Patent Application
20170063005
There is a general market demand in the electrical and/or optical technology industries to increase data throughput while improving or at least maintaining performance. A countervailing market demand, however, is that the devices or systems that use the electrical and/or optical technology be reduced in size. These market demands are made throughout the consumer electronic industry and medical device industry in which different components communicate with each other electrically or optically. As one example with respect to medical devices, there is a desire to replace catheter-based two-dimensional (2D) intracardiac echo (ICE) imaging systems with real-time three-dimensional (3D) imaging systems. Both of these imaging systems may utilize a catheter having a probe coupled to a distal end of the catheter. The catheter may be configured for insertion into a patient's body (e.g., human or animal). The catheter is communicatively coupled to a user device through a cable assembly. The cable assembly is configured to communicate data signals from the probe to the user device.
In order to achieve higher quality imaging and/or 3D imaging, medical device makers have sought to replace the conventional piezoelectric transducer probes with capacitive micromachined ultrasonic transducer (CMUT) probes or piezoelectric micromachined ultrasound transducer (PMUT) probes. The CMUT and PMUT probes may be fabricated using microelectromechanical systems (MEMS) manufacturing techniques.
Although the CMUT and PMUT probes have been demonstrated as being feasible, the CMUT and PMUT probes may be commercially impractical. CMUTs and PMUTs typically include a dense transducer array of sensing elements. For instance, the transducer array may have about 1000 sensing elements/cm2. Communicating data signals that are based on external signals detected by this transducer array can be challenging. For example, it is often desirable or necessary that the catheter and corresponding cable assembly have a cross-sectional size that is capable of being inserted into a patient's body. Heretofore, a commercially reasonable method for interconnecting the transducer array and the cable assembly while maintaining a reduced cross-sectional size is lacking. A similar problem may also exist in other industries or technologies that utilize a small modular device that is coupled to a cable assembly.
Accordingly, there is a need for an array connector that is capable of interconnecting a cable assembly to a modular device.
In an embodiment, an array connector is provided that includes a connector body having a mating side. The connector body includes a plurality of substrate layers that are stacked side-by-side and have respective mating edges that form the mating side. The substrate layers form a plurality of interfaces in which each interface is defined between adjacent substrate layers. The adjacent substrate layers form a plurality of channels therebetween. The array connector also includes communication lines disposed within corresponding channels of the connector body such that the communication lines extend along the interfaces. The communication lines are wire conductors or optical fibers. The communication lines have respective mating terminals that are positioned proximate to the mating side and form at least a two-dimensional terminal array.
Optionally, the communication lines include wire conductors having end faces, and the mating terminals include conductive bumps that are attached to the end faces of the wire conductors. The conductive bumps may have a height of 100 μm or less and a tolerance limit that is within ±10 μm. Optionally, the terminal array of mating terminals has a density of at least 50 mating terminals per 100 mm2.
In an embodiment, a method of manufacturing an array connector is provided. The method includes (a) forming trenches along a working layer. The working layer includes a mating edge, a loading edge, and a layer side that extends therebetween. The trenches open to the layer side and extend through the mating edge and the loading edge. The method also includes (b) disposing communication lines within the trenches thereby forming a substrate layer. The communication lines have respective mating terminals that are positioned proximate to the mating edge and extending to at least proximate to the loading edge. The method also includes (c) repeating (a) and (b) to form at least one more substrate layer (d) stacking the substrate layers side-by-side. The mating edges of the substrate layers collectively form a mating side and the mating terminals form at least a two-dimensional terminal array. In some embodiments, the method may also include polishing the mating side to remove segment projections of the communication lines.
In an embodiment, a method of manufacturing an array connector is provided. The method includes (a) forming trenches along a working layer. The working layer includes a mating edge, a loading edge, and opposite first and second layer sides extending therebetween. The trenches open to the first and second layer sides and extend through the mating edge and the loading edge. The method also includes (b) disposing communication lines within the trenches thereby forming a substrate layer. The communication lines have respective mating terminals that are positioned proximate to the mating edge and extend to at least proximate to the loading edge. The mating terminals form at least a two-dimensional terminal array. The method also includes (c) stacking another working layer onto the first layer side of the substrate layer. The trenches of the first layer side become channels, wherein the other working layer is a cover layer or another substrate layer having trenches.
Embodiments set forth herein include array connectors, apparatuses or devices that utilize array connectors (e.g., detector assemblies and systems), and methods of manufacturing or fabricating the same. Array connectors are configured to electrically and/or optically interconnect an apparatus (e.g., device or system) to an array of terminals that are coupled to another component. The terminals may be electrical terminals, such as contact pads, or the terminals may be ends of optical fibers. The array connectors include connector bodies that hold a plurality of communication lines. The communication lines may include wire conductors capable of transmitting current in the form of electrical power or data signals. The communication lines may also include optical fibers capable of transmitting light or optical signals. The connector body typically provides a rigid structure that holds portions or segments of the communication lines in fixed positions with respect to one another. The communication lines may form an array of mating terminals along one or more sides of the connector body. In some embodiments, the array connector may be part of a cable assembly that interconnects two components, such as a modular device and a control device. In particular embodiments, the modular device includes an array of elements that are configured to detect external signals or emit energy. For example, the modular device may be a solid state device having electrodes.
In some embodiments, the array connector includes a plurality of substrate layers that are stacked side-by-side to form, at least in part, the connector body. The communication lines may extend along interfaces between adjacent substrate layers. As used herein, the term “substrate layer” is not limited to a single continuous body of material unless otherwise recited. For example, each substrate layer may be formed form multiple sub-layers of the same or different materials. Moreover, each substrate layer may include one or more features of different materials located therein or extending therethrough. The different substrate layers may be formed using known layer-fabricating processes, such as photolithography, etching, sputtering, evaporation, casting (e.g., spin coating), chemical vapor deposition, electrodeposition, epitaxy, thermal oxidation, physical vapor deposition, and the like. One or more layers may also be formed using a molding process, such as micromolding or nanoimprint lithography (NIL).
As described herein, the mating terminals may form a terminal array that is configured to couple to a corresponding array of another component. Each mating terminal has a fixed location or address with respect to other mating terminals in the terminal array. The terminal arrays may be one dimensional or at least two-dimensional. More specifically, the mating terminals may be positioned in a designated manner along at least two dimensions. For example, the mating terminals may coincide with a plane that extends perpendicular or orthogonal to the communication lines. Alternatively, one or more of the mating terminals may have a different depth or Z-position with respect to other mating terminals. Accordingly, the terminal arrays may be three-dimensional.
A technical effect of at least some embodiments may include the ability to communicate signals to and/or from a dense array of elements. Embodiments may directly connect the cross-sectional end faces of wire conductors (or conductive bumps) to similar terminals. Likewise, embodiments may directly align ends of optical fibers with other optical components. The mating side of the array connectors may include a proud surface that is modified to have designated characteristics. Embodiments may be assembled layer-by-layer to build a 2D or 3D structure of any desired combination of elements. At least some embodiments may enable increased terminal density and product scalability, and reduce assembly cost and product variability.
As used herein, phrases such as “a plurality of [elements]” and “an array of [elements]” and the like, when used in the detailed description and claims, do not necessarily include each and every element that a component may have. The component may have other elements that are similar to the plurality of elements. For example, the phrase “a plurality of substrate layers [being/having a recited feature]” does not necessarily mean that each and every substrate layer of the component has the recited feature. Other substrate layers may not include the recited feature. Accordingly, unless explicitly stated otherwise (e.g., “each and every substrate layer [being/having a recited feature]”), embodiments may include similar elements that do not have the recited features. As used herein, the term “exemplary,” when used as an adjective, means serving as an example. The term does not indicate that the object to which it modifies is preferred.
As used herein, the term “communication line” may include one or more electrical conductors or one or more optical fibers. For example, a communication line may include a single insulated wire conductor or may include two or more insulated wire conductors, such as twin-axial (or twinax) cables. The communication line may also include a coaxial cable. In some embodiments, the communication line only includes the electrical conductor (e.g., wire conductor plus insulation or an uninsulated wire conductor) or the optical fiber. In such embodiments, the end face of the corresponding conductor/fiber may constitute or be part of the mating terminal of the communication line that is used to form an array. In other embodiments, however, the communication line may include a discrete mating terminal that is positioned relative to the end face of the conductor/fiber. For example, the mating terminal may be a conductive bump or plating that is attached to the end face of an electrical conductor or a lens that is positioned adjacent to an optical fiber. Accordingly, the term “mating terminal” may be an end face of a conductor/fiber or a discrete element that is operably coupled to the end face, such as a conductive bump that is attached to the end face of an electrical conductor or a lens that is positioned to transmit optical signals to and/or from a respective optical fiber end.
The array connector 100 has a plurality of communication lines 110 that extend through the connector body 102. The communication lines 110 may include one or more wire conductors and/or one or more optical fibers. In particular embodiments, the communication lines 110 are wire conductors. As shown, the communication lines 110 include mating terminals 112 that are exposed along the mating side 104. The mating terminals 112 may include or be end faces of the corresponding wire conductors or optical fibers or may be discrete elements that are positioned relative to the end faces of the corresponding wire conductors or optical fibers. The communication lines 110 extend from the mating side 104 and through the connector body 102 such that the communication lines 110 either clear the connector body 102 or have corresponding mating terminals (not shown) that are exposed along one of the other body sides 105-108. In particular embodiments, the communication lines 110 extend entirely through the connector body 102 and clear the connector body 102 such that the communication lines 110 project away from the connector body 102. In some embodiments, the communication lines 110 may be grouped or bundled together to form one or more cables or cable harnesses (not shown).
In the illustrated embodiment, the connector body 102 is substantially rectangular or block-shaped in which each body side is opposite another body side. In other embodiments, however, the connector body 102 may have any one of a variety of shapes. For example, the connector body 102 may have a trapezoidal shape in which the mating side 104 has a smaller area than the opposite side 108. In such embodiments, the communication lines 110 may flare away from each other as the communication lines 110 extend from the mating side 104 to the body side 108.
In some embodiments, the mating terminals 112 are ends of the segments of the communication lines 110 that extend through the connector body 102. For example, the mating terminals 112 may be ends of optical fibers that are positioned proximate to the mating side 104. In such embodiments, the mating terminals 112 may project from the mating side 104, as shown in
The mating terminals 112 form a terminal array 114 in which each mating terminal 112 has a designated location or address relative to the other mating terminals 112. In the illustrated embodiment, the terminal array 114 includes a plurality of columns and rows of mating terminals 112. It should be understood, however, that the locations of the mating terminals 112 in the terminal array 114 may be arranged in a different manner based upon the application of the array connector 100.
In particular embodiments, the terminal array 114 of mating terminals 112 forms a high-density array. As used herein, a “high-density array” includes at least 50 mating terminals per 100 mm2 or at least 75 mating terminals per 100 mm2. In some embodiments, the high density array may have at least 100 mating terminals per 100 mm2, at least 200 mating terminals per 100 mm2, at least 300 mating terminals per 100 mm2, or at least 400 mating terminals per 100 mm2. In particular embodiments, the high density array may have at least 500 mating terminals per 100 mm2 or at least 750 mating terminals per 100 mm2. In more particular embodiments, the high density array may have at least 1000 mating terminals per 100 mm2.
In particular embodiments, the terminal array 114 is a two-dimensional array such that the mating terminals 112 coincide with a common plane. In other words, the mating terminals 112 may be coplanar. For example, the terminal array 114 coincides with a plane that extends parallel to the elevation axis 193 and the lateral axis 192. In other embodiments, however, the terminal array 114 may not coincide with a common plane. For example, each row of mating terminals 112 may have alternating positions along the mating axis 191.
As described herein, the connector body 102 may comprise a plurality of substrate layers 120 that are stacked side-by-side. Each substrate layer 120 may have a plurality of layer edges 122-125. In order to distinguish the different layer edges, the layer edges 122 may be referred to as leading edges or mating edges. The layer edges 124 (
The mating edges 122 collectively form the mating side 104 when the substrate layers 120 are stacked side-by-side along the elevation axis 193. In the illustrated embodiment, the mating edges 122 are even or flush with one another such that the mating side 104 has a mating surface 126 that is essentially planar. The mating terminals 112 project away from the mating surface 126. Yet in other embodiments, the mating edges 122 of the substrate layers 120 may not be even or flush with one another. For example the mating edges 122 may form a stair-like structure in which each mating edge 122 has a different location along the mating axis 191.
Accordingly, the array connector 100 presents a mating side 104 that is capable of being interconnected with a corresponding array of another component. Each of the substrate layers 120 may be shaped such that adjacent substrate layers 120 form channels (not shown) that extend between the adjacent substrate layers 120. The stacked substrate layers 120 may form a substantially monolithic body that holds segments of the communication lines 110 in fixed positions with respect to one another. For example, the connector body 120 may consist essentially of the communication lines 110, the substrate layers 120, and the mating terminals 112 if the mating terminals 112 comprise a material that differs from the communication lines 110.
The method 200 may include a plurality of additive or subtractive steps in which working layers (or portions thereof) are added or subtracted, respectively, from a working substrate. The terms “working layer” and “working substrate” are used to describe intermediate objects that are used to form an array connector, such as the array connector 100. More specifically, the term “working layers” includes one or more layers of material that may be used to form a substrate layer. For example, the term encompasses a single base layer and a base layer having a photoresist deposited thereon. The term “working substrate” includes a plurality of stacked substrate layers in which at least one of the substrate layers is being used to form an array connector. For example, in some cases, the term may encompass an array connector prior to the mating side being modified.
The following describes only one method of manufacturing an array connector. It should be understood that the method may be modified or that other methods may be used to manufacture the array connectors. At least one of the substrate layers may be formed using one or more processes that are similar to, for example, the processes used to manufacture integrated circuits, semiconductors, and/or microelectromechanical systems (MEMS). For example, lithography (e.g., photolithography) is one category of techniques or processes that may be used to fabricate the array connectors described herein. Exemplary lithographic techniques or processes are described in greater detail in Marc J. Madou, Fundamentals of Microfabrication and Nanotechnology: Manufacturing Techniques for Microfabrication and Nanotechnology, Vol. II, 3rd Edition, Part I (pp. 2-145), which is incorporated herein by reference in its entirety.
One or more processes for fabricating the substrate layers and/or the array connectors may include subtractive techniques in which material is removed from a working substrate. In addition to lithography, such processes include (1) chemical techniques, such as dry chemical etching, reactive ion etching (RIE), vapor phase etching, chemical machining (CM), anisotropic wet chemical etching, wet photoetching; (2) electrochemical techniques, such as electrochemical etching (ECM), electrochemical grinding (ECG), photoelectrochemical etching; (3) thermal techniques, such as laser machining, electron beam machining, electrical discharge machining (EDM); and (4) mechanical techniques, such as physical dry etching, sputter etching, ion milling, water-jet machining (WJM), abrasive water-jet machining (AWJM), abrasive jet machining (AJM), abrasive grinding, electrolytic in-process dressing (ELID) grinding, ultrasonic drilling, focused ion beam (FIB) milling, and the like. The above list is not intended to be limiting and other subtractive techniques or processes may be used. Exemplary subtractive techniques or processes are described in greater detail in Marc J. Madou, Fundamentals of Microfabrication and Nanotechnology: Manufacturing Techniques for Microfabrication and Nanotechnology, Vol. II, 3rd Edition, Part II (pp. 148-384), which is incorporated herein by reference in its entirety.
One or more processes for fabricating the substrate layers and/or the array connectors may also include additive techniques in which material is added to a working substrate. Such processes include PVD, evaporation (e.g., thermal evaporation), sputtering, ion plating, ion cluster beam deposition, pulsed laser deposition, laser ablation deposition, molecular beam epitaxy, chemical vapor deposition (CVD) (e.g., atmospheric pressure CVD (APCVD), low pressure CVD (LPCVD), very low pressure CVD (VLPCVD), ultrahigh vacuum CVD (UHVCVD), metalorganic CVD (MOCVD), laser-assisted chemical vapor deposition (LACVD), plasma-enhanced CVD (PECVD), atomic layer deposition (ALD), epitaxy (e.g., liquid-phase epitaxy, solid-phase epitaxy), anodization, thermal spray deposition, electroplating, electroless plating, incorporation in the melt, thermal oxidation, laser sputter deposition, reaction injection molding (RIM), spin coating, polymer spraying, polymer dry film lamination, casting, plasma polymerization, silk screen printing, ink jet printing, mechanical microspotting, microcontact printing, stereolithography or microphotoforming, nanoimprint lithography, electrochemical forming processes, electrodeposition, spray pyrolysis, electron beam deposition, plasma spray deposition, micromolding, LIGA (which is a German acronym for x-ray lithography, electrodeposition, and molding), compression molding, and the like. The above list is not intended to be limiting and other additive techniques or processes may be used. Exemplary additive techniques or processes are described in greater detail in Marc J. Madou, Fundamentals of Microfabrication and Nanotechnology: Manufacturing Techniques for Microfabrication and Nanotechnology, Vol. II, 3rd Edition, Part III (pp. 384-642), which is incorporated herein by reference in its entirety.
In some cases, one or more processes may provide array connectors with identifiable physical characteristics. For example, channels formed within the array connector may be identified as etched channels or molded channels based upon inspection of the array connector. More specifically, a scanning electron microscope (SEM) or other imaging system may capture an image of the array connector, such as a sliced portion of the array connector. The channels may have qualities or characteristics that are indicative of surfaces that are etched or molded.
The method 200 is described with reference to other Figures of the present application. The method 200 includes providing, at 202, a working layer 220 (shown in
In some cases, the base layer 222 may undergo surface modification to enhance adhesion of the channel layer 224 to the base layer 222. For example, a top surface 223 of the base layer 222 may be subjected to silanization. In the illustrated embodiment, the base layer 222 includes glass (e.g., silicon wafer), and the channel layer 224 includes photoresist, such as a negative photoresist. In particular embodiments, the photoresist is SU-8. SU-8 includes Bisphenol A Novolac epoxy that is dissolved in an organic solvent (gamma-butyrolactone GBL or cyclopentanone, depending on the formulation) and up to 10 wt % of mixed Triarylsulfonium/hexafluoroantimonate salt as the photoacid generator. Upon irradiation, the photoacid generator decomposes to form hexafluoroantimonic acid that protonates the epoxides on the oligomer. The protonated oxonium ions are available to react with neutral epoxides in a series of cross-linking reactions after application of heat. Each monomer molecule contains eight reactive epoxy sites, and therefore high degree of cross-linking can be obtained after photothermal activation giving a negative tone. This results in high mechanical and thermal stability of the lithographic structures after processing. It is contemplated, however, that materials other than SU-8 may be used in alternative embodiments, such as other photoresists.
At 204, the method 200 may include forming trenches 230 within the channel layer 224. For example, a mask 226 may be applied to the channel layer 224 and the resulting working layer 228 may be subjected to an ultraviolet (UV) exposure for a designated amount of time. The UV exposure may form the trenches 230 within the channel layer 224. In alternative embodiments, the trenches may be formed through additive techniques. Methods of working with and patterning SU-8 are also described in del Campo, Aránzazu, and Christian Greiner. “SU-8: a photoresist for high-aspect-ratio and 3D submicron lithography.” Journal of Micromechanics and Microengineering 17.6 (2007): R81; Abgrall, Patrick, et al. “SU-8 as a structural material for labs-on-chips and microelectromechanical systems.” Electrophoresis 28.24 (2007): 4539-4551; Lee, Jeong Bong, Kyung-Hak Choi, and Koangki Yoo. “Innovative SU-8 Lithography Techniques and Their Applications.” Micromachines 6.1(2014): 1-18, each of which is incorporated herein by reference.
At 206, the method 200 may include disposing communication lines 232 within corresponding trenches 230. As shown in
Optionally, an adhesive 236 may be applied to the working layer 238. The adhesive 236 may be, for example, an epoxy. The adhesive 236 may be deposited along the outer surface 234 and/or within the trenches 230. The adhesive 236 may at least partially fill voids formed between the communication line 232 and the corresponding surfaces that define the trench 230. The adhesive 236 may facilitate securing the communication lines 232 in essentially fixed positions with respect to other elements of the working layer 238. In particular embodiments, the adhesive 236 is a silane adhesion promoter that couples glass or a silicon wafer to SU-8. For example, the adhesive 236 may be applied using the Gelest method. In particular embodiments, the adhesive 236 is 1,3-bis(3-Glycidoxypropyl)TetramehylDisiloxane.
At 208, the working layers may be stacked onto one another to form a connector body.
As the second working layer 242 is lowered onto the first working layer 238, the surfaces that define the trenches 244 may engage the communication lines 232 disposed within the trenches 230 of the first working layer 238. In such embodiments, the communication lines 232 may cause the second working layer 242 to align with the first working layer 238 to form a plurality of channels 246 extending through the connector body 240. Accordingly, each channel 246 is formed by one of the trenches 230 and one of the trenches 244.
Similarly, the connector body 250 may be formed by stacking a second working layer 252 onto a first working layer 238. The second working layer 252, however, may be devoid of trenches along a side 254 of the second working layer 252 that faces the first working layer 238. Optionally, the second working layer 252 may include trenches along a side 255 that is opposite the side 254. The communication lines 232 may be flush with the outer surface 234 or located a depth within the trenches 230. When the second working layer 252 is lowered onto the first working layer 238, the side 254 of the second layer 252 engages the outer surface 234 of the first layer 238 and covers the trenches 230 to form a plurality of channels 256.
In both connector bodies 240, 250, the first and second working layers are adjacent substrate layers that define interfaces 249, 259, respectively, therebetween. In each example, the adjacent substrate layers of each interface 249, 259 are shaped to form the channels 246, 256, respectively. In each example, the communication lines 232 are disposed within corresponding channels 246, 256 of the connector body such that the communication lines 232 extend along the corresponding interface.
Although
The following describes one particular example of a method of manufacturing the substrate layers, such as the method 200 (
The trenches may be formed using photolithographic coating and etching of SU-8 based photoresist. SU-8 is a negative photoresist that has been used directly as a structural material due to its mechanical strength, chemical resistance, and thermal stability. The SU-8 can be cross-linked upon UV exposure.
One or both sides of the substrate layer (or working layer) may be processed to include the trench. The process included preparing a working substrate for forming the trenches. Preparing the working substrate included subjecting a silicon wafer to oxygen plasma treatment to clean and activate the surface of the silicon wafer (APE 110 Plasma Chamber, 150 Watts RF Power, <0.30 Torr Vacuum, 2 minute residence time, 2 cycles, 125 sccm Gas Flow). This activated surface was then subjected to a surface modification process. More specifically, a surface silanization process may be conducted after the surface has been activated by the oxygen plasma treatment. The silanization enhances adhesion of SU-8 to the silicon wafer. The silanization process included: adjusting pH of 95% Ethanol-5% DI H2O mixture to ˜5 with dilute acid; adding 2 ml silane in 100 ml mixture of the aqueous alcohol and stir; allowing 5 minutes for hydrolysis and silanol formation; immersing wafer for 2 minutes; rinsing with ethanol and air drying; curing wafer for 10 minutes at 110° C. on a hotplate. Adhesion was enhanced due to the bonding of the silane functional group with the silicon wafer coupled with the presence of epoxy ring in both silane and SU-8. In some embodiments, a silane adhesion promoter may be used to couple SU-8 of one working layer to the silicon wafer of another working layer.
The process also included film deposition that included dynamic dispensing via quick injection with syringe containing 4 g Microchem SU-8-305 followed by spincoating with 2000 rpm-ramp 300 seconds. The target thickness (75±1 μm) was obtained when ambient is ˜21.7° C. The spin-speed program varies with room temperature, equipment, and lab conditions.
The process also included baking the working substrate, also referred to as a soft bake. For instance, progressive heating with ramp from room temperature to 95° C. for 20 minutes may be beneficial to reduce intrinsic stress.
After the baking, the working substrate was exposed to UV light having a wavelength of 365 nm. The prescribed exposure dose may range from 150 to 250 mJ/cm2 to attain ˜75 μm thickness. A target energy level of 200 mJ/cm2 may be determined using a dosimeter. After exposing the working substrate, the working substrate was baked at 65° C. for 1 minute and then 95° C. for 5 minutes. The working substrate was then immersed in propylene glycol methyl ether acetate (PGMEA), double puddle, minimum 4 minutes each, with moderate agitation, and then rinsed with fresh PGMEA. The working substrate was then baked (i.e., hard baked) at 150° C. for 30 minutes for permanent structural integrity. The working substrate was then diced to generate multiple working substrates having trenches formed thereon.
As another example, working substrates (or layers) may be formed using a photostructurable glass ceramic (PSGC). PSGC may enable forming microstructures, such as the trenches, therein without use of any of conventional drilling or machining processes. For example, a wafer may be exposed to a designated UV light for a predetermined period of time using a mask. The exposed regions may be converted to a ceramic material by baking at a designated temperature for a predetermined time. More specifically, the PSGC may transform into the crystalline phase lithium metasilicate. The transformed material may be more active for reaction with hydrofluoric acid (HF) than amorphous glass. In this manner, the trenches may be formed in the working layers.
The trenches 302, 304 are open-sided channels or grooves that extend an entire axial dimension 310 (
As shown in
By way of example only, the trench width 320 may be less than or equal to 250 μm, less than or equal to 150 μm, less than or equal to 125 μm, or less than or equal to 100 μm. In particular embodiments, the trench width 320 may be less than or equal to 90 μm, less than or equal to 80 μm, or less than or equal to 70 μm. In more particular embodiments, the trench width 320 may be less than or equal to 60 μm, less than or equal to 50 μm, or less than or equal to 40 μm. By way of example only, the trench depth 322 may be less than or equal to 200 μm, less than or equal to 175 μm, or less than or equal to 150 μm. In particular embodiments, the trench depth 322 may be less than or equal to 130 μm, less than or equal to 110 μm, or less than or equal to 100 μm. In more particular embodiments, the trench depth 322 may be less than or equal to 80 μm, less than or equal to 60 μm, or less than or equal to 40 μm.
The lateral center-to-center spacing 324 may be less than or equal to 1000 μm, less than or equal to 800 μm, or less than or equal to 600 μm. In particular embodiments, the lateral center-to-center spacing 324 may be less than or equal to 500 μm, less than or equal to 400 μm, or less than or equal to 300 μm. The elevated center-to-center spacing 326 may be less than or equal to 1000 μm, less than or equal to 800 μm, or less than or equal to 600 μm. In particular embodiments, the elevated center-to-center spacing 326 may be less than or equal to 500 μm, less than or equal to 400 μm, or less than or equal to 300 μm. In more particular embodiments, the elevated center-to-center spacing 326 may be less than or equal to 250 μm, less than or equal to 200 μm, or less than or equal to 150 μm. In the illustrated embodiment of
In the illustrated embodiment, the trenches 302, 304 have identical dimensions (e.g., the trench depth 322 and the trench width 320) and spacings with respect to one another. It should be understood that the dimensions and spacing are not required to be identical. For example, while some trenches 302 may be configured to receive 32 AWG communication lines, other trenches 302 may be configured to receive 50 AWG communication lines. Likewise, the lateral center-to-center spacings 324 and the elevated center-to-center spacing 326 are not required to be the same.
In the embodiment shown in
The communication lines 378 clear the loading edge 374. In an exterior of the substrate layer 370, the communication lines 378 are secured to a coupling layer 382. In the illustrated embodiment, the coupling layer 382 is a strip of tape having an adhesive outer surface 384. The communication lines 378 are positioned onto the adhesive outer surface 384 and pressed into the adhesive outer surface 384 thereby securing the communication lines 378 to the coupling layer 382. The communication lines 378 may have any designated arrangement. For example, the communication lines 378 are coplanar and have the same center-to-center spacing 380 in
Although the coupling layer 382 may be a strip of tape in some embodiments, the coupling layer 382 may also be an overmold in other embodiments. For example, the communication lines 378 may be held at designated positions with respect to one another within a molding cavity. A moldable material (e.g., thermoplastic) may be injected into the molding cavity and allowed to cure to form the overmold. Yet in other embodiments, the coupling layer 382 may include multiple sub-layers. For example, a first sub-layer may include a base layer, such as polyimide. After the communication lines 378 are positioned onto the base layer, an adhesive material may be applied onto the base layer (e.g., sprayed) and allowed to cure thereby forming a second sub-layer and securing the communication lines 378 to the coupling layer 378.
In the illustrated embodiment, the coupling layer 382 has a length (or sub-length) 385 that extends along only a portion of the length of the communication lines 378. In some embodiments, one or more other coupling layer(s) (not shown) may secure the communication lines 378 along a different portion(s) of the length. Although
Each segment projection 410 has a length 414 that is measured between an end face 415 of the corresponding segment projection 410 and the corresponding edge surface 408. The lengths 414 of the segment projections 410 may be different due to tolerances in the method of manufacturing the array connector 400. For some applications, it may be desirable to have a limited planarity requirement with respect to the mating terminals. More specifically, it may be desirable for the end faces 415 of the communication lines 404 to have a common length 414.
Accordingly, modifying the mating side, at 210, may include polishing the mating side 406 to remove the segment projections 410 of the communication lines 404. The array connector 400 after the polishing operation is shown in
The polishing operation may not only remove the segment projections 410 (
In an exemplary embodiment, the height 422 is less than or equal to 100 μm and has a tolerance limit of ±10 μm. However, the height 422 may have other values with different tolerance limits. For example, the height 422 may be less than or equal to 200 μm, less than or equal to 150 μm, or less than or equal to 125 μm. In particular embodiments, the height 422 may be less than or equal to 110 μm, less than or equal to 100 μm, or less than or equal to 90 μm. In more particular embodiments, the height 422 may be less than or equal to 80 μm, less than or equal to 70 μm, less than or equal to 60 μm, or less than or equal to 50 μm. The tolerance limit may be within ±15% of the height, within ±12% of the height, within ±10% of the height, or within ±8% of the height.
The cable harness 454 is configured to group or bunch a plurality of communication lines 466 (
The method 200 may also include coupling, at 212 (
In the illustrated embodiment, the device array 516 and the terminal array 506 are communicatively coupled through thermocompression flip-chip bonding or thermonsonic flip-chip bonding (also referred to as solderless bonding). In thermocompression flip-chip bonding, the mating terminals 510 of the array connector 502 are bonded to the mating terminals 518 of the modular device 512 by thermal energy and applied force. The bonding temperature may be relatively high, e.g., 300° C., to soften bonding material and increase the diffusion bonding process. In thermosonic (or solderless) flip-chip bonding, the ultrasonic energy is transferred to the bonding joint through the array connector 502. The ultrasonic energy may soften the bonding material and make it vulnerable to plastic deformation. It should be understood that the method of bonding may be identified through inspection. For example, an SEM image of a device may reveal that the device array and terminal array are thermocompression bonded or thermosonic bonded.
It should be understood that a terminal array of fiber ends may also be communicatively coupled to a device array of fiber ends. For example, the mating sides of two optical ferrules may have respective arrays of optical fiber ends or lenses that are coupled to optical fiber ends. One optical ferrule may be an array connector as described herein. The other optical ferrule may be similar to a multi-fiber MT ferrule. Optionally, the mating sides may include physical alignment features that engage one another to align the two ferrules. The mating sides may be operably coupled to one another to maintain the alignment throughout operation. For example, the two ferrules may be secured to each other using a fastener or an adhesive.
In an exemplary embodiment, the probe assembly 552 is a catheter that is configured to be inserted into a body (e.g., human or animal). For example, the probe assembly 552 may be configured for real-time three-dimensional (3D) ultrasound imaging. Ultrasound can be excited by many different methods, including the piezoelectric effect, magnetostriction, and the photoacoustic effect. The probe assembly 552 may also be configured to emit energy for delivering therapy, such as tissue ablation. As shown, the probe assembly 552 includes a cable assembly 558. The cable assembly 558 may include an array connector (not shown), such as the array connectors described herein, and a plurality of communication lines (not shown) that are communicatively coupled to the array connector.
The probe assembly 552 may also include a modular device 560 that is communicatively coupled to the control device 554 through the cable assembly 558. In particular embodiments, the modular device 554 includes a solid state device, such as complementary metal-oxide semiconductors (CMOSs), charge-coupled devices (CCDs), and the like. The modular device 560 may be sized for insertion into, for example, a patient's body. In some embodiments, the modular device 560 is configured to detect or observe external signals. In the illustrated embodiment, the modular device is an ultrasound device or transducer 560. For example, the ultrasound device 560 may be or include a piezoelectric micromachined ultrasonic transducer (PMUT) or a capacitive micromachined ultrasonic transducer (CMUT). In other embodiments, the modular device 560 may include or constitute an imaging sensor (e.g., CMOS). The modular device 560 may also be configured to measure conditions within a designated space, such as pressure or temperature. In some embodiments, the modular device 560 may be configured for providing therapy, such as tissue ablation. Ablation may refer to the direct application of chemical or thermal therapies to a designated region of an organ or tissue in an attempt to at least substantially damage or destroy the designated region. For example, the modular device 560 may be configured to ablate tissue through high intensity focused ultrasound (HIFU), radio-frequency (RF), microwaves, laser, or thermal control (e.g., thermal ablation or cryoablation). The modular device 560 may also be configured for stimulation by delivering electrical pulses. It should be understood that the modular device 560 may also be configured for both detection and therapy in some embodiments.
In some embodiments, the entire system 500 may be configured for insertion into a patient's body. For example, the probe assembly 552 may include a stimulation device (e.g., neurostimulator or pacemaker) and the control device 554 may be a pulse generator that is configured to provide a designated sequence of electrical pulses to the probe assembly 552 for delivering the therapy. The modular device 560 may be, for example, a percutaneous lead or a paddle lead. The control device 554 and the probe assembly 552 may be implanted into a patient's body.
The probe assembly 552, however, may be used for purposes other than medical applications. For example, the modular device 560 may include an imaging sensor (e.g., CMOS) or other type of detector/transducer that detects external signals and communicates the external signals, directly or indirectly, to the control device 554.
The array 608 of elements 610 are configured to detect external signals or, more specifically, ultrasound signals from within a region-of-interest (ROI), such as a region within a patient's body. In particular embodiments, the ROI is within a vessel or, more specifically, a cardiac vessel. The modular device 606 is configured to communicate data signals that are based on the ultrasound signals to a computing system. The data signals may be identical to the detected ultrasound signals or may be processed in a predetermined manner by the modular device 606. To this end, the modular device 606 is communicatively coupled to a cable assembly 612, which may be similar or identical to the cable assemblies described herein. For example, the cable assembly 612 may include an array connector (not shown) and wire conductors (not shown) that are coupled to the array connector. The array connector is communicatively coupled to the modular device 606. In alternative embodiments, the elements 610 may be replaced with elements that are configured to detect other external signals and/or are configured to emit energy. For example, the elements 610 may include electrodes for delivering radiofrequency (RF) energy to a designated tissue. In other embodiments, the elements 610 may be electrodes that are configured to apply electrical pulses to a designated tissue. In other embodiments, the elements 610 are configured to deliver HIFU to a designated tissue.
In addition to a device array (not shown) and the array 608, the modular device 606 may include other components. For example, the modular device 606 may include circuitry that is configured to process data signals that are received from the array 608 and/or circuitry that is configured to process data signals that are received from a control device. In some embodiments, the modular device 606 may include a signal converter (or optical engine) that changes the signals between one signal form (e.g., optical) and another signal form (e.g., electrical). The signal converter may be similar to, for example, the engines developed by TE Connectivity and sold under the trademark Coolbit. Accordingly, the modular device 606 may be configured to (a) receive optical signals and/or electrical signals from the cable assembly or (b) provide optical signals and/or electrical signals to the cable assembly.
The array connector 654 may be similar or identical to the array connectors described herein. For example, the array connector 654 includes a connector body 660 having a mating side 662 and a loading side 664. The communication lines 656 extend through the loading side 664 and toward the mating side 662. The communication lines 656 may extend along channels that are formed through the connector body 660. The communication lines 656 may form an array along the mating side 662 such that end faces of wire conductors or optical fibers (not shown) are exposed along the mating side 662 or such that conductive bumps or lenses (not shown) are aligned with the end faces along the mating side 662.
In the illustrated embodiment, the loading side 664 and the mating side 662 face in opposite directions. In other embodiments, however, the loading side 664 and the mating side 662 may face in different directions that are, for example, perpendicular to each other. In such embodiments, the connector body 660 may include channels that are non-linear. For embodiments that have optical fibers, the bending of the optical fibers may satisfy the bend radius for communicating optical signals.
The array connector 654 is configured to be communicatively coupled to a modular device 670. The modular device 670 includes a mounting side 672 and an active side 674. The modular device 670 may be manufactured using, for example, semiconductor or integrated circuit manufacturing technology or microelectromechanical systems (MEMS) manufacturing technology. The modular device 670 may be manufactured using, for example, the subtractive or additive processes described above. The active side 674 includes an array of elements (not shown) that are configured to detect external signals and/or emit energy therefrom. The array of elements are communicatively coupled (e.g., through vias, conductive traces, optical fibers, and/or the like) to a device array 676 positioned along the mounting side 672. The device array 676 includes an array of terminals 678. In some embodiments, the array terminals include electrical contacts 678. The electrical contacts 678 may be, for example, contact pads that are positioned substantially flush with the mounting side 672 or flexible contact beams that project away from the mounting side 672. In some embodiments, the array terminals include optical fiber ends 678 that are exposed along the mounting side 672 for aligning with corresponding optical fiber ends. In some embodiments, the device array 676 includes both electrical contacts and optical fiber ends. The device array 676 is configured to match the array (not shown) along the mating side 662 of the array connector 670.
Also shown, the connector body 702 may have a working passage or channel 710 therethrough. The working passage 710 may be aligned with a corresponding passage of, for example, a modular device (not shown). The working passage 710 and the optional passage of the modular device may be sized and shape to receive an instrument or tool. For example, the working passage 710 and the device passage may be sized and shaped to receive a tube 712. A fluid may be directed through the tube 712 to, for example, remove debris. In other embodiments, the modular device may be disposed within a flexible container or bladder. The tube 712 may provide a fluid along the array of the modular device.
In the illustrated embodiments, each of the communication lines has only a single communication pathway. In other embodiments, however, the communication lines may include multiple communication pathways. Alternatively, the channels may be sized and shaped to receive more than one communication line. For example, the communication line may include a twin-axial communication line in which two wire conductors extend parallel to each other through a common jacket. As another example, the communication line may comprise a coaxial line.
In an embodiment, a probe assembly is provided that includes a modular device configured to detect external signals or emit energy. The modular device has a device array that includes at least one of electrical contacts or optical fiber ends. The probe assembly also includes a cable assembly that is configured to communicatively couple the modular device to a computing system and transmit data signals therethrough. The cable assembly includes an array connector having a connector body that includes a mating side and channels extending through the mating side and the connector body. The cable assembly includes a plurality of communication lines that are disposed within corresponding channels of the connector body. The communication lines include at least one of wire conductors or optical fibers. The communication lines have respective end faces that are positioned proximate to the mating side to form at least a two-dimensional terminal array. The terminal array is aligned with and coupled to the device array of the modular device. In alternative embodiments, the communication lines may form only a one-dimensional array. For example, the end faces may be positioned proximate to the mating side along one row or column.
Optionally, the probe assembly includes a probe body that surrounds the modular device and that is configured to be inserted into an individual. For example, the modular device may include at least one of a capacitive micromachined ultrasonic transducer (CMUT) or a piezoelectric micromachined ultrasonic transducers (PMUT) that is surrounded by the probe body.
In some embodiments, the connector body includes a plurality of substrate layers that are stacked side-by-side and have respective mating edges that form the mating side. The substrate layers may form a plurality of interfaces in which each interface is defined between adjacent substrate layers, wherein the adjacent substrate layers define the channels therebetween. Optionally, the communication lines include wire conductors and conductive bumps that are directly coupled to corresponding end faces of the wire conductors. The conductive bumps form corresponding mating terminals and are presented along the mating side to form the terminal array. The conductive bumps are electrically coupled to corresponding electrical contacts of the device array. In some embodiments, the device array is coupled to the terminal array through one of a thermo-compression bond, a solderless bond, or an anisotropic conductive film or gel.
In an embodiment, a system is provided that includes a modular device that is configured to detect external signals or emit energy. The modular device includes a device array having at least one of electrical contacts or optical fiber ends. The system also includes a control device that is configured to receive data signals based on the external signals or transmit data signals to the modular device for emitting energy. The system also includes a cable assembly that is configured to communicatively couple the modular device to the control device and transmit data signals therethrough. The cable assembly includes a connector body having a mating side and channels extending through the mating side and the connector body. The cable assembly includes a plurality of communication lines that are disposed within corresponding channels of the connector body. The communication lines are at least one of wire conductors or optical fibers. The communication lines have respective end faces that are positioned proximate to the mating side to form at least a two-dimensional terminal array. The terminal array is aligned with and coupled to the device array of the modular device.
It is to be understood that the above description is intended to be illustrative, and not restrictive. For example, the above-described embodiments (and/or aspects thereof) may be used in combination with each other. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the various embodiments without departing from its scope. Dimensions, types of materials, orientations of the various components, and the number and positions of the various components described herein are intended to define parameters of certain embodiments, and are by no means limiting and are merely exemplary embodiments. Many other embodiments and modifications within the spirit and scope of the claims will be apparent to those of skill in the art upon reviewing the above description. The patentable scope should, therefore, be determined with reference to the appended claims, along with the full scope of equivalents to which such claims are entitled.
As used in the description, the phrase “in an exemplary embodiment” and the like means that the described embodiment is just one example. The phrase is not intended to limit the inventive subject matter to that embodiment. Other embodiments of the inventive subject matter may not include the recited feature or structure. In the appended claims, the terms “including” and “in which” are used as the plain-English equivalents of the respective terms “comprising” and “wherein.” Moreover, in the following claims, the terms “first,” “second,” and “third,” etc. are used merely as labels, and are not intended to impose numerical requirements on their objects. Further, the limitations of the following claims are not written in means—plus-function format and are not intended to be interpreted based on 35 U.S.C. §112(f), unless and until such claim limitations expressly use the phrase “means for” followed by a statement of function void of further structure.
The present application includes subject matter that is similar to subject matter described in U.S. application Ser. No. ______ (Attorney Docket No. MD-00620 (958-3099US)), which was filed on the same day as the present application and is entitled “PROBE ASSEMBLY AND SYSTEM INCLUDING A MODULAR DEVICE AND CABLE ASSEMBLY,” which is incorporated herein by reference in its entirety.
