The present application relates to the field of display technology and, in particular, to an array substrate and a display panel.
With the development of display technology, display panels are increasingly widely used, and accordingly, the requirements for the display panels are also increasing.
A display panel generally includes pixel circuits and light-emitting elements. The pixel circuits drive the light-emitting elements to emit light, implementing the function of image display. A pixel circuit includes thin-film transistors. However, the existing thin-film transistors have unstable characteristics, affecting the display effect of the display panel.
The present application provides an array substrate and a display panel to improve the display effect of the display panel.
According to an aspect of the present application, an array substrate is provided. The array substrate includes a substrate, a compensation layer, an insulating layer and an active layer. The compensation layer is disposed on a side of the substrate. The insulating layer is disposed on a side of the compensation layer away from the substrate and covers the compensation layer. The active layer is disposed on a side of the insulating layer away from the substrate. A vertical projection of the compensation layer on the substrate overlaps a vertical projection of the active layer on the substrate, and the compensation layer is configured to compensate for a threshold voltage of a thin-film transistor of the array substrate.
According to another aspect of the present application, a display panel is provided. The display panel includes the array substrate provided in any embodiment of the present application. A pixel circuit is disposed on the array substrate.
The array substrate provided in the embodiment of the present application includes the substrate and the compensation layer and the active layer which are disposed on a side of the substrate. The compensation layer is disposed between the substrate and the active layer and is covered by the insulating layer. The vertical projection of the compensation layer on the substrate overlaps the vertical projection of the active layer on the substrate. According to the embodiment of the present application, the compensation layer is disposed in the thin-film transistor to block at least a part of the active layer, thereby avoiding the attack by some electrons or holes on the active layer and preventing electrons or holes from acting on the active layer and thus affecting a threshold voltage of the thin-film transistor. In this manner, positive bias temperature stress (PBTS) or negative bias temperature stress (NBTS) of the thin-film transistor is improved, which is conducive to improving the display effect of the display panel including the thin-film transistor.
It is to be understood that the content described in this section is neither intended to identify key or critical features of the embodiments of the present application nor intended to limit the scope of the present application. Other features of the present application become easily understood through the description provided hereinafter.
To illustrate embodiments of the present application more clearly, drawings used in description of the embodiments are described simply hereinafter. Apparently, the drawings described hereinafter illustrate part of embodiments of the present application, and those of ordinary skill in the art may obtain other drawings according to the drawings described hereinafter on the premise that no creative work is done.
To make embodiments of the present disclosure better understood by those skilled in the art, the embodiments of the present application will be described clearly and completely in conjunction with the drawings of the embodiments of the present application. Apparently, the embodiments described below are part, not all, of embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by those of ordinary skill in the art without creative work are within the scope of the present application.
It is to be noted that terms “first”, “second” and the like in the description, claims and drawings of the present application are used for distinguishing between similar objects and are not necessarily used for describing a particular order or sequence. It is to be understood that data used in this manner is interchangeable in appropriate cases so that the embodiments of the present application described herein can also be implemented in an order not illustrated or described herein. In addition, terms “comprising”, “including” and any other variations thereof are intended to encompass a non-exclusive inclusion.
As described in the background, thin-film transistors in the related art have unstable characteristics, which can easily affect the display effect of the display panel. It is found that the reason for the preceding situation is that, when the pixel circuit formed by the thin-film transistor and the thin-film transistor is used for the turning-on or turning-off function, the PBTS or the NBTS of the thin-film transistor has a greater impact on the display quality and the display effect, which easily causes phenomena such as image sticking, low-frequency flickering or greenish images. During normal display, it is expected that the absolute value of PBTS or NBTS of the thin-film transistors is relatively small so that the display effect is improved. However, in the manufacturing process of the thin-film transistor, the gate pattern of the thin-film transistor cannot completely cover the pattern of the active layer, resulting in an unblocked region of the pattern of the active layer. This unblocked region is easily affected by electrons and holes, causing a drift in the threshold characteristics of the thin-film transistor, resulting in the relatively large absolute value of PBTS or NBTS of the thin-film transistor, seriously affecting the image quality and reducing the display effect.
For the preceding situation, an embodiment of the present application provides an array substrate including a thin-film transistor to alleviate the threshold drift phenomenon of the thin-film transistor and reduce the PBTS or NBTS of the thin-film transistor.
Specifically, the substrate 10 serves as a support to support the thin-film transistor. A gate layer 21 is further disposed on the substrate 10. The gate layer 21 is configured to form a gate electrode of the thin-film transistor. The gate layer 21 is disposed opposite the active layer 202. For example, as shown in
Of course, the gate layer 21 may also be disposed below the active layer 202.
In the embodiment, the compensation layer 201 is disposed on the substrate 10, and the compensation layer 201 is disposed on the side of the active layer 202 close to the substrate 10. Regardless of whether the gate layer 21 is disposed above or below the active layer 202, the gate layer 21 is disposed on the side of the compensation layer 201 away from the substrate 10. The vertical projection of the compensation layer 201 on the substrate 10 at least partially overlaps the vertical projection of the active layer 202 on the substrate 10, that is, the compensation layer 201 can at least partially block the active layer 202, thereby blocking a part of the active layer 202 that is not blocked by the gate layer 21. Specifically, the vertical projection of the compensation layer 201 on the substrate 10 covers at least the non-overlapping portion which includes the first portion 202-A1 and the second portion 202-A2. For example, as shown in
It is to be understood that to better prevent the active layer 202 from being attacked by the accumulated electrons or holes in the substrate 10, the projection of the compensation layer 201 on the substrate should cover at least the part of the active layer 202 that is not blocked by the gate layer 21.
The array substrate provided in the embodiment of the present application includes the substrate and the compensation layer, the insulating layer and the active layer which are all disposed on a side of the substrate. The compensation layer is disposed between the substrate and the active layer and is covered by the insulating layer. The vertical projection of the compensation layer on the substrate overlaps the vertical projection of the active layer on the substrate. In the embodiment of the present application, the compensation layer is disposed in the array substrate to block at least a part of the active layer, thereby avoiding the attack by some electrons or holes on the active layer and preventing electrons or holes in the substrate from acting on the active layer and thus affecting the threshold voltage of the thin-film transistor. In this manner, the PBTS or NBTS of the thin-film transistor is improved, which is conducive to improving the display effect of the display panel including the thin-film transistor.
With continued reference to
In the embodiment, the substrate 10 may be a flexible substrate. For example, the substrate 10 may be made of the polyimide (PI) material. In the related art, since the gate layer 21 cannot completely block the active layer, under the act of the characteristics of the flexible material such as PI, fluoride ions in the substrate 10 can directly act on the active layer 202, affecting the electric field distribution inside the active layer 202, thereby causing the threshold voltage drift of the thin-film transistor. The compensation layer 201 is added to block the active layer 202, so that the impact of ions in the substrate 10 on the active layer 202 can be effectively blocked, and the drift of the threshold voltage of the thin-film transistor can be prevented.
Optionally, the material of the compensation layer 201 may be amorphous silicon or metal, which can effectively block ions or other electrons in the substrate 10 from entering the active layer 202, where the metal material may include titanium, molybdenum, aluminum or alloys thereof.
In the embodiment, if the material of the active layer 201 is metal, the compensation layer 201 may be connected to a compensation voltage so that an electric field is generated between the compensation layer 201 and the active layer 202. Through the electric field, the threshold voltage of the thin-film transistor is reversely biased so that the drift of the threshold voltage caused by electrons or holes is compensated for.
Specifically, in the embodiment, the material of the active layer 202 is a metal oxide, such as the indium gallium zinc oxide (IGZO). When electrons (such as fluorine ions) in the substrate 10 act on the IGZO active layer 202, the threshold voltage of the thin-film transistor will be negatively biased. A compensation voltage VDC is applied to the compensation layer 201, so that an electric field is formed between the compensation layer 201 and the active layer 202; the electric field distribution of the active layer 202 is adjusted through the electric field, and then the threshold voltage is adjusted to be biased to an opposite direction, so that the negative bias of the threshold voltage is compensated for.
In the embodiment, the compensation voltage VDC is a direct current negative voltage, and the voltage value may be set according to the thickness between the compensation layer 201 and the active layer 202. The threshold voltage of an IGZO thin-film transistor is a positive voltage. A negative voltage is applied to the compensation layer 201, so that the threshold voltage of the thin-film transistor can be positively biased, and thus the negative bias of the threshold voltage caused by electrons or holes is compensated for. In the specific implementation process, the threshold voltage of the thin-film transistor can be adjusted to around 0V through the direct current voltage VDC, so that the PBTS of the thin-film transistor is less than 1V and thus expectations are satisfied.
Compared to a Low Temperature Polycrystalline Silicon (LTPS) thin-film transistor, the difficulty of realizing an improving process of the uniformity of the threshold voltage of the IGZO thin-film transistor is big. The IGZO thin-film transistor is usually used as a switching transistor. The pixel circuit requires as little PBTS or NBTS of the switching transistor as possible to improve the display effect. In the embodiment, to ensure that electrons (fluorine ions) in the substrate 10 do not act on the active layer 202 (some electrons may enter the active layer 202 due to incomplete blocking), a direct current negative voltage is applied to the compensation layer 201 to positively bias the threshold voltage of the thin-film transistor, so that the negative bias of the threshold voltage caused by the impact of electrons on the active layer 202 is compensated for. Therefore, setting the compensation layer 201 can greatly reduce the difficulty of the process.
Specifically, if the compensation layer 201 is made of metal, to avoid the short circuit between the compensation layer 201 and the first gate layer 203, the insulating layer 20 is disposed between the compensation layer 201 and the first gate layer 203 to achieve the insulation purpose. In the embodiment, the first gate layer 203 may be a bottom gate of the thin-film transistor, and the second gate layer 204 may be a top gate of the thin-film transistor. Ion implantation is performed on the active layer 202, so that a source region and a drain region can be formed on two sides of the active layer 202 respectively, while a region where no ion is implanted forms a channel region. The second interlayer insulating layer 50 is disposed on a side of the second gate layer 204 away from the substrate 10. A source electrode is formed by leading out the source region through the source layer 301, and a drain electrode is formed by leading out the drain region through the drain layer 302 (the source layer 301 is the source electrode, and the drain layer 302 is the drain electrode). The first gate layer 203 is led out through a first connecting line 304, the second gate layer 204 is led out through a second connecting line 303, and the compensation layer 201 is led out through a third connecting line 305, so that the connection of the thin-film transistor is achieved through various connecting lines. The first gate layer 203 is a first gate electrode of the thin-film transistor, the second gate layer 204 is a second gate electrode of the thin-film transistor, and the compensation layer 201 is a compensation electrode of the thin-film transistor.
With continued reference to
With further continued reference to
In the embodiment, there is no limitation on the thickness between the compensation layer 201 and the active layer 202, and cases where the vertical projection of the compensation layer 201 on the substrate 10 overlaps the vertical projection of the active layer 202 on the substrate 10 are all within the scope of the present application.
Optionally,
The array substrate further includes a first electrode layer 401 and a second electrode layer 402. The first electrode layer 401 is disposed on a side of the first insulating sublayer 61 away from the substrate 10 and is covered by the second insulating sublayer 62, and the second electrode layer 402 is disposed on a side of the second insulating sublayer 62 away from the first insulating sublayer 61 and is covered by the third insulating sublayer 63. The first electrode layer 401 and the second electrode layer 402 are used for forming a storage capacitor, and the second insulating sublayer 62 may serve as a dielectric layer for the storage capacitor.
In the embodiment, the compensation layer 201 may be disposed between the substrate 10 and the first insulating sublayer 61. Of course, the compensation layer 201 may also be disposed between the second insulating sublayer 62 and the first insulating sublayer 61, or between the second insulating sublayer 62 and the third insulating sublayer 63. In other words, if the first gate layer 203 is disposed below the active layer 202, the compensation layer 201 may be disposed in any film layer below the first gate layer 203.
In the embodiment, if the compensation layer 201 is not connected to the compensation voltage VDC, the compensation layer 201 may also be used as the first electrode layer 401, and the first gate layer 203 may also be used as the second electrode layer 402, which is conducive to reducing the processes and lowering the process difficulty.
It is to be noted that other film layers, such as a buffer layer, may be included between the substrate 10 and the first gate layer 203, and these film layers are not shown in the figures. Without affecting the function of the array substrate, the compensation layer 201 may be disposed in any film layer below the first gate layer 203.
The blocking layer 70 may be disposed in any layer of the first insulating sublayer 61, the second insulating sublayer 62 and the third insulating sublayer 63 to achieve the light blocking function. For the specific working principle, reference may be made to relevant descriptions in the related art, and the specific working principle is not repeated here. In the embodiment, preferably, the blocking layer 70 may be disposed in the same layer as the compensation layer 201 so that the overall blocking effect on the array substrate is improved.
An embodiment of the present application further provides a display panel including the array substrate provided in any of the preceding embodiments. A pixel circuit is disposed on the array substrate, and the pixel circuit includes the thin-film transistor provided in any embodiment of the present application. The IGZO thin-film transistor is taken as an example. The IGZO thin-film transistor may be used as a threshold compensation transistor and an initialization transistor in the pixel circuit, which can reduce the leakage current in the pixel circuit. In the embodiment, the pixel circuit may be architectures such as 7TIC, 7T2C and 8T2C.
In the embodiment, the direct current voltage VDC connected to the IGZO transistor may be a power supply voltage VSS, or may be an initialization voltage Vref (including Vref1, Vref2 and Vref3) The power supply voltage VSS may be provided by a power supply line, and the initialization voltage Vref may be provided by an initialization signal line.
It is to be understood that various forms of processes shown above may be adopted with steps reordered, added or deleted. For example, the steps described in the present application may be performed in parallel, sequentially or in different sequences, as long as the desired results of the embodiment of the present application can be achieved, and no limitation is imposed herein.
The preceding embodiments do not limit the scope of the present application. It is to be understood by those skilled in the art that various modifications, combinations, sub-combinations and substitutions may be performed according to design requirements and other factors. Any modification, equivalent substitution, improvement or the like made within the spirit and principle of the present application is within the scope of the present application.
Number | Date | Country | Kind |
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202210819815.7 | Jul 2022 | CN | national |
This application is a continuation of International Application No. PCT/CN2022/130841, filed on Nov. 9, 2022, which claims priority to Chinese Patent Application No. 202210819815.7 filed with the China National Intellectual Property Administration (CNIPA) on Jul. 12, 2022, the disclosures of which are incorporated herein by reference in their entireties.
Number | Date | Country | |
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Parent | PCT/CN2022/130841 | Nov 2022 | WO |
Child | 18823923 | US |