U.S. patent application Ser. No. 08/003,274, Holcombe et al, filed Jan. 12, 1993. |
Mailhot, et al., Proc. of the 15th Int'l Thermal Spray Conf., p. 1419 (May 25-29, 1998). |
Morvan, D. et al., Proc of the 15th Int'l Thermal Spray Conf., p. 511 (May 25-29, 1998). |
Heberlein, Jr. et al., Thermal Spray: A United Forum for Scientific and Technological Advances, p. 329 (1997). No Month. |
HV-2000 Brochure, Praxair Surface Technologies, Inc, N670 Communication Dr., Appleton, WI 54915, (920) 734-9292 (1997). No Month. |
Scandolo, S. et al., Phys. Rev. Let., 74:20, p. 40155 (1995). No Month. |
Neiser, R. A., et al., Proc. of the 1993 Thermal Spray Cont. p. 61 (Jun. 7-11, 1993). |
Erskine, D. J. and William, J. N., J. Appl. Phys. 71:10, p. 4882 (1992). No Month. |
Canham, L. T., Appl. Phys. Let., 57:10, p. 1046 (1990). No Month. |
Kowalsky, K. A., et al., Thermal Spray Res. and App., Proc. of the 3rd Nat. Thermal Spray Conf., p. 587 (May 20-25, 1990). |
Pirouz, P. et al., Mater, 38:2, p. 313 (1990). No Month. |
Hanfland, M., et al., Phys. Rev. B, 39:17, p. 39 (1989). No Month. |
Stiffler S. R. and Thompson M.O., Phys.I Rev. Let., 60:24, p. 2519 (1988). No Month. |
Besson J. M., et al., Phys. Rev. Let. 59:4, p. 473 (1987). No Month. |
Zhao et al., Solid State Comm., 59:10, p. 679 (1986). No Month. |
Shaner, J. W., et al., Jour. de Physique, 45, p. C8-235 (1984). No Month. |
Gust, W. H. and Royce E. B., J. of Appl. Phys., 42:5, p. 1897 (1971). No Month. |
DPV-2000 Brochure, Technar Automation LTEE, 3502 First Street, St. Hubert, Quebec, Canada J3Y 8Y5, (450) 443-5335, <http://tecnar-automation.com>. (No Date). |
Wentorf, R. H., “Diamond”, Bever, M. B. ed., Encyclopedia of Materials Science and Engineering, vol. 2., The Pergamon Press and The MIT Press, Oxford, p. 1139 (No Date). |
Goswami et al., “Shock Synthesis of Nanocrystalline Si by Thermal Spraying,” J. Mater. Res., vol. 14, No. 9, pp. 3489-3492 (1999) No Month. |