The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. For ease of illustration, separations and brackets in the figures indicate that the precise thickness of the semiconductor die is not claimed.
The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. For ease of illustration, separations and brackets in the figures indicate that the precise thickness of the semiconductor die is not claimed.
Number | Name | Date | Kind |
---|---|---|---|
3357544 | Gingher | Dec 1967 | A |
3390502 | Carroll | Jul 1968 | A |
D233898 | Warren | Dec 1974 | S |
D330325 | Kocon | Oct 1992 | S |
D356033 | Horvat | Mar 1995 | S |
D356705 | Aston | Mar 1995 | S |
D411261 | Movsesian | Jun 1999 | S |
D516670 | Aselton | Mar 2006 | S |
D537048 | Mitsui | Feb 2007 | S |
D543160 | Mitsui | May 2007 | S |
D568839 | Mitsui | May 2008 | S |
D635622 | Martin | Apr 2011 | S |
D688736 | Lilly | Aug 2013 | S |
D720310 | Sharma | Dec 2014 | S |
Number | Date | Country | |
---|---|---|---|
Parent | 29441116 | Dec 2012 | US |
Child | 29456725 | US |