Claims
- 1. An article consisting of:
- (A) a thermoplastic polymer substrate,
- (B) on at least one surface of said substrate a layer comprising rupturable microcapsules carrying a liquid therein and a binder resin adhering the microcapsules to the substrate,
- said substrate bearing said microcapsules being capable of softening sufficiently when exposed to heat to allow said microcapsules to become partially embedded in said surface by means of applied pressure, said microcapsules being sufficiently strong to avoid rupture when exposed to the heat and pressure required to soften said substrate and embed said microcapsules, said substrate further being capable of softening sufficiently so that the thermoplastic material of the polymeric substrate can flow sufficiently to allow the substrate to become bonded to porous objects.
- 2. The article of claim 1 wherien said softening occurs under temperature conditions of from about 100.degree. C. to about 250.degree. C. and said partial embedding occurs under pressure conditions of from about 0.5 psig to about 100 psig.
- 3. The article of claim 1 wherein said substrate is selected from the group consisting of polyolefin polymers and polyvinyl polymers.
- 4. The article of claim 1 wherein said microcapsules comprise gelatin.
- 5. The article of claim 4 wherein said microcapsules have an average diameter between about 3 and about 30 micrometers.
- 6. The article of claim 1 wherein said microcapsules comprise aminoplast resin.
- 7. The article of claim 6 wherein said microcapsules have an average diameter between about 3 and about 30 micrometers.
- 8. The article of claim 1 wherein said microcapsules have an average diameter between about 3 and about 30 micrometers.
Parent Case Info
This is a continuation of application Ser. No. 699,660 filed Feb. 8, 1985, now U.S. Pat. No. 4,654,256.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
4493869 |
Sweeny et al. |
Jan 1985 |
|
4528226 |
Sweeny |
Jul 1985 |
|
Continuations (1)
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Number |
Date |
Country |
Parent |
699660 |
Feb 1985 |
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