Claims
- 1. An aromatic polyamide composition for molding comprising:A. 100 parts by weight of semi-aromatic polyamide aromatic monomer component of greater than 20 mol % and said melting having a melting point of which is greater than 280° C.; and B. 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 μm to approximately 180 μm and a number average diameter of approximately 0.1 μm to 15.00 μm and the average aspect ratio of which is greater than 3:1.
- 2. An aromatic polyamide composition for molding comprising:A. 100 parts by weight of a semi-aromatic polyamide in which (a) the quantity of aromatic monomer in the monomer component that forms the polyamide is greater than 20 mol %, said polyamide having (b) a dicarboxylic acid component selected from the group consisting of terephthalic acid, a mixture of terephthalic acid and isophthalic acid in which the quantity of terephthalic acid in the dicarboxylic acid component is greater than 40 mol %, a mixture of terephthalic acid and adipic acid and a mixture of terephthalic acid, isophthalic acid and adipic acid in which the quantity of terephthalic acid in the dicarboxylic acid component is greater than 40 mol %, and (c) a diamine component selected from the group consisting of hexamethylenediamine and a mixture of hexamethylenediamine and 2-methylpentamethylenediamine and (d) a melting point greater than 280° C.; and B. 5 to 170 parts by weight of wollastonite of a number average length of approximately 5 μm to approximately 180 μm and a number average diameter of approximately 0.1 μm to 15.00 μm and the average aspect ratio of which is greater than 3:1.
- 3. The composition of claim 1 further comprising a thermal stabilizer.
- 4. The composition of claim 3 further comprising a phenolic antioxidant.
- 5. The composition of claim 4, further comprising an auxiliary antioxidant selected form the group consisting of phosphorous antioxidants and sulfur antioxidants.
- 6. The composition of claim 1 further comprising a mold release agent.
Priority Claims (1)
Number |
Date |
Country |
Kind |
11-219331 |
Aug 1999 |
JP |
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Parent Case Info
This application is a continuation of U.S. Ser. No. 09/630,827, filed Aug. 2, 2000, now abandoned.
US Referenced Citations (8)
Continuations (1)
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Number |
Date |
Country |
Parent |
09/630827 |
Aug 2000 |
US |
Child |
10/185485 |
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US |