Claims
- 1. A composition for treating a hard surface comprising:at least one of the following: a low residue surfactant wherein said low-residue surfactant is selected from the group consisting of sulfobetaines, ampho glycinates, ampho propionates, betaines, poly alkyl glycosides, sucrose esters and mixtures thereof and an aliphatic alkyl ethoxylate surfactant; and a polymeric biguanide wherein said composition has a pH of 7 or less.
- 2. The composition of claim 1 wherein the pH of said composition is from about 5 to 7, and said low residue surfactant is a C8-C16 alkyl poly glycoside.
- 3. The composition of claim 1 wherein said composition further comprises an organic acidifying agent.
- 4. The composition of claim 3 wherein said organic acidifying agent is selected from the group consisting of tartaric acid, lactic acid, citric acid and mixtures thereof.
- 5. The composition of claim 4 wherein said organic acidifying agent is citric acid.
- 6. The composition of claim 1 wherein said low-residue surfactant is selected from the group consisting of sulfobetaines, poly alkyl glycosides and mixtures thereof.
- 7. The composition of claim 1 wherein said aliphatic alkyl ethoxylate surfactant comprises from about 8 to about 18 carbon atoms in the hydrophobic chain length, and an average of about 1 to about 15 ethylene oxide moieties per surfactant molecule.
- 8. The composition of claim 1 wherein said polymeric biguanide is selected from the group consisting of oligo-hexamethylene biguanide, poly-hexamethylene biguanide, salt thereof and a mixture thereof.
- 9. The composition of claim 1, wherein said polymeric biguanide is poly (hexamethylene biguanide) hydrochloride.
- 10. The composition of claim 3 wherein said composition comprises from about 0.01% to about 0% by weight of said acidifying agent; and wherein the level of said low-residue surfactant and/or said aliphatic alkyl ethoxylate surfactant is from about 0.01% to about 15% by weight; the level of biguanide is from about 0.01% to about 20% by weight; and the pH of the aqueous composition is from about 0.5 to 7.
- 11. The composition of claim 10 wherein the level of said organic acidifying agent is from about 0.01% to about 3.0% by weight; the level of said low-residue surfactant and/or said aliphatic alkyl ethoxylate surfactant is from about 0.01% to about 1.5% by weight; the level of said polymeric biguanide is from about 0.01% to about 2.0% by weight; and the pH of the aqueous composition is from about 0.5 to 7.
- 12. The composition of claim 11, wherein the level of said organic acidifying agent is from about 0.05% to about 2.0% by weight; the level of said low-residue surfactant and/or said aliphatic alkyl ethoxylate surfactant is from about 0.01% to about 1.0% by weight; the level of said polymeric biguanide is from about 0.01% to about 1.0% by weight; and the pH of the aqueous composition is from about 1.0 to about 6.0.
- 13. The composition of claim 12 wherein the level of said organic acidifying agent is from about 0.1% to about 1.0% by weight; the level of said low-residue surfactant and/or said aliphatic alkyl ethoxylate surfactant is from about 0.03% to about 0.75% by weight; the level of said polymeric biguanide is from about 0.02% to about 0.75% by weight; and the pH of the aqueous composition is from about 2.0 to about 5.5.
- 14. The composition of claim 13 wherein the total level of solids is 3% or less by weight of the aqueous composition.
- 15. The composition of claim 1 further comprising from about 0.5% to about 25% by weight of a solvent.
- 16. The composition of claim 15 wherein said solvent has a vapour pressure of about 6.66 Pa (about 0.05mm Hg at 25° C. and atmospheric pressure).
- 17. The composition of claim 1 further comprising a hydrotrope.
- 18. The composition of claim 17 wherein said hydrotrope is an alkyl ethoxylate comprising from about 8 to about 18 carbon atoms in the hydrophobic group and at least an average of about 15 ethoxylate groups per hydrophobic group.
- 19. A method of cleaning hard surfaces comprising the step of contacting said surface with an aqueous composition according to claim 1.
- 20. The method of cleaning hard surfaces according to claim 19 wherein said method additionally comprises the step of wiping said surface during and/or after the step of contacting said surface with said aqueous composition.
- 21. The method of cleaning bard surfaces according to claim 20 wherein said step of wiping said surface is performed by contacting said surface with a cleaning tool selected from the group consisting of sponges, cloths, cellulose strings, cellulose strips, paper, paper towels, pre-moistened wipe laminates and absorbent disposable cleaning pads.
- 22. The method of cleaning according to claim 21 wherein said aqueous composition is applied onto said cleaning tool prior to and/or during the wiping of said surface.
- 23. The method of cleaning according to claim 21 wherein said aqueous composition is delivered on said surface prior to and/or during the wiping of said surface.
- 24. A composition for treating a hard surface comprising:at least one of the following: a low residue surfactant and an aliphatic alkyl ethoxylate surfactant; an organic acidifying agent; and a polymeric biguanide wherein said composition has a pH of 7 or less.
- 25. The composition of claim 24 wherein the pH of said composition is from about 5 to 7, and said low residue surfactant is a C8-C16 alkyl poly glycoside.
- 26. The composition of claim 24 wherein said organic acidifying agent is selected from the group consisting of tartaric acid, lactic acid, citric acid and mixtures thereof.
- 27. The composition of claim 24 wherein said low-residue surfactant is selected from the group consisting of zwitterionic surfactants, amphoteric surfactants, non-ionic surfactants comprising at least one sugar moiety and mixtures thereof.
- 28. The composition of claim 24 wherein said aliphatic alkyl ethoxylate surfactant comprises from about 8 to about 18 carbon atoms in the hydrophobic chain length, and an average of about 1 to about 15 ethylene oxide moieties per surfactant molecule.
- 29. The composition of claim 24 wherein said polymeric biguanide is selected from the group consisting of oligo-hexamethylene biguanide, poly-hexamethylene biguanide, salt thereof and a mixture thereof.
- 30. The composition of claim 24 wherein said polymeric biguanide is poly (hexamethylene biguanide) hydrochloride.
- 31. The composition of claim 24 wherein said composition comprises from about 0.01% to about 30% by weight of said acidifying agent; and wherein the level of said low-residue surfactant and/or an alkyl ethoxylate surfactant is from about 0.01% to about 15% by weight; the level of biguanide is from about 0.01% to about 20% by weight; and the pH of the aqueous composition is from about 0.5 to 7.
- 32. The composition of claim 31 wherein the level of said organic acidifying agent is from about 0.01% to about 3.0% by weight; the level of said low-residue surfactant and/or an alkyl ethoxylate surfactant is from about 0.01% to about 1.5% by weight; the level of said polymeric biguanide is from about 0.01% to about 2.0% by weight; and the pH of the aqueous composition is from about 0.5 to 7.
- 33. The composition of claim 32 wherein the level of said organic acidifying agent is from about 0.05% to about 2.0% by weight; the level of said low-residue surfactant and/or an alkyl ethoxylate surfactant is from about 0.01% to about 1.0% by weight; the level of said polymeric biguanide is from about 0.01% to about 1.0% by weight; and the pH of the aqueous composition is from about 1.0 to about 6.0.
- 34. The composition of claim 33 wherein level of said organic acidifying agent is from about 0.1% to about 1.0% by weight; the level of said low-residue surfactant and/or an alkyl ethoxylate surfactant is from about 0.03% to about 0.75% by weight; the level of said polymeric biguanide is from about 0.02% to about 0.75% by weight; and the pH of the aqueous composition is from about 2.0to about 5.5.
- 35. The composition of claim 34 wherein the total level of solids is 3% or less by weight of the aqueous composition.
- 36. The composition of 24 further comprising from about 0.5% to about 25% by weight of a solvent.
- 37. The composition of claim 36 wherein said solvent has a vapour pressure of about 6.66 Pa (about 0.05 mm Hg at 25° C. and atmospheric pressure).
- 38. The composition of claim 24 further comprising a hydrotrope.
- 39. The composition of claim 38 wherein said hydrotrope is an alkyl ethoxylate comprising from about 8 to about 18 carbon atoms in the hydrophobic group and at least an average of about 15 ethoxylate groups per hydrophobic group.
- 40. A method of cleaning hard surfaces comprising the step of contacting said surface with an aqueous composition according to claim 24.
- 41. The method of cleaning hard surfaces according to claim 40 wherein said method additionally comprises the step of wiping said surface during and/or after the step of contacting said surface with said aqueous composition.
- 42. The method of cleaning hard surfaces according to claim 41 wherein said step of wiping said surface is performed by contacting said surface with a cleaning tool selected from the group consisting of sponges, cloths, cellulose strings, cellulose strips, paper, paper towels, pre-moistened wipe laminates and absorbent disposable cleaning pads.
- 43. A disposable premoistened wipe for cleaning hard surfaces comprising:a substrate impregnated with the cleaning composition of claim 1.
- 44. The disposable premoistened wipe of claim 43 wherein said substrate comprises a cellulosic material.
- 45. A cleaning system for cleaning hard surfaces comprising:a disposable dry absorbent substrate; and a container filled with the cleaning composition of claim 1.
CROSS REFERENCE TO RELATED APPLICATION
This application is a Continuation-In-Part of U.S. patent application Ser. No. 09/671,718 to Sherry et al. filed Sep. 27, 2000, now U.S. Pat. No. 6,716,805 which claims the benefit of U.S. Provisional Application No. 60/156,286, filed on Sep. 27, 1999. This application also claims the benefit of U.S. Provisional Application No., 60/328,006, filed on Oct. 9, 2001.
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Provisional Applications (2)
|
Number |
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|
60/156286 |
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|
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Continuation in Parts (1)
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|
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