidewall corner. In the exemplary embodiment illustrated, two corner tabs 1010 are provided at each corner of the inner main surface tamper-respondent sensor 820. These corner tabs 1010 include circuit lines 1005 (
As noted above in connection with
In general, in one or more implementations, disclosed herein is a tamper-respondent assembly which includes an electronic enclosure to enclose, at least in part, at least one electronic component to be protected, wherein the electronic enclosure includes an inner surface. The tamper-respondent assembly also includes a tamper-respondent electronic circuit structure comprising a tamper-respondent sensor lining or covering, at least in part, the inner surface of the electronic enclosure. The tamper-respondent sensor may include a flexible layer having opposite first and second sides, and circuit lines substantially covering at least one of the first side or the second side of the flexible layer, forming at least one tamper-respondent network, such as described herein.
The tamper-respondent assembly may further include a physical security structure, such as at least one security element, that overlies and physically secures in place, at least in part, the tamper-respondent sensor covering, at least in part, the inner surface of the electronic enclosure. In the embodiment of
In the example of
In one or more enhanced embodiments, the security element(s) defining the security band, or more generally, the physical security structure, are formed (for instance, by stamping) a metal material, or metal alloy, such as copper, soft stainless steel, etc. Further, the metal security element(s) may advantageously be electrically connected to ground to further enhance detection capabilities of the tamper-respondent assembly. By forming the security element(s) of a metal that is difficult to drill through, then, if an attempt were made to drill through the security element, metal fragments would be created, which potentially could be pulled into the sensor layer(s) lining the inner surface of the electronic enclosure, which would result in a greater chance of shorting or otherwise damaging the circuit lines forming the one or more tamper-respondent networks of the sensor during the attack, and thus enhance detection capability of the tamper-respondent sensor. Further, by electrically grounding the security element(s), then a drill contacting the grounded security element(s) after drilling through one or more tamper-respondent sensors would be more likely to short one or more of the circuit lines forming the at least one tamper-detect network in the associated tamper-respondent sensor(s). By grounding the security element(s), another path for current to flow is established, which advantageously increases the likelihood of detecting an attempt to tamper with the tamper-respondent assembly. Note that grounding of the security element(s) could be by any means, such as by electrically connecting the elements to one or more ground lines on the electronic assembly being protected by the tamper-respondent assembly, or (in certain of the embodiments disclosed herein) by electrically connecting the elements to one or more ground planes within the multilayer circuit board forming, in part, the secure volume about the electronic assembly being protected. In one or more implementations, the security element(s), or more generally, the security band or physical security structure, may be pre-formed (e.g., by stamping) into the desired shape, for example, to accommodate and overlie the overlap between the inner-sidewall tamper-respondent sensor and the inner main surface tamper-respondent sensor, such as depicted in
One fabrication issue with providing a tamper-respondent assembly such as described above in connection with
Described herein below with reference with
Generally stated, therefore, in one or more aspects, an assembly apparatus is disclosed herein which includes a pressure cure fixture or element that is sized to reside within a container, such as an electronic enclosure, and facilitate applying pressure during heat curing to an adhesive disposed over an inner surface of the container. The fixture is formed of a material with a higher coefficient of thermal expansion (CTE) than the container, and is sized to correspond, at least in part, to an inner space of the container, while allowing for the adhesive and a surface-mount element, such as a tamper-respondent sensor, to be disposed between the pressure cure fixture and the inner surface of the container. By way of example, the adhesive may comprise a pressure-sensitive adhesive, such as an adhesive sheet layer with a pressure-sensitive adhesive on at least one side. Such an adhesive may be particularly advantageous when applying a surface-mount element to an inner-sidewall of the container. The pressure cure fixture, which may be sized to substantially fill the inner space of the container, is configured and the material thereof is chosen so that when heated, the fixture expands greater than the container and imparts a desired pressure to the surface-mount element and adhesive to facilitate securing the surface-mount element to the inner surface of the container. Achieving a desired pressure on the surface-mount element and adhesive may be accomplished by selecting the material of the pressure cure fixture dependent, in part, on the material of the container, as well as forming or machining the fixture to have a desired minimal spacing or gap between the fixture and the surface-mount element at room temperature. For instance, when assembled at room temperature, the gap between the pressure cure fixture and surface-mount element or inner surface of the container may be only on the order of a few millimeters or less.
In one or more implementations, the adhesive may comprise an adhesive sheet layer, with at least one side of the adhesive sheet layer comprising a pressure-sensitive adhesive. Further, the material of the pressure cure fixture may be, for instance, a rubber or silicone material, such as silicone sponge rubber, or may be teflon, and the inner surface may be an inner-sidewall surface or inner main surface of the container, where the surface-mount element mounts to the inner surface of the container via the adhesive. Alternatively, in one or more implementation, the adhesive may comprise a liquid adhesive to be pressure cured. By way of example, the adhesive may also include one or more compounds, materials or elements to enhance thermal conductivity of the adhesive once cured in place.
In one or more embodiments, the assembly apparatus further includes a base fixture, upper fixture, and clamp. The base fixture includes an opening sized to receive the container with a pressure cure fixture, surface-mount element and adhesive disposed therein, and the clamp clamps or affixes the upper fixture to the base fixture. In one or more embodiments, the upper fixture may include or be subject to spring biasing (for instance, via a spring biasing plate disposed over the upper fixture, and affixed to the base fixture) to, for instance, apply uniform pressure to the pressure cure fixture to force the fixture towards, for instance, the inner main surface of the container. The base fixture, upper fixture and clamp facilitate, in part, alignment of the surface-mount element to an edge of the container during the heating or curing of the adhesive and imparting of the pressure to the surface-mount element and adhesive.
In one or more implementations, the adhesive is a first adhesive, the pressure cure fixture is a first pressure cure fixture, the material of the first pressure cure fixture is a first material, and the surface-mount element is a first surface-mount element. Further, the assembly may include a second pressure cure fixture to facilitate adhering a second surface-mount element to the inner surface of the container after the first surface-mount element has been adhered to the inner surface of the container. The second pressure cure fixture may be formed of a second material with a higher coefficient of thermal expansion (CTE) than the container. The second pressure cure fixture may be sized to correspond, at least in part, to the inner space of the container while allowing for the first surface-mount element, the first adhesive, the second surface-mount element, and the second adhesive to be disposed between the second pressure cure fixture and the inner surface of the container. When heated, the second pressure cure fixture expands greater than the container and imparts pressure to the second surface-mount element and the second adhesive to facilitate securing the second surface-mount element to the inner surface of the container. As one example, the first surface-mount element may be an inner-sidewall tamper-respondent sensor, and the second surface-mount element may be an inner main surface tamper-respondent sensor. Further, by way of example, the first material and the second material of the first and second pressure cure fixtures may be the same or different materials, and the first and second adhesives may be different types of adhesives. For instance, at least one of the different types of adhesives may include a pressure-sensitive adhesive. Further, the materials of the first and second pressure cure fixtures may include at least one of silicone or teflon. Still further, in one or more implementations, the container may be an electronic enclosure formed of a metal, such as aluminum or copper, or a metal alloy.
Note generally, the assembly apparatuses and processes disclosed herein utilize a specially configured high CTE material placed within a container or enclosure along with a surface-mount element, such as a tamper-respondent sensor, at room temperature prior to curing. The adhesive employed may include, for instance, a pressure-sensitive adhesive. Once assembled, the assembly is placed within an oven for curing of the adhesive, and as temperature rises, the high CTE material expands at a rate much higher than the container, and thereby exerts the desired pressure outwards towards the inner wall of the container, and thereby facilitates void-free bonding of the surface-mount element to the container. As the temperature cools after curing, the high CTE material shrinks back to its original size, and is readily removed from the container. The high CTE material(s) of the pressure cure fixture may be chosen, in part, so that the material does not adhere itself to the adhesive in the event that any adhesive contacts the fixture. Advantageously, the assembly apparatus disclosed herein is inexpensive, with the high CTE pressure cure fixture being reusable, and with the process employing, for instance, a standard batch oven.
The electronic enclosure 700 depicted is presented as one example of a container having an inner surface to which one or more surface-mount elements, such as inner-sidewall tamper-respondent sensor 810 are to be affixed. As noted above, the tamper-respondent assembly includes a tamper-respondent electronic circuit structure which includes, in one or more embodiments, at least one tamper-respondent sensor 810 mounted to and covering, at least in part, the inner surface(s) of electronic enclosure 700. The tamper-respondent sensor(s) is configured (for example, is flexible) so as to facilitate good contact, and good adhesion of the sensor to the inner surface of the enclosure.
By way of example,
Referring collectively to
As depicted, pressure cure fixture 1210 is sized to correspond, at least in part, to the inner space of electronic enclosure 700, while still allowing for adhesive 1201 and inner-sidewall tamper-respondent sensor 810 to be disposed between pressure cure fixture 1210 and electronic enclosure 700. By way of example, pressure cure fixture 1210 could be configured to substantially fill the inner space of electronic enclosure 700 with adhesive 1201 and inner-sidewall tamper-respondent sensor 810 disposed therein. For instance, pressure cure fixture 1210 may be configured, designed and sized so that at room temperature, the fixture readily slides into the inner space of electronic enclosure 700. Any spacing or gap between pressure cure fixture 1210 and, for instance, inner-sidewall tamper-respondent sensor 810 may be dependent, for instance, on the particular material of the pressure cure fixture selected as the high coefficient of thermal expansion (CTE) material, relative to the coefficient of thermal expansion of the electronic enclosure 700. As one example only, the material of pressure cure fixture 1210 could be a silicone sponge rubber material, such as the sponge rubber materials offered by Diversified Silicone Products, Inc. of Santa Fe Springs, Calif., USA, and electronic enclosure 700 may be formed of a metal, such as aluminum. The density of the silicone sponge rubber may be selected to achieve a desired force exerted on the adhesive for a given set of cure conditions. For instance, an applied force in the range of 5-20 pounds may be achieved.
In the embodiment depicted, assembly apparatus 1200 may further include a base fixture 1220, upper fixture 1230 and clamp 1240 with bolts 1241 to secure the assembly together in fixed relation, for instance, for placement within a curing oven. In one or more embodiments, upper fixture 1230 may be configured to accommodate the integrated flex ribbon cable or extension 811 of inner-sidewall tamper-respondent sensor 810. For instance, upper fixture 1230 and/or pressure cure fixture 1210 could be provided with one or more recesses or cutouts to accommodate the extension when assembled as depicted in
As noted,
Pressure cure fixture or element 1310 is configured, designed and sized to reside within electronic enclosure 700, with inner-sidewall tamper-respondent sensor 810 positioned as depicted in
By way of example, adhesive 1301 may be a liquid adhesive with enhanced thermal conduction properties compared with, for example, adhesive 1201 (
As one example, adhesive 1301 may comprise a Master Bond Supreme 10AOHTXT black adhesive with, for instance, aluminum oxide as a filler to provide the adhesive with enhanced thermal conductivity properties. This adhesive is available from Master Bond, Inc. of Hackensack, N.J., USA. The material has good bond strength and a relatively short cure time, for instance, 125° C. for 90 minutes. As with the above-described material, adhesive 1301 is capable of relatively low pressure bonding (for instance, in the range of 5-20 pounds). Note, however, that this adhesive 1301 example is one example only of an adhesive which could be employed in the assembly apparatuses and processes disclosed herein. Further, note that in one or more implementations, the pattern of adhesive 1301 applied to the inner surface of electronic enclosure 700 may be configured or designed based upon placement of heat generating components within the secure volume. For instance, in the design depicted in
In operation, electronic enclosure 700 with inner-sidewall tamper-respondent sensor 810 affixed thereto may be prepared with adhesive 1301 and placed into base fixture 1320, that is, into an opening configured and sized to receive electronic enclosure 700. Inner main surface tamper-respondent sensor 820 may then be placed into electronic enclosure 700 over adhesive 1301. Upper fixture 1330 with pressure cure fixture 1310 mounted thereto may then be placed in position over the subassembly using alignment pins 1321 projecting from base fixture 1320 and alignment openings 1331 in upper fixture 1330. In this configuration, pressure cure fixture 1310 projects downward and substantially fills the inner space of electronic enclosure 700, with inner main surface tamper-respondent sensor 1820 and inner-sidewall tamper-respondent sensor 1810 disposed between the fixture and the inner surface of electronic enclosure 700. One or more bolts 1332 may be employed to clamp or affix the upper and lower fixtures together for placement of the assembly into a curing oven.
In one or more implementations, pressure cure fixture 1310 may be formed of teflon so that should any liquid adhesive 1301 contact the pressure cure fixture, it would not adhere to the fixture and prevent or inhibit disassembly of the assembly apparatus after curing of the adhesive. Note also, in one or more implementations, the upper fixture may include or be subject to spring biasing. For instance, a spring biasing plate (not shown) could be disposed over the upper fixture and be affixed to the base fixture, to facilitate spring biasing of the upper fixture towards the base fixture to, for instance, apply uniform pressure to the pressure cure fixture to force the fixture towards, for instance, the inner main surface of the container.
By way of further example,
Referring collectively to
As with the examples above, pressure cure fixture 1410 is sized to correspond, at least in part, to the inner space of electronic enclosure 700, while still allowing for the inner-sidewall tamper-respondent sensor 810, inner main surface tamper-respondent sensor 820, adhesive 1401 and security element(s) 831 to be disposed between the pressure cure fixture and the inner surface of the electronic enclosure, as illustrated. By way of example only, the material of pressure cure fixture 1410 could again be a silicone sponge rubber material, such as the above-discussed sponge rubber materials offered by Diversified Silicone Products, Inc. Alternatively, the material of pressure cure fixture 1410 could be formed of teflon, or any other available material with a higher CTE than that of the electronic enclosure 700 so that when placed within the cure oven, a desired pressure is generated from within the electronic enclosure outwards towards the surface-mount element to be adhered within the electronic enclosure 700. As with the assembly apparatuses described above, once assembled together as depicted in
The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the singular forms “a”, “an” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms “comprise” (and any form of comprise, such as “comprises” and “comprising”), “have” (and any form of have, such as “has” and “having”), “include” (and any form of include, such as “includes” and “including”), and “contain” (and any form contain, such as “contains” and “containing”) are open-ended linking verbs. As a result, a method or device that “comprises”, “has”, “includes” or “contains” one or more steps or elements possesses those one or more steps or elements, but is not limited to possessing only those one or more steps or elements. Likewise, a step of a method or an element of a device that “comprises”, “has”, “includes” or “contains” one or more features possesses those one or more features, but is not limited to possessing only those one or more features. Furthermore, a device or structure that is configured in a certain way is configured in at least that way, but may also be configured in ways that are not listed.
The corresponding structures, materials, acts, and equivalents of all means or step plus function elements in the claims below, if any, are intended to include any structure, material, or act for performing the function in combination with other claimed elements as specifically claimed. The description of the present invention has been presented for purposes of illustration and description, but is not intended to be exhaustive or limited to the invention in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art without departing from the scope and spirit of the invention. The embodiment was chosen and described in order to best explain the principles of one or more aspects of the invention and the practical application, and to enable others of ordinary skill in the art to understand one or more aspects of the invention for various embodiments with various modifications as are suited to the particular use contemplated.
| Number | Name | Date | Kind |
|---|---|---|---|
| 3165569 | Bright et al. | Jan 1965 | A |
| 4160503 | Ohlbach | Jul 1979 | A |
| 4211324 | Ohlbach | Jul 1980 | A |
| 4324823 | Ray, III | Apr 1982 | A |
| 4496900 | Di Stefano et al. | Jan 1985 | A |
| 4516679 | Simpson et al. | May 1985 | A |
| 4593384 | Kleinjne | Jun 1986 | A |
| 4609104 | Kasper et al. | Sep 1986 | A |
| 4653252 | Van de Haar et al. | Mar 1987 | A |
| 4677809 | Long et al. | Jul 1987 | A |
| 4691350 | Kleijne et al. | Sep 1987 | A |
| 4807284 | Kleijne | Feb 1989 | A |
| 4811288 | Kleijne et al. | Mar 1989 | A |
| 4860351 | Weingart | Aug 1989 | A |
| 4865197 | Craig | Sep 1989 | A |
| 5009311 | Schenk | Apr 1991 | A |
| 5027397 | Double et al. | Jun 1991 | A |
| 5060114 | Feinberg et al. | Oct 1991 | A |
| 5075822 | Baumler et al. | Dec 1991 | A |
| 5117457 | Comerford et al. | May 1992 | A |
| 5159629 | Double et al. | Oct 1992 | A |
| 5185717 | Mori | Feb 1993 | A |
| 5201868 | Johnson | Apr 1993 | A |
| 5201879 | Steele et al. | Apr 1993 | A |
| 5211618 | Stoltz | May 1993 | A |
| 5239664 | Verrier et al. | Aug 1993 | A |
| 5389738 | Piosenka et al. | Feb 1995 | A |
| 5406630 | Piosenka et al. | Apr 1995 | A |
| 5506566 | Oldfield et al. | Apr 1996 | A |
| 5568124 | Joyce et al. | Oct 1996 | A |
| 5594439 | Swanson | Jan 1997 | A |
| 5675319 | Rivenberg et al. | Oct 1997 | A |
| 5715652 | Stahlecker | Feb 1998 | A |
| 5761054 | Kuhn | Jun 1998 | A |
| 5813113 | Stewart et al. | Sep 1998 | A |
| 5858500 | MacPherson | Jan 1999 | A |
| 5880523 | Candelore | Mar 1999 | A |
| 5988510 | Tuttle et al. | Nov 1999 | A |
| 6121544 | Petsinger | Sep 2000 | A |
| 6195267 | MacDonald, Jr. et al. | Feb 2001 | B1 |
| 6201296 | Fries et al. | Mar 2001 | B1 |
| 6261215 | Imer | Jul 2001 | B1 |
| 6301096 | Wozniczka | Oct 2001 | B1 |
| 6384397 | Takiar et al. | May 2002 | B1 |
| 6424954 | Leon | Jul 2002 | B1 |
| 6438825 | Kuhm | Aug 2002 | B1 |
| 6469625 | Tomooka | Oct 2002 | B1 |
| 6512454 | Miglioli et al. | Jan 2003 | B2 |
| 6473995 | Kayama | Nov 2003 | B2 |
| 6686539 | Farquhar et al. | Feb 2004 | B2 |
| 6746960 | Goodman et al. | Jun 2004 | B2 |
| 6798660 | Moss et al. | Sep 2004 | B2 |
| 6853093 | Cohen et al. | Feb 2005 | B2 |
| 6879032 | Rosenau et al. | Apr 2005 | B2 |
| 6929900 | Farquhar et al. | Aug 2005 | B2 |
| 6946960 | Sisson et al. | Sep 2005 | B2 |
| 6957345 | Cesana et al. | Oct 2005 | B2 |
| 6970360 | Sinha | Nov 2005 | B2 |
| 6985362 | Mori et al. | Jan 2006 | B2 |
| 6991961 | Hubbard et al. | Jan 2006 | B2 |
| 6996953 | Perreault et al. | Feb 2006 | B2 |
| 7005733 | Kommerling et al. | Feb 2006 | B2 |
| 7015823 | Gillen et al. | Mar 2006 | B1 |
| 7054162 | Benson et al. | May 2006 | B2 |
| 7057896 | Matsuo et al. | Jun 2006 | B2 |
| 7094143 | Wolm et al. | Aug 2006 | B2 |
| 7094459 | Takahashi | Aug 2006 | B2 |
| 7095615 | Nichols | Aug 2006 | B2 |
| 7156233 | Clark et al. | Jan 2007 | B2 |
| 7180008 | Heitmann et al. | Feb 2007 | B2 |
| 7189360 | Ho et al. | Mar 2007 | B1 |
| 7214874 | Dangler et al. | May 2007 | B2 |
| 7247791 | Kulpa | Jul 2007 | B2 |
| 7304373 | Taggart et al. | Dec 2007 | B2 |
| 7310737 | Patel et al. | Dec 2007 | B2 |
| 7465887 | Suzuki et al. | Dec 2008 | B2 |
| 7475474 | Heitmann et al. | Jan 2009 | B2 |
| 7515418 | Straznicky et al. | Apr 2009 | B2 |
| 7549064 | Elbert et al. | Jun 2009 | B2 |
| 7640658 | Pham et al. | Jan 2010 | B1 |
| 7643290 | Narasimhan et al. | Jan 2010 | B1 |
| 7663883 | Shirakami et al. | Feb 2010 | B2 |
| 7672129 | Ouyang et al. | Mar 2010 | B1 |
| 7731517 | Lee et al. | Jun 2010 | B2 |
| 7746657 | Oprea et al. | Jun 2010 | B2 |
| 7760086 | Hunter et al. | Jul 2010 | B2 |
| 7768005 | Condorelli et al. | Aug 2010 | B2 |
| 7783994 | Ball et al. | Aug 2010 | B2 |
| 7787256 | Chan et al. | Aug 2010 | B2 |
| 7868411 | Eaton et al. | Jan 2011 | B2 |
| 7898413 | Hsu et al. | Mar 2011 | B2 |
| 7901977 | Angelopoulos et al. | Mar 2011 | B1 |
| 7947911 | Pham et al. | May 2011 | B1 |
| 7978070 | Hunter | Jul 2011 | B2 |
| 8006101 | Crawford | Aug 2011 | B2 |
| 8084855 | Lower et al. | Dec 2011 | B2 |
| 8094450 | Cole et al. | Jan 2012 | B2 |
| 8133621 | Wormald et al. | Mar 2012 | B2 |
| 8101267 | Moh et al. | Jun 2012 | B2 |
| 8199506 | Janik et al. | Jun 2012 | B2 |
| 8287336 | Dangler et al. | Oct 2012 | B2 |
| 8325486 | Arshad et al. | Dec 2012 | B2 |
| 8516269 | Hamlet et al. | Aug 2013 | B1 |
| 8589703 | Lee | Nov 2013 | B2 |
| 8646108 | Shiakallis et al. | Feb 2014 | B2 |
| 8659506 | Nomizo | Feb 2014 | B2 |
| 8659908 | Adams et al. | Feb 2014 | B2 |
| 8664047 | Lower et al. | Mar 2014 | B2 |
| 8716606 | Kelley et al. | May 2014 | B2 |
| 8797059 | Boday et al. | Aug 2014 | B2 |
| 8836509 | Lowy | Sep 2014 | B2 |
| 8853839 | Gao et al. | Oct 2014 | B2 |
| 8879266 | Jarvis et al. | Nov 2014 | B2 |
| 8890298 | Buer et al. | Nov 2014 | B2 |
| 8947889 | Kelley et al. | Feb 2015 | B2 |
| 8961280 | Dangler et al. | Feb 2015 | B2 |
| 9003199 | Dellmo et al. | Apr 2015 | B2 |
| 9011762 | Seppa et al. | Apr 2015 | B2 |
| 9052070 | Davis et al. | Jun 2015 | B2 |
| 9166586 | Carapelli et al. | Oct 2015 | B2 |
| 9298956 | Wade et al. | Mar 2016 | B2 |
| 9555606 | Fisher | Jan 2017 | B1 |
| 20010050425 | Beroz et al. | Dec 2001 | A1 |
| 20010056542 | Cesana et al. | Dec 2001 | A1 |
| 20020002683 | Benson | Jan 2002 | A1 |
| 20020068384 | Beroz et al. | Jun 2002 | A1 |
| 20020084090 | Farquhar | Jul 2002 | A1 |
| 20030009684 | Schwenck et al. | Jan 2003 | A1 |
| 20050068735 | Fissore et al. | Mar 2005 | A1 |
| 20050111194 | Sohn et al. | May 2005 | A1 |
| 20050180104 | Olesen et al. | Aug 2005 | A1 |
| 20060034731 | Lewis et al. | Feb 2006 | A1 |
| 20060049941 | Hunter et al. | Mar 2006 | A1 |
| 20060072288 | Stewart et al. | Apr 2006 | A1 |
| 20060196945 | Mendels | Sep 2006 | A1 |
| 20060218779 | Ooba et al. | Oct 2006 | A1 |
| 20070064396 | Oman et al. | Mar 2007 | A1 |
| 20070064399 | Mandel et al. | Mar 2007 | A1 |
| 20070108619 | Hsu | May 2007 | A1 |
| 20070211436 | Robinson et al. | Sep 2007 | A1 |
| 20070230127 | Peugh et al. | Oct 2007 | A1 |
| 20070268671 | Brandenburg et al. | Nov 2007 | A1 |
| 20080050512 | Lower et al. | Feb 2008 | A1 |
| 20080144290 | Brandt et al. | Jun 2008 | A1 |
| 20080159539 | Huang et al. | Jul 2008 | A1 |
| 20080160274 | Dang et al. | Jul 2008 | A1 |
| 20080191174 | Ehrensvard et al. | Aug 2008 | A1 |
| 20080251906 | Eaton et al. | Oct 2008 | A1 |
| 20090073659 | Peng et al. | Mar 2009 | A1 |
| 20090166065 | Clayton et al. | Jul 2009 | A1 |
| 20100088528 | Sion | Apr 2010 | A1 |
| 20100110647 | Hiew et al. | May 2010 | A1 |
| 20100177487 | Arshad et al. | Jul 2010 | A1 |
| 20100319986 | Bleau et al. | Dec 2010 | A1 |
| 20110001237 | Brun et al. | Jan 2011 | A1 |
| 20110038123 | Janik et al. | Feb 2011 | A1 |
| 20110103027 | Aoki et al. | May 2011 | A1 |
| 20110241446 | Tucholski | Oct 2011 | A1 |
| 20110299244 | Dede et al. | Dec 2011 | A1 |
| 20120050998 | Klum et al. | Mar 2012 | A1 |
| 20120117666 | Oggioni et al. | May 2012 | A1 |
| 20120140421 | Kirstine et al. | Jun 2012 | A1 |
| 20120319986 | Toh et al. | Jun 2012 | A1 |
| 20120170217 | Nishikimi et al. | Jul 2012 | A1 |
| 20120185636 | Leon et al. | Jul 2012 | A1 |
| 20130170217 | Nishikimi et al. | Jul 2012 | A1 |
| 20120244742 | Wertz et al. | Sep 2012 | A1 |
| 20120256305 | Kaufmann et al. | Oct 2012 | A1 |
| 20120320529 | Loong et al. | Dec 2012 | A1 |
| 20130033818 | Hosoda et al. | Feb 2013 | A1 |
| 20130058052 | Arshad et al. | Mar 2013 | A1 |
| 20130104252 | Yanamadala et al. | Apr 2013 | A1 |
| 20130141137 | Krutzik et al. | Jun 2013 | A1 |
| 20130158936 | Rich et al. | Jun 2013 | A1 |
| 20130208422 | Hughes et al. | Aug 2013 | A1 |
| 20130235527 | Wagner et al. | Sep 2013 | A1 |
| 20130283386 | Lee | Oct 2013 | A1 |
| 20140022733 | Lim et al. | Jan 2014 | A1 |
| 20140160679 | Kelty et al. | Jun 2014 | A1 |
| 20140184263 | Ehrenpfordt et al. | Jul 2014 | A1 |
| 20140204533 | Abeyasekera et al. | Jul 2014 | A1 |
| 20140321064 | Bose et al. | Oct 2014 | A1 |
| 20140325688 | Cashin et al. | Oct 2014 | A1 |
| 20150007427 | Dangler et al. | Jan 2015 | A1 |
| 20150163933 | Steiner | Jun 2015 | A1 |
| 20150235053 | Lee et al. | Aug 2015 | A1 |
| 20160005262 | Hirato et al. | Jan 2016 | A1 |
| 20160137548 | Cabral, Jr. et al. | May 2016 | A1 |
| 20160262253 | Isaacs et al. | Sep 2016 | A1 |
| 20160262270 | Isaacs et al. | Sep 2016 | A1 |
| 20170019987 | Dragone et al. | Jan 2017 | A1 |
| Number | Date | Country |
|---|---|---|
| 2014-30639 | Mar 2010 | CN |
| 10-4346587 | Feb 2015 | CN |
| 19816571 | Oct 1999 | DE |
| 19816572 | Oct 1999 | DE |
| 10-2012-203955 | Sep 2013 | DE |
| 0 056 360 | Oct 1993 | EP |
| 0 629 497 | Dec 1994 | EP |
| 1 184 773 | Mar 2002 | EP |
| 1 207 444 | May 2002 | EP |
| 1484163 | Jul 2002 | EP |
| 1 734 578 | Dec 2006 | EP |
| 1 968 362 | Sep 2008 | EP |
| 2 104 407 | Sep 2009 | EP |
| 1 672 464 | Apr 2012 | EP |
| 2 560 467 | Feb 2013 | EP |
| S5554649 | Apr 1980 | JP |
| 61-297035 | Dec 1986 | JP |
| S61297035 | Dec 1986 | JP |
| 2000-238141 | Sep 2000 | JP |
| 2013-125807 | Jun 2013 | JP |
| 2013-140112 | Jul 2013 | JP |
| WO 1999003675 | Jan 1999 | WO |
| WO 1999021142 | Apr 1999 | WO |
| WO 2001063994 | Aug 2001 | WO |
| 2003012606 | Feb 2003 | WO |
| WO 2003025080 | Mar 2003 | WO |
| WO 2004040505 | May 2004 | WO |
| WO 2009042335 | Apr 2009 | WO |
| WO 2009092472 | Jul 2009 | WO |
| WO 2010128939 | Nov 2010 | WO |
| WO 2013004292 | Jan 2013 | WO |
| WO 20130189483 | Dec 2013 | WO |
| WO 2014086987 | Jun 2014 | WO |
| WO 2014158159 | Oct 2014 | WO |
| Entry |
|---|
| Holm, Ragnar, “Electric Contacts: Theory and Application”, Spinger-Verlag, New York, 4th Edition, 1981 (pp. 10-19). |
| Clark, Andrew J., “Physical Protection of Cryptographic Devices”, Advanced in Cyprtology, Eurocrypt '87, Springer, Berlin Heidelberg (1987) (11 pages). |
| Halperin et al., “Latent Open Testing of Electronic Packaging”, MCMC-194, IEEE (1994) (pp. 83-33). |
| Simek, Bob, “Tamper Restrictive Thermal Ventilation System for Enclosures Requiring Ventilation and Physical Security”, IBM Publication No. IPCOM000008607D, Mar. 1, 1998 (2 pages). |
| Pamula et al., “Cooling of Integrated Circuits Using Droplet-Based Microfluidics”, Association for Computing Machinery (ACM), GLSVLSI'03, Apr. 28-29, 2003 (pp. 84-87). |
| Saran et al., “Fabrication and Characterization of Thin Films of Single-Walled Carbon Nanotube Bundles on Flexible Plastic Substrates”, Journal of the American Chemical Society, vol. 126, No. 14 (Mar. 23, 2004) (pp. 4462-4463). |
| Khanna P.K. et al., “Studies on Three-Dimensional Moulding, Bonding and Assembling of Low-Temperature-Cofired Ceramics MEMS and MST Applications.” Materials Chemistry and Physics, vol. 89, No. 1 (2005) (pp. 72-79). |
| Drimer et al., “Thinking Inside the Box: System-Level Failures of Tamper Proofing”, 2008 IEEE Symposium on Security and Privacy, (Feb. 2008) (pp. 281-295). |
| Loher et al., “Highly Integrated Flexible Electronic Circuits and Modules”, 3rd International IEEE on Microsystems, Packaging, Assembly & Circuits Technology Conference (Oct. 22-24, 2008) (Abstract Only) (1 page). |
| Sample et al., “Design of an RFID-Based Battery-Free Programmable Sensing Platform”, IEEE Transactions on Instrumentation and Measurement, vol. 57, No. 11, Nov. 2008 (pp. 2608-2615). |
| Jhang et al., “Nonlinear Ultrasonic Techniques for Non-Destructive Assessment of Micro Damage in Material: A Review”, International Journal of Prec. Eng. & Manuf., vol. 10, No. 1, Jan. 2009 (pp. 123-135). |
| Anonymous, “Consolidated Non-Volatile Memory in a Chip Stack”, IBM Technical Disclosure: IP.com No. IPCOM000185250, Jul. 16, 2009 (6 pages). |
| Isaacs et al., “Tamper Proof, Tamper Evident Encryption Technology”, Pan Pacific Symposium SMTA Proceedings (2013) (9 pages). |
| Anonymous, “Selective Memory Encryption”, IBM Technical Disclosure: IP.com IPCOM000244183, Nov. 20, 2015 (6 pages). |
| Zhou et al., “Nonlinear Analysis for Hardware Trojan Detection”, ICSPCC2015, IEEE (2015) (4 pages). |
| Harting Mitronics, “Saftey Caps for Payment Terminals, http://harting-mitronics.ch/fileadmin/hartingmitronics/case_studies/Saftey_caps_for_payment_terminals.pdf”, downloaded Aug. 2016 (2 pages). |
| Dangler et al., “Tamper-Respondent Sensors with Formed Flexible Layer(s)”, U.S. Appl. No. 14/865,551, filed Sep. 25, 2015 (113 pages). |
| Brodsky et al., “Overlapping, Discrete Tamper-Respondent Sensors”, U.S. Appl. No. 14/865,572, filed Sep. 25, 2015 (114 pages). |
| Dangler et al., “Tamper-Respondent Assemblies with Region(s) of Increased Susceptibility to Damage”, U.S. Appl. No. 14/865,591, filed Sep. 25, 2015 (114 pages). |
| Brodsky et al., “Circuit Boards and Electronic Packages with Embedded Tamper-Respondent Sensor”, U.S. Appl. No. 14/865,610, filed Sep. 25, 2015 (43 pages). |
| Brodsky et al, “Tamper-Respondent Assemblies”, U.S. Appl. No. 14/865,632, filed Sep. 25, 2015 (115 pages). |
| Brodksky et al., “Enclosure with Inner Tamper-Respondent Sensor(s)”, U.S. Appl. No. 14/865,651, filed Sep. 25, 2015 (115 pages). |
| Fisher et al., “Enclosure with Inner Tamper-Respondent Sensor(s) and Physical Security Element(s)”, U.S. Appl. No. 14/865,686, filed Sep. 25, 2015 (114 pages). |
| Brodsky et al., “Tamper-Respondent Assemblies with Bond Protection”, U.S. Appl. No. 14/865,708, filed Sep. 25, 2015 (113 pages). |
| Brodsky et al., “Circuit Layouts of Tamper-Respondent Sensors”, U.S. Appl. No. 14/886,179, filed Oct. 19, 2015 (113 pages). |
| Isaacs, Phillip Duane, “Tamper-Respondent Assembly with Protective Wrap(s) Over Tamper-Respondent Sensor(s)”, U.S. Appl. No. 14/918,691, filed Oct. 21, 2015 (40 pages). |
| Brodsky et al., “Tamper-Respondent Assemblies with Bond Protection”, U.S. Appl. No. 14/941,860, filed Nov. 16, 2015 (108 pages). |
| Fisher et al., “Enclosure with Inner Tamper-Respondent Sensor(s) and Physical Security Element(s)”, U.S. Appl. No. 14/941,872, filed Nov. 16, 2015 (109 pages). |
| Brodsky et al, “Tamper-Respondent Assemblies”, U.S. Appl. No. 14/941,887, filed Nov. 16, 2015 (109 pages). |
| Brodsky et al., “Circuit Boards and Electronic Packages with Embedded Tamper-Respondent Sensors”, U.S. Appl. No. 14/941,908, filed Nov. 16, 2015 (41 pages). |
| Fisher et al., “Tamper-Respondent Assembly with Vent Structure”, U.S. Appl. No. 14/955,283, filed Dec. 1, 2015 (61 pages). |
| Fisher et al., “Applying Pressure to Adhesive Using CTE Mismatch Between Components”, U.S. Appl. No. 14/963,681, filed Dec. 9, 2015 (68 pages). |
| Brodsky et al., “Tamper-Respondent Assemblies with Enclosure-to-Board Protection”, U.S. Appl. No. 14/974,036, filed Dec. 18, 2015 (55 pages). |
| Busby et al., “Multi-Layer Stack with Embedded Tamper-Detect Protection”, U.S. Appl. No. 15/053,336, filed Feb. 25, 2016 (68 pages). |
| Campbell et al., “Tamper-Proof Electronic Packages With Two-Phase Dielectric Fluid”, U.S. Appl. No. 15/139,503, filed Apr. 27, 2016 (60 pages). |
| Busby et al., “Tamper-Proof Electronic Packages Formed With Stressed Glass”, U.S. Appl. No. 15/154,077, filed May 13, 2016 (45 pages). |
| Busby et al., “Tamper-Proof Electronic Packages With Stressed Glass Component Substrate(s)”, U.S. Appl. No. 15/154,088, filed May 13, 2016 (56 pages). |
| Brodsky et al., “Circuit Layouts of Tamper-Respondent Sensors”, U.S. Appl. No. 15/187,002, filed Jun. 20, 2016 (110 pages). |
| Brodsky et al., “Tamper-Respondent Assemblies with Enclosure-to-Board Protection”, U.S. Appl. No. 15/193,525, filed Jun. 27, 2016 (54 pages). |
| Busby et al., “Tamper-Respondent Assembly with Nonlinearity Monitoring”, U.S. Appl. No. 15/194,738, filed Jun. 28, 2016 (48 pages). |
| Dangler et al., “Tamper-Respondent Sensors with Formed Flexible Layer(s)”, U.S. Appl. No. 15/249,663, filed Aug. 29, 2016 (109 pages). |
| Brodsky et al., “Overlapping, Discrete Tamper-Respondent Sensors”, U.S. Appl. No. 15/249,671, filed Aug. 29, 2016 (109 pages). |
| Dangler et al., “Tamper-Respondent Assemblies with Region(s) of Increased Susceptibility to Damage”, U.S. Appl. No. 15/249,676, filed Aug. 29, 2016 (110 pages). |
| Dragone et al., “Tamper-Respondent Assembly with Sensor Connection Adapter”, U.S. Appl. No. 15/268,959, filed Sep. 19, 2016 (45 pages). |
| Fisher et al., Office Action for U.S. Appl. No. 14/963,681, filed Dec. 9, 2015, dated May 6, 2016 (10 pages). |
| Fisher et al., Notice of Allowance for U.S. Appl. No. 14/963,681, filed Dec. 9, 2015, dated Jul. 5, 2016 (7 pages). |
| Fisher et al., Notice of Allowance for U.S. Appl. No. 14/963,681, filed Dec. 9, 2015, dated Sep. 20, 2016 (7 pages). |
| Fisher et al., “List of IBM Patents and/or Patent Applications Treated as Related”, U.S. Appl. No. 15/193,556, filed Jun. 27, 2016, dated Sep. 26, 2016 (2 pages). |
| Fisher et al., GB Examination Report for Application No. GB1619363.3, dated Mar. 21, 2017 (5 pages). |
| Dragone et al., “Vented Tamper-Respondent Assemblies”, U.S. Appl. No. 15/275,748, filed Sep. 26, 2016 (53 pages). |
| Dragone et al., “Tamper-Respondent Assemblies with In Situ Vent Structure(s)”, U.S. Appl. No. 15/275,762, filed Sep. 26, 2016 (72 pages). |
| Busby et al., “Tamper-Respondent Assemblies with Trace Regions of Increased Susceptibility to Breaking”, U.S. Appl. No. 15/341,108, filed Nov. 2, 2016 (56 pages). |
| Brodsky et al., “Enclosure with Inner Tamper-Respondent Sensor(s)”, U.S. Appl. No. 15/409,851, filed Jan. 19, 2017 (115 pages). |
| Brodsky et al., “Tamper-Respondent Assemblies with Enclosure-to-Board Protection”, U.S. Appl. No. 15/423,833, filed Feb. 3, 2017 (54 pages). |
| Number | Date | Country | |
|---|---|---|---|
| 20170171999 A1 | Jun 2017 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 14963681 | Dec 2015 | US |
| Child | 15193556 | US |
