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The subject matter described herein relates to artificial magnetic conductors. More particularly, the disclosure relates to artificial magnetic conductors which are tunable to one or desired resonance frequencies.
Artificial magnetic conductors (AMCs) are surface treatments that control the phase of reflection of an incident electromagnetic wave. AMCs are characterized by a resonant frequency, fres, at which where the phase of reflection is 0 degrees, and by their ±90 degrees bandwidth in which the reflected phase lies between −90 and +90 degrees. In general, AMCs may be constructed by applying a capacitive metallic grid on top of a dielectric substrate with a ground plane. The size of the grid and its period scales with the resonant frequency. The bandwidth scales with substrate thickness. Thus, as the target resonant frequency decreases, the grid period and the substrate thickness increases proportionately in order to maintain the same bandwidth.
To implement AMCs with sufficient and practical bandwidth at lower frequencies, such as in the VHF band (30-300 MHz) and in the lower end of the UHF band (300 MHz-3 GHz), the size of the structure must be scaled proportionally. By way of example, a 10 GHz AMC may be fabricated using relatively thin (e.g., 0.025-0.050″ thick) substrates of standard electronic circuit board material. By contrast, a VHF AMC requires substrate thickness between 0.500 to 1.00 inches, or even greater. Therefore, using standard electronic substrates is prohibitive for practical application because of availability, cost and weight. For example, a 1.00 inch thick AMC using Rogers Corp. 3010 substrate material will weigh more than 7.08 kg per square foot. Also, standard circuit board substrates have permittivity typically 2.0 or more. The higher the substrate permittivity, the lower the bandwidth of the AMC because the capacitance between the grid and the ground planes is proportional to the substrate permittivity.
Therefore, apparatus and methods to form AMCs capable of implementing relatively low-frequency (e.g., VHF and UHF band) communication may find utility.
In various aspects, artificial magnetic conductor assemblies are disclosed. In one embodiment an artificial magnetic conductor assembly to reflect an electromagnetic signal with a phase shift that measures between −90 degrees and +90 degrees at a target frequency comprises a first ground plane, a plurality of metallic elements disposed at a first distance from the first ground plane, a plurality of capacitors coupling adjacent metallic elements of the plurality of metallic elements, and a dielectric substrate disposed between the first ground plane and the array of metallic elements and formed from a material having a relative permittivity that measures between 1 and 20.
In another embodiment, an artificial magnetic conductor assembly to reflect an electromagnetic signal with a phase shift that measures between −90 degrees and +90 degrees at a target frequency comprises a first ground plane and a second ground plane disposed adjacent the first ground plane, a plurality of metallic elements disposed at a first distance from the first ground plane, and a plurality of variable capacitors electrically coupled to the first ground plane and the second ground plane.
In yet another embodiment, an aircraft, comprises a fuselage, an antenna assembly, and an artificial magnetic conductor assembly to reflect an electromagnetic signal with a phase shift that measures between −90 degrees and +90 degrees at a target frequency. The artificial magnetic conductor assembly comprises a first ground plane and a second ground plane disposed adjacent the first ground plane, a plurality of metallic elements disposed at a first distance from the first ground plane a first plurality of variable capacitors electrically coupled to the first ground plane, and a second plurality of variable capacitors electrically coupled to the second ground plane, wherein the first ground plane comprises a plurality of holes through which vias from the second ground plane pass, and at least one shunt capacitor coupled to the first ground plane and to at least one of the plurality of vias.
The features, functions and advantages discussed herein can be achieved independently in various embodiments described herein or may be combined in yet other embodiments, further details of which can be seen with reference to the following description and drawings.
The detailed description is described with reference to the accompanying figures.
Described herein are exemplary artificial magnetic conductor (AMC) assemblies and aircraft comprising such assemblies. Such artificial magnetic conductor assemblies may be useful, e.g., in providing low-profile antenna structures which may be mounted on a vehicle such as, e.g., an aircraft or the like. Further described herein are methods to make an AMC that operates in the UHF and VHF frequency range without having to use costly and heavy substrates. Also described are methods to make a tunable AMC with multiple ground planes for biasing tunable capacitors without the detriment caused by RF leakage from the bias lines between the ground planes.
In the following description, numerous specific details are set forth to provide a thorough understanding of various embodiments. However, it will be understood by those skilled in the art that the various embodiments may be practiced without the specific details. In other instances, well-known methods, procedures, components, and circuits have not been illustrated or described in detail so as not to obscure the particular embodiments.
Referring to
As illustrated in
Adjacent metallic elements 150 may be capacitively coupled by capacitors 160. In the embodiment depicted in
Capacitors 160 can take a variety of forms, including microelectromechanical capacitors, plunger-type actuators, thermally activated bimetallic plates, or any other device for effectively varying the capacitance between a pair of capacitor plates. In some embodiments variable capacitors 160 may be implemented as junction tuning varactor diodes, which are a type of solid state diode which has a variable capacitance that is a function of the voltage impressed on its terminals By varying the capacitance applied to the metallic elements at different locations on the matrix of metallic elements 150 a location-dependent reflection phase results. Thus, a tunable, high-impedance reflective surface is provided.
In some embodiments, the assembly 100 may be tuned to 300 MHz by using capacitors 160 having a capacitance between 1 and 100 picoFarads (pF). In some embodiments, the capacitors 160 may be implemented as variable capacitors (e.g., varactors) that have a capacitance which ranges from 1 to 100 pF in order to tune the assembly 100 to a range from 50 to 1000 MHz.
Having described the metallic layer of the assembly 100, additional details about the structure of the assembly 100 will be described with reference to
In embodiments in which the capacitors 160 comprises variable capacitors, a first plurality of the metallic elements 150 are electrically coupled to the first ground plane 110 by vias 162, and a second plurality of the metallic elements 150 are electrically coupled to the second ground plane 120 by vias 164. In practice, the metallic elements 150 may be coupled to the first ground plane 110 and the second ground plane 120 in an alternating fashion. The first ground plane 110 and the second ground plane 120 are coupled to a voltage controller 180, which applies a bias voltage to the metallic elements 150 via the first ground plane 110 and the metallic elements 150 coupled to the second ground plane 120, thereby generating a voltage differential across the variable capacitors 160. The bias voltage generated by the voltage controller 180 may be adjusted to tune the artificial magnetic conductor assembly 100 to a predetermined resonance frequency.
Referring now to
Thus, having described aspects of the structure of an artificial magnetic conductor assembly 100, attention will now be turned to the operation of the assembly 100. In operation, an artificial magnetic conductor assembly 100 may be coupled to a voltage controller 180 as indicated in
Reference in the specification to “one embodiment” or “some embodiments” means that a particular feature, structure, or characteristic described in connection with the embodiment is included in at least an implementation. The appearances of the phrase “in one embodiment” in various places in the specification may or may not be all referring to the same embodiment.
Although embodiments have been described in language specific to structural features and/or methodological acts, it is to be understood that claimed subject matter may not be limited to the specific features or acts described. Rather, the specific features and acts are disclosed as sample forms of implementing the claimed subject matter.
Number | Name | Date | Kind |
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6262498 | Leiber | Jul 2001 | B1 |
6323826 | Sievenpiper | Nov 2001 | B1 |
6426722 | Sievenpiper | Jul 2002 | B1 |
6433756 | Sievenpiper | Aug 2002 | B1 |
6483480 | Sievenpiper | Nov 2002 | B1 |
6483481 | Sievenpiper | Nov 2002 | B1 |
6496155 | Sievenpiper | Dec 2002 | B1 |
6538621 | Sievenpiper | Mar 2003 | B1 |
6774866 | McKinzie et al. | Aug 2004 | B2 |
7023386 | Habib et al. | Apr 2006 | B2 |
7420524 | Werner et al. | Sep 2008 | B2 |
7612718 | Sievenpiper | Nov 2009 | B2 |
7639207 | Sievenpiper | Dec 2009 | B2 |
8134521 | Herz et al. | Mar 2012 | B2 |
8212739 | Sievenpiper | Jul 2012 | B2 |
20090109121 | Herz et al. | Apr 2009 | A1 |
Number | Date | Country |
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2003298464 | Oct 2003 | JP |
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