Array of triangular semiconductor dies

Information

  • Patent Grant
  • D739363
  • Patent Number
    D739,363
  • Date Filed
    Monday, December 31, 2012
    11 years ago
  • Date Issued
    Tuesday, September 22, 2015
    8 years ago
  • US Classifications
    Field of Search
    • US
    • D13 110
    • D13 182
    • D13 184
    • 361 679010
    • 361 728000
    • 361 761000
    • 361 820000
    • 361 718000
    • 361 764000
    • 361 748000
    • 361 752000
    • 361 783000
    • 257 668000
    • 257 678000
    • 257 684000
    • 324 071500
    • 324 252000
    • 029 825000
    • 029 829000
    • 029 830000
    • 029 831000
    • 029 832000
    • 029 846000
    • 174 068100
    • 174 250-261
    • 174 268000
    • 216 013000
    • 428 901000
  • International Classifications
    • 1303
    • Term of Grant
      14Years
Abstract
Description


FIG. 1 is a top plan view of a first embodiment of an array of triangular semiconductor dies showing our new design;



FIG. 2 is a front perspective view thereof;



FIG. 3 is a rear perspective view thereof;



FIG. 4 is a top plan view of a second embodiment of an array of triangular semiconductor dies showing our new design;



FIG. 5 is a front perspective view thereof;



FIG. 6 is a rear perspective view thereof;



FIG. 7 is a top plan view of a third embodiment of an array of triangular semiconductor dies showing our new design;



FIG. 8 is a front perspective view thereof;



FIG. 9 is a rear perspective view thereof;



FIG. 10 is a top plan view of a fourth embodiment of an array of triangular semiconductor dies showing our new design;



FIG. 11 is a front perspective view thereof;



FIG. 12 is a rear perspective view thereof;



FIG. 13 is a top plan view of a fifth embodiment of an array of triangular semiconductor dies showing our new design;



FIG. 14 is a front perspective view thereof; and,



FIG. 15 is a rear perspective view thereof.


The broken lines in the figures represent unclaimed subject matter and form no part of the claimed design. The triangular semiconductor dies is shown broken away in FIGS. 1-15 to indicate that no particular length is claimed.


Claims
  • The ornamental design for an array of triangular semiconductor dies, as shown and described.
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Continuations (1)
Number Date Country
Parent 13357578 Jan 2012 US
Child 29441116 US
Continuation in Parts (1)
Number Date Country
Parent 13163482 Jun 2011 US
Child 13357578 US