Illustrative embodiments generally relate to phased array systems and, more particularly, various embodiments relate to layout of certain phased array systems.
Antennas that emit electronically steered beams are known in the art as “phased array antennas.” Such antennas are used worldwide in a wide variety of commercial applications. They typically are produced from many small radiating elements that are individually phase controlled to form a beam in the far field of the antenna. Among other things, phased array antennas are popular due to their ability to rapidly steer beams without requiring moving parts.
In accordance with one embodiment of the invention, a phased array system has a substrate, a plurality of elements, a plurality of beamforming ICs, and a plurality of feedlines electrically coupling the plurality of elements with at least one beamforming IC. In preferred embodiments, the feedlines are non-intersecting, symmetric feedlines that mitigate cross-polarization.
The feedlines to the at least one beamforming IC each also may have substantially the same lengths. Moreover, among other ways, the elements may be configured as a triangular lattice or a rectangular lattice. In some embodiments, the beamforming IC has a first set of element interfaces and a second set of element interfaces. The first set of element interfaces may be configured to be polarized in a first polarization, while the second set of element interfaces may be configured to be polarized in a second polarization. To minimize cross-interference, the first polarization preferably is different from the second polarization (e.g., orthogonal).
As an example, the first element may have first and second locations for receiving two feedlines, and a second element has third and fourth locations for receiving two feedlines. The first and third locations may be configured to be at a first polarization (e.g., a horizontal polarization), while the second and fourth location may be configured to be at a different polarization (e.g., a vertical polarization). The first, second, third, and fourth locations preferably are colinear.
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
Those skilled in the art should more fully appreciate advantages of various embodiments of the invention from the following “Description of Illustrative Embodiments,” discussed with reference to the drawings summarized immediately below.
The satellite communication system may be part of a cellular network operating under a known cellular protocol, such as the 3G, 4G, or 5G protocols. Accordingly, in addition to communicating with satellites, the system may communicate with earth-bound devices, such as smartphones or other mobile devices, using any of the 3G, 4G, or 5G protocols. As another example, the satellite communication system may transmit/receive information between aircraft and air traffic control systems. Of course, those skilled in the art may use the AESA system 10 (implementing the noted phased array 10A) in a wide variety of other applications, such as broadcasting, optics, radar, etc.
Some embodiments may be configured for non-satellite communications and instead communicate with other devices, such as smartphones (e.g., using 4G or 5G protocols). Accordingly, discussion of communication with orbiting satellites 12 is not intended to limit all embodiments of the invention.
Specifically, the AESA system 10 of
Indeed, the array shown in
In a similar manner, those skilled in the art can apply various embodiments to smaller phased arrays 10A.
As a patch array, the elements 18 have a low profile. Specifically, as known by those skilled in the art, a patch antenna (i.e., the element 18 or the transmission/receiving part of the element) typically is mounted on a flat surface and includes a flat rectangular sheet of metal (known as the patch and noted above) mounted over a larger sheet of metal known as a “ground plane.” A dielectric layer between the two metal regions electrically isolates the two sheets to prevent direct conduction. When energized, the patch and ground plane together produce a radiating electric field and/or receive RF signals.
As noted above and discussed in greater detail below, illustrative embodiments form the patch antennas on one or more printed circuit boards that themselves are coupled with the printed circuit board 16. These patch antennas preferably are formed using standard printed circuit board fabrication processes, thus complying with standard printed circuit board design rules (discussed below). Accordingly, using such fabrication processes, each element 18 in the phased array 10A should have a very low profile.
The phased array 10A can have one or more of any of a variety of different functional types of elements 18. For example, the phased array 10A can have transmit-only elements 18, receive-only elements 18, and/or dual mode receive and transmit elements 18 (referred to as “dual-mode elements 18”). The transmit-only elements 18 are configured to transmit outgoing signals (e.g., burst signals) only, while the receive-only elements 18 are configured to receive incoming signals only. In contrast, the dual-mode elements 18 are configured to either transmit outgoing burst signals, or receive incoming signals, depending on the mode of the phased array 10A at the time of the operation. Specifically, when using dual-mode elements 18, the phased array 10A can be in either a transmit mode, or a receive mode. The noted controller 24 at least in part controls the mode and operation of the phased array 10A, as well as other array functions.
The AESA system 10 has a plurality of the above noted integrated circuits 14 (mentioned above with regard to
Each integrated circuit 14 preferably is configured with at least the minimum number of functions to accomplish the desired effect. Indeed, integrated circuits 14 for dual mode elements 18 are expected to have some different functionality than that of the integrated circuits 14 for the transmit-only elements 18 or receive-only elements 18. Accordingly, integrated circuits 14 for such non-dual-mode elements 18 typically have a smaller footprint than the integrated circuits 14 that control the dual-mode elements 18. Despite that, some or all types of integrated circuits 14 fabricated for the phased array 10A can be modified to have a smaller footprint.
As an example, depending on its role in the phased array 10A, each integrated circuit 14 may include some or all of the following functions:
Indeed, some embodiments of the integrated circuits 14 may have additional or different functionality, although illustrative embodiments are expected to operate satisfactorily with the above noted functions. Those skilled in the art can configure the integrated circuits 14 in any of a wide variety of manners to perform those functions. For example, the input amplification may be performed by a low noise amplifier, the phase shifting may use conventional active phase shifters, and the switching functionality may be implemented using conventional transistor-based switches.
Each integrated circuit 14 preferably operates on at least one element 18 in the array. For example, one integrated circuit 14 can operate on two or four different elements 18. Of course, those skilled in the art can adjust the number of elements 18 sharing an integrated circuit 14 based upon the application. For example, a single integrated circuit 14 can control two elements 18, three elements 18, five elements 18, six elements 18, seven elements 18, eight elements 18, etc., or some range of elements 18. Sharing the integrated circuits 14 between multiple elements 18 in this manner reduces the required total number of integrated circuits 14, correspondingly sometimes enabling a reduction in the required size of the printed circuit board 16.
As noted above, the dual-mode elements 18 may operate in a transmit mode, or a receive mode. To that end, the integrated circuits 14 may generate time division diplex or duplex waveforms so that a single aperture or phased array 10A can be used for both transmitting and receiving. In a similar manner, some embodiments may eliminate a commonly included transmit/receive switch in the side arms of the integrated circuit 14. Instead, such embodiments may duplex at the element 18. This process can be performed by isolating one of the elements 18 between transmit and receive by an orthogonal feed connection.
RF interconnect, through-vias, and/or beam forming lines 26 electrically connect the integrated circuits 14 to their respective elements 18. To further minimize the feed loss, illustrative embodiments mount the integrated circuits 14 as close to their respective elements 18 as possible. Specifically, this close proximity preferably reduces RF interconnect line lengths, reducing the feed loss. To that end, each integrated circuit 14 preferably is packaged either in a flip-chipped configuration using wafer level chip scale packaging (WLCSP), or a traditional package, such as quad flat no-leads package (QFN package). While other types of packaging may suffice, WLCSP techniques are preferred to minimize real estate on the substrate 16A. Some embodiments may mount some or all of the integrated circuits 14 on or within the printed circuit boards forming the elements 18. Other embodiments may mount some or all of the integrated circuits 14 on the underlying routing substrate board 16.
In addition to reducing feed loss, using WLCSP techniques reduces the overall footprint of the integrated circuits 14, enabling them to be mounted on the top face of the printed circuit board 16 with the elements 18—providing more surface area for the elements 18. Other embodiments mount the integrated circuits 14 of one side and the elements 18 on the other side.
It should be reiterated that although
Each dual transmit/receive integrated circuit preferably has separate transmit and receive interfaces for each element it controls. For example, if a given integrated circuit controls two elements, it has a first pair of transmit and receive interfaces for the first element, and a second pair of transmit and receive interfaces for the second element. Each transmit interface and receive interface on an integrated circuit respectively couples to corresponding transmit and receive interfaces on one of the elements. To provide signal isolation, the two interfaces on each element are polarized out of phase with each other. For example, a given element's transmit interface may be about 90 degrees out of phase with its receive interface.
More specifically, as shown in
In illustrative embodiments, the number of point A excited elements is substantially equal to the number of elements excited by point C; and the number of elements excited by point B are substantially equal to the number of element excited by point D. Accordingly, cross-polarization effectively is canceled by having equal number of positive and negative excitation of array elements; improving the cross-polarization of the entire array.
In general, illustrative embodiments relate to an antenna array where each antenna element can radiate energy into two perpendicular polarizations by coupling to two-points A and B with positive excitation, or C and D with negative phase excitation, but resulting in the same polarization. That is, polarization is the same when C (or D) is excited by a negative phase in comparison to phase at A (or B), but with same amplitude (
Two pairs of antenna elements are connected together with a transmission line by connecting A-to-A and B-to-B of each antenna (called the positive pair) and by connecting C-to-C and D-to-D (called the negative pair), respectively. The connecting transmission line has a center location referred to as “AA/BB” for the positive pair and “CC/DD” for the negative pair. In general, AA, BB, CC, and DD are not collinear for a given antenna array arrangement. This arrangement, in general, is known in the art as a “split feed arrangement,” where two elements are connected to the same RF source through a common excitation point, e.g., the correct phase of signal is connected at AA, BB, CC, and DD in
To physically align AA, BB, CC, and DD, segments of connecting line lenA, lenB, lenC, and lenD are added to AA, BB, CC, and DD (
Specifically, the embodiment shown in
Therefore, as shown in
Thus, for example, to achieve IC routing symmetry, scan performance, and cross polarization level (including non-linear polarization) all at once, the asymmetry property in a phase reversal arrangement can be neutralized by the asymmetry in the triangular lattice (e.g., a quasi-triangular lattice that is a lattice based on a regular triangle but not an isosceles triangle). The antenna columns or rows can be shifted vertically and/or horizontally, respectively, by a length that can align the phase reversed feed locations of the same polarization to the same horizontal or vertical line, respectively. In this way, optimal IC routing can be enabled on the RF output routing to the antennas and the optimal input routing of the IC can be enabled in a rectangular lattice, while antenna lattice can be non-rectangular, e.g., triangular like. In one embodiment of a slant polarization split feed element, this alignment can be done by shifting the elements by half of “s,” e.g., as shown in
The embodiments of the invention described above are intended to be merely exemplary; numerous variations and modifications will be apparent to those skilled in the art. Such variations and modifications are intended to be within the scope of the present invention as defined by any of the appended innovations.
This patent application is a continuation of U.S. patent application Ser. No. 17/716,625 entitled ARRAY LATTICE TECHNIQUES FOR HIGH SYMMETRY AND HIGH SCAN PERFORMANCE filed Apr. 8, 2022, which claims the benefit of U.S. Provisional Patent Application No. 63/173,120 entitled ARRAY LATTICE TECHNIQUES FOR HIGH SYMMETRY AND HIGH SCAN PERFORMANCE filed Apr. 9, 2021, which is hereby incorporated herein by reference in its entirety.
Number | Date | Country | |
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63173120 | Apr 2021 | US |
Number | Date | Country | |
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Parent | 17716625 | Apr 2022 | US |
Child | 18601689 | US |