The present disclosure relates to sealing methods for sealing arrangements for LED luminaires and similar lighting fixtures. Particularly, the present disclosure relates to sealing arrangement for the portion of the wires routed from a driver to an LED array in an LED luminaire and similar lighting fixtures.
The background information herein below relates to the present disclosure but is not necessarily prior art.
In existing LED luminaires, the portion of wires routed from a board carrying the LED array to the driver are sealed by applying a RTV (room temperature vulcanizing) sealant and by using complicated techniques for manufacturing for the area where the wires are routed, to provide a sealing that ensures ingress protection. As a result, the precision of the complicated manufacturing processes becomes critical. Besides, the existing arrangement described above degrades overall aesthetic appeal of the luminaire. The existing method of applying an RTV sealant for sealing limits the ease of assembly of LED luminaires.
Thus, there is a need of an arrangement for sealing the portion of wires between an LED array board and a driver in an LED luminaire, which ameliorates the aforementioned issues.
Some of the objects of the present disclosure, which at least one embodiment herein satisfies, are as follows:
A primary object of the present disclosure is to provide an arrangement for sealing the portion of wires between an LED array board and a driver in an LED luminaire.
Another object of the present disclosure is to provide an arrangement for sealing, which ensures ingress protection.
Yet another object of the present disclosure is to provide an arrangement for sealing, which precludes complicated manufacturing processes and/or assembly techniques.
Still another object of the present disclosure is to provide an arrangement for sealing, which enhances the aesthetic appeal of the LED luminaire.
Other objects and advantages of the present disclosure will be more apparent from the following description, which is not intended to limit the scope of the present disclosure.
The present disclosure envisages an arrangement for sealing the portion of wires between an LED array board and a driver in an LED luminaire. The LED luminaire is provided with a lens assembly for covering the LED array board. A connecting wire is configured to provide electrical connection between the LED array board and the driver. The arrangement for sealing comprises a lens gasket and a gasket channel. The lens gasket is configured to seal the space enclosed by the lens assembly from the outside, and thus, prevent ingress of fluids from the outside into the enclosed space and thereby prevent damage to the LED array on the LED array board. The gasket channel is provided on the operative inner surface and along the periphery of the lens frame for accommodating the lens gasket. The lens gasket is also configured to seal that portion of the connecting wire which exits the lens assembly. The lens gasket is provided with a first tab having a pair of first through-holes. The first tab extends in a direction transverse to the plane of the lens gasket. Each of the first through-holes is configured to allow a lead of the connecting wire to pass therethrough.
The portion of the lens channel adjacent to the fitted position of the first tab is provided with a wire access slot for allowing the connecting wire to access and pass through the first through-holes on the first tab.
The luminaire frame has a cavity that is positioned between the area where the LED array board is fixed and the location of the driver, so that the connecting wire passes over the cavity in a fully assembled state of the LED luminaire. The arrangement for sealing includes a cavity gasket that is provided with a second tab and a third tab. The second tab and the third tab extends in a direction transverse to the plane of the cavity gasket, and the second tab has a plurality of second through-holes and the third tab has a pair of third through-holes.
Preferably, the second tab and the third tab are configured to be positioned opposite to each other.
In an embodiment, the shape of the cavity and hence the shape of the cavity gasket is rectangular, wherein the second tab and the third tab are positioned on opposite sides of the cavity gasket.
In an embodiment, width of the second tab is larger than the width of the third tab.
In an embodiment, the periphery of the cavity is provided with a corresponding channel for accommodating the cavity gasket.
In an embodiment, the second tab of the lens gasket is positioned adjacent to the first tab of the lens gasket in an assembled configuration.
Preferably, wire access slots, for allowing the connecting wires to access and pass through the second through-holes and the third through-holes, are provided in the channel accommodating the cavity gasket.
In an embodiment, the arrangement for sealing includes a bridge support member that covers the remaining portion of the connecting wire between the cavity gasket and the driver. The bridge support member includes a cavity cover portion at one end for covering the cavity and a bridge portion in the middle.
The present disclosure also envisages a method for providing an arrangement for sealing.
An arrangement for sealing the portion of wires between an LED array board and a driver in an LED luminaire, of the present disclosure, will now be described with the help of the accompanying drawing, in which:
Embodiments, of the present disclosure, will now be described with reference to the accompanying drawing.
Embodiments are provided so as to thoroughly and fully convey the scope of the present disclosure to the person skilled in the art. Numerous details are set forth, relating to specific components, and methods, to provide a complete understanding of embodiments of the present disclosure. It will be apparent to the person skilled in the art that the details provided in the embodiments should not be construed to limit the scope of the present disclosure. In some embodiments, well-known processes, well-known apparatus structures, and well-known techniques are not described in detail.
The terminology used, in the present disclosure, is only for the purpose of explaining a particular embodiment and such terminology shall not be considered to limit the scope of the present disclosure. As used in the present disclosure, the forms “a”, “an” and “the” may be intended to include the plural forms as well, unless the context clearly suggests otherwise. The terms “comprises”, “comprising”, “including” and “having” are open ended transitional phrases and therefore specify the presence of stated features, elements, modules, units and/or components, but do not forbid the presence or addition of one or more other features, elements, components, and/or groups thereof.
The terms first, second, third, etc., should not be construed to limit the scope of the present disclosure as the aforementioned terms may be only used to distinguish one element, component or section from another component or section. Terms such as first, second, third etc., when used herein do not imply a specific sequence or order unless clearly suggested by the present disclosure.
The arrangement for sealing the portion of wires between an LED array board and a driver in an LED luminaire of the present disclosure shall now be described with the help of
The LED luminaire 100 has a luminaire frame 2 that supports an LED array board 4 and a driver compartment 6. Connecting wires 8 connect the LED array board 4 with the driver compartment 6, particularly, with a driver circuit in a driver compartment 6. A connector 5 is configured on the LED array board 4 for plugging free ends of the connecting wires 8. The LED array board 4 is enclosed by a lens assembly 10. The lens assembly 10 comprises a lens frame 12 and a lens 14 fitted in the lens frame 12. The lens 14 is configured to provide a transparent cover for the LED array board 4 enclosed by the lens frame 12. The connecting wires 8 are passed underneath the lens frame 12 to be connected to the LED array board 4. A sealing arrangement is, therefore, required for that portion of the lens assembly 10, and specifically, of the lens frame 12, though which the connecting wires 8 are made to pass.
Further, the luminaire frame 2 has a cavity 30 that is positioned between the area where the LED array board 4 is fixed and the location of thedriver compartment 6. Thus, the connecting wires 8 pass over the cavity 30 in a fully assembled state of the LED luminaire 100. Also, a sealing arrangement is required for that portion of the connecting wires 8 which pass over the cavity 30.
The arrangement for sealing of the present disclosure comprises a lens gasket 20, shown in
The fitted configuration of the lens gasket 20 in the lens assembly 10 is illustrated in
In an embodiment, the arrangement for sealing of the present disclosure also comprises a cavity gasket 40, an exemplary embodiment of which is illustrated in
In an embodiment, the arrangement for sealing of the present disclosure includes a bridge support member 50, which is visible in
In the first step, the connecting wires 8 are joined to the LED array board 4 through the connector 5. As shown in
The arrangement for sealing as described hereinabove is not only cheaper than the conventional one that involves use of RTV sealant, but the arrangement also simplifies the assembly process while reducing the number of assembly steps. A reliable, rigid, robust, aesthetically appealing and cost-effective arrangement for sealing the connecting wire between an LED driver and an LED array board is thus provided.
The foregoing description of the embodiments has been provided for purposes of illustration and not intended to limit the scope of the present disclosure. Individual components of a particular embodiment are generally not limited to that particular embodiment, but, are interchangeable. Such variations are not to be regarded as a departure from the present disclosure, and all such modifications are considered to be within the scope of the present disclosure.
The present disclosure described herein above has several technical advantages including, but not limited to, the realization of an arrangement for sealing the portion of wires between an LED array board and a driver in an LED luminaire, that:
The embodiments herein and the various features and advantageous details thereof are explained with reference to the non-limiting embodiments in the following description. Descriptions of well-known components and processing techniques are omitted so as to not unnecessarily obscure the embodiments herein.
The foregoing description of the specific embodiments so fully reveal the general nature of the embodiments herein that others can, by applying current knowledge, readily modify and/or adapt for various applications such specific embodiments without departing from the generic concept, and, therefore, such adaptations and modifications should and are intended to be comprehended within the meaning and range of equivalents of the disclosed embodiments. It is to be understood that the phraseology or terminology employed herein is for the purpose of description and not of limitation. Therefore, while the embodiments herein have been described in terms of preferred embodiments, those skilled in the art will recognize that the embodiments herein can be practiced with modification within the spirit and scope of the embodiments as described herein.
The use of the expression “at least” or “at least one” suggests the use of one or more elements or ingredients or quantities, as the use may be in the embodiment of the disclosure to achieve one or more of the desired objects or results.
While considerable emphasis has been placed herein on the components and component parts of the preferred embodiments, it will be appreciated that many embodiments can be made and that many changes can be made in the preferred embodiments without departing from the principles of the disclosure. These and other changes in the preferred embodiment as well as other embodiments of the disclosure will be apparent to those skilled in the art from the disclosure herein, whereby it is to be distinctly understood that the foregoing descriptive matter is to be interpreted merely as illustrative of the disclosure and not as a limitation
Number | Date | Country | Kind |
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202121018847 | Apr 2021 | IN | national |
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Entry |
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First Examination Report (FER) for India Patent Application No. 202121018847 dated Nov. 25, 2022, pp. 1-5. |
Number | Date | Country | |
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20220341584 A1 | Oct 2022 | US |