Patent Application
20180268962
The present invention relates to an assembled wire, which is composed by stacking a plurality of rectangular metallic bodies, and which is mainly intended for a high-frequency application; and further the present invention relates to a method of producing the same, and an electrical equipment using the same.
In general, the high-frequency rectangular wire is used for coils, and the like, of the AC motor and the high-frequency electrical equipment. This is also applied to motors for a high-speed railroad vehicle, in addition to motors for a hybrid vehicle (HV) and an electric vehicle (EV). Conventional rectangular wires are composed by stacking rectangular metallic bodies each having a rectangular shape of a cross-section and an insulating enamel coating or oxide coating formed on the outer periphery of the rectangular metallic body. Further, as rectangular wires without any enamel coating, there are known those which are composed by stacking rectangular metallic bodies each having a rectangular cross-section and having a bonding thermosetting resin coating or an oxide coating formed on the outer periphery thereof. For example, there is disclosed an assembled conductor having an adhesion layer of an insulating thermosetting resins interposed between conductors (for example, see Patent Literature 1). Further, there is disclosed a rectangular wire, which is composed by stacking rectangular metallic conductors having an oxide coating formed on the outer periphery of the conductor and by covering the stacked conductor bodies with an insulating layer (for example, see Patent Literature 2).
Patent Literature 1: JP-A-2008-186724 (“JP-A” means unexamined published Japanese patent application)
In the conventional high-frequency rectangular wires, which are composed by stacking a plurality of rectangular metallic bodies having an insulating enamel coating formed on the outer periphery thereof, high-frequency property is developed by stacking the rectangular metallic conductors. However, the enamel coating remains as soot, at the welding step in assembling of a motor. As a result, the soot made it difficult to rigidly weld. Further, in the rectangular wire without any enamel coating, a good weldability can be obtained. However, there was room for improvement in adhesiveness between each of the rectangular metallic conductors in the bending work.
The present invention is contemplated for allowing a rigid welding while satisfying high-frequency property, and for securing adhesiveness between a conductor strand and an insulating outer layer stacked on the conductor. Further, the present invention is contemplated for providing an assembled wire improved in bending workability, a method of producing the same, and an electrical equipment using the same.
The above-described problems of the present invention are solved by the following means:
(1) An assembled wire, comprising: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; and an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and further comprising: an adhesion layer composed of a thermoplastic resin having a thickness of 3 μm or more and 10 μm or less between the assembled conductor and the insulating outer layer.
(2) The assembled wire as described in the item (1), wherein the adhesion layer is composed of a thermoplastic resin having a tensile modulus at 250° C. of 10 MPa or more and 1,000 MPa or less.
(3) The assembled wire as described in the item (1) or (2), wherein the adhesion layer is composed of: an amorphous resin having a glass transition temperature of 200° C. or more and 300° C. or less; or a thermoplastic resin having a melting point of 250° C. or more and 350° C. or less.
(4) The assembled wire as described in any one of the items (1) to (3), wherein the adhesion layer is composed of a resin selected from the group consisting of polyetherimide (PEI), polyethersulfone (PES), and polyphenyl sulfone (PPSU).
(5) The assembled wire as described in any one of the items (1) to (4), wherein the adhesion layer is comprised of a single layer or a plurality of layers (multi-layers).
(6) The assembled wire as described in any one of the items (1) to (5), wherein the interlayer insulating layer is composed of a thermoplastic resin having a melting point of 250° C. or more and 350° C. or less.
(7) The assembled wire as described in any one of the items (1) to (6), wherein the interlayer insulating layer is composed of a resin selected from the group consisting of polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyamide 6T (PA6T), and polyamide 9T (PA9T).
(8) The assembled wire as described in any one of the items (1) to (7), wherein the interlayer insulating layer is composed of a thermoplastic resin having a melting point of 270° C. or more.
(9) The assembled wire as described in any one of the items (1) to (8), wherein the interlayer insulating layer is composed of a resin selected from the group consisting of polyphenylenesulfide (PPS), polyetheretherketone (PEEK), modified polyetheretherketone (modified PEEK), and thermoplastic polyimide.
(10) The assembled wire as described in any one of the items (1) to (9), wherein the number of stacked layers of conductor strands is two layers or more and six layers or less.
(11) A method of producing an assembled wire, comprising:
a step of forming an assembled conductor, by stacking, in a thickness direction, each of conductor strands having a rectangular cross-section and having an interlayer insulating layer of a thermoplastic resin of an amorphous resin having no melting point or a thermoplastic resin of a crystalline resin having an amide bond, formed on one side thereof by performing bake-finishing;
a step of coating an adhesion layer of a thermoplastic resin on the outer periphery of the assembled conductor; and
a step of coating an insulating outer layer on the outer periphery of the adhesion layer,
wherein, before coating the insulating outer layer, an adhesion layer, which has a thickness of 3 μm or more and 10 μm or less, is formed on the outer periphery of the assembled conductor.
(12) An electrical equipment, having wirings,
wherein at least a part of the wirings comprises: an assembled conductor composed of a plurality of conductor strands each having a rectangular cross-section, stacked and arranged each other across an interlayer insulating layer; and an insulating outer layer that coats the assembled conductor including the interlayer insulating layer; and further comprises: an adhesion layer composed of a thermoplastic resin having a thickness of 3 μm or more and 10 μm or less between the assembled conductor and the insulating outer layer.
The assembled wire of the present invention has an interlayer insulating layer between stacked conductor strands. Further, an insulating outer layer is formed on the outer periphery of the stacked conductor strands through an adhesion layer of a thermoplastic resin. This allows suppression of high-frequency loss. With this, by the lack of weld-generated soot, a rigid weld is enabled and an easier weld can be achieved in combination with the rigid weld. Further, with the adhesion layer, adhesiveness between an insulating outer layer and an assembled conductor is enhanced, and thereby a bending workability of the assembled wire can be enhanced.
The method of producing an assembled wire according to the present invention allows provision of production of an assembled wire which exhibits an excellent high-frequency property, ease of welding and bending work.
The electrical equipment of the present invention exhibits an excellent high-frequency property, together with a high reliance of wire jointing because the assembled wire of the present invention is excellent in welding property and bending work.
Other and further features and advantages of the invention will appear more fully from the following description, appropriately referring to the accompanying drawings.
Each of
Each of
With regard to the assembled wire of the present invention, one of preferable embodiments is described with reference to
As shown in
The conductor strand 11 of the above-described assembled wire 1 has a rectangular cross-section and those used in the conventional assembled wires (rectangular wires) can be used. The above-described rectangular cross-section means a rectangle-shaped cross-section and includes those having a round at a corner of the rectangle. Preferred examples of the conductor strand 11 include conductors of a low-oxygen copper whose oxygen content is 30 ppm or less, or an oxygen-free copper. In a case where the conductor strand 11 is melted by heat for the purpose of welding if the oxygen content is low, voids caused by contained oxygen are not occurred at a welded portion, the deterioration of the electrical resistance of the welded portion can be prevented, and the strength of the welded portion can be secured.
In the interlayer insulating layer 12 between the two conductor strands 11, a thermoplastic resin having a melting point of 250° C. or more and 350° C. or less is used. If the melting point of the interlayer insulating layer 12 is too low, electric characteristics in the heat resistance test get worse. On the other hand, if the melting point of the interlayer insulating layer 12 is too high, there is a possibility that the interlayer insulating layer remains not to be fully melted on the occasion of weld and thereby weldability gets worse. The interlayer insulating layer 12 is selected from the group consisting of polyethylene terephthalate, polyethylene naphthalate, polyamide 6T, and polyamide 9T. The polyethylene terephthalate (PET) has a melting point of 252° C., and the polyethylene naphthalate (PEN) has a melting point of 265° C. The polyamide 6T (PA6T) has a melting point of 320° C., and the polyamide 9T (PA9T) has a melting point of 300° C.
The interlayer insulating layer 12 is an insulating layer for preventing contact between the two conductor strands 11, and is formed between opposing sides of the two conductor strands 11.
The adhesion layer 13 has a tensile modulus whereby, when the assembled wire 1 is subjected to bending work, a stacking condition of the two conductor strands 11 can be maintained without any misalignment. The tensile modulus at 250° C. of the adhesion layer 13 is 10 MPa or more and 1,000 MPa or less, preferably 50 MPa or more and 500 MPa or less, and more preferably 100 MPa or more and 200 MPa or less. The tensile modulus is a value obtained by dividing a tensile stress to which a material is subjected within the limitation of elasticity by a distortion caused in the material. With an increase in this value, the deformation of an assembled wire 1 against a burden on the assembled wire 1 becomes smaller. If the tensile modulus is too low, when the assembled wire 1 is subjected to bending work, misalignment in the stacked state of the conductor strand 11 becomes large. On the other hand, if the tensile modulus is too high, when the assembled wire 1 is subjected to bending work, the assembled wire 1 becomes unpliable.
Further, the adhesion layer 13 is permissible, as long as it allows adhesiveness to both the conductor strand 11 and the insulating outer layer 14. Thus, the thickness of the adhesion layer 13 is 3 μm or more and 10 μm or less, preferably 3 μm or more and 8 μm or less, and further preferably 4 μm or more and 7 μm or less. If the adhesion layer 13 is too thin, when the assembled wire 1 is subjected to bending work, misalignment in the stacking state of the conductor strand 11 becomes large. Further, if the adhesion layer 13 is too thick, when the assembled wire 1 is subjected to bending work, the assembled wire 1 becomes unpliable.
The above-described adhesion layer 13 is composed of a thermoplastic resin, and examples thereof include amorphous resins having a glass transition temperature of 200° C. or more and 300° C. or less. If the glass transition temperature is too low, there is a possibility that electric characteristics get worse in the heat resistance test. On the other hand, if the glass transition temperature is too high, there is a possibility that the adhesion layer remains not to be fully melted on the occasion of weld and thereby weldability gets worse.
Examples of the amorphous resin include resins selected from the group consisting of polyetherimide, polyethersulfone, polyphenyl sulfone, and phenyl sulfone. The polyetherimide (PEI) has a tensile modulus of 100 MPa, and a glass transition temperature of 217° C. The polyethersulfone (PES) has a tensile modulus of 200 MPa, and a glass transition temperature of 225° C. The polyphenyl sulfone (PPSU) has a tensile modulus of 200 MPa, and a glass transition temperature of 220° C. The phenyl sulfone (PSU) has a tensile modulus of 30 MPa, and a glass transition temperature of 185° C.
Alternatively, in the adhesion layer 13, a thermoplastic resin having a melting point of 250° C. or more and 350° C. or less is adopted in order not to deform the interlayer insulating layer 12. If the melting point thereof is too low, there is a possibility that electric characteristics in the heat resistance test get worse. On the other hand, if the melting point thereof is too high, there is a possibility that the adhesion layer remains not to be fully melted on the occasion of weld and thereby weldability gets worse. Further, in order to suppress deformation of the above-described interlayer insulating layer 12, the glass transition temperature of the adhesion layer 13 is preferably not higher than the melting point of the interlayer insulating layer 12. Examples of the resin for this purpose include resins selected from the group consisting of PEI, PES, and PPSU.
The above-described adhesion layer 13 may be formed into multi-layers. For example, as shown in
The insulating outer layer 14 is composed of a thermoplastic resin having a melting point of 270° C. or more. In order to prevent the above-described interlayer insulating layer 12 and adhesion layer 13 from change of properties, it is preferable that this melting point is set to be lower than the melting point of any of these resins. Examples thereof include resins selected from the group consisting of polyphenylenesulfide, polyetheretherketone, modified polyetheretherketone, and thermoplastic polyimide. The polyphenylenesulfide (PPS) has a melting point of 280° C. The polyetheretherketone (PEEK) has a melting point of 343° C. The modified polyetheretherketone (modified PEEK) has a melting point of 345° C. The thermoplastic polyimide has a melting point of 388° C.
The thickness of the insulating outer layer 14 is preferably 30 μm or more and 250 μm or less. If the thickness thereof is too thick, the insulating outer layer 14 becomes less effective in flexibility required for the assembled wire 1, because the insulating outer layer 14 itself has stiffness (hardness or rigidity). On the other hand, from the viewpoint that insulation failure can be prevented, the thickness of the insulating outer layer 14 is preferably 30 μm or more, more preferably 40 μm or more, and further preferably 50 μm or more. In this way, even though the insulating outer layer 14 has a certain thickness, since this layer is composed of a thermoplastic resin, generation of soot is suppressed on the occasion of weld, for example, arc weld and thereby a reduction in weldability due to soot can be prevented.
The number of stacked layers (the stacked layer number) of conductor strands 11 in the assembled conductors 10 is two layers or more and six layers or less. A decrease in the high-frequency loss can be fully appreciated even in the case where the number of layers to stack is two. As the number of the layers increases, the loss is more decreased. If the stacked layer number is one, the high-frequency loss becomes too much. On the other hand, if the stacked layer number is seven or more, the number of interlayer insulating layers 12 gets too much to bend it with ease, which results in lowering of moldability (workability). More specifically, misalignment in the stacked conductor strands 11 becomes easy to occur. In view of the above, it can be said to be realistic that the number of layers to stack is up to six, and preferable that the number of layers to stack is up to three.
Further, with regard to the direction to stack, whether the layers are stacked in any one of the direction of width (transverse) or thickness does not make any difference, provided that the longer side of the conductor strand 11 is defined as a width, and the shorter side thereof is defined as a thickness. Preferably, the conductor strand 11 is brought into contact with one another through their longer sides and is stacked in the thickness direction.
The assembled wire 1 of the present invention has an interlayer insulating layer 12, an adhesion layer 13 and an insulating outer layer 14, each of which is composed of a thermoplastic resin. For this reason, by suppressing generation of soot in the weld step, weld becomes easy to do, and this allows a rigid weld. Further, from the presence of the interlayer insulating layer between the conductor strands, the high-frequency loss can be suppressed. Further, from enhancement of the adhesiveness between the assembled conductor 10 and the insulating outer layer 14 by the adhesion layer 13, the assembled wire 1 is excellent in moldability. For this reason, even though the assembled wire 1 is bent, misalignment in the stacked conductor strands 11 can be suppressed. In other words, a bending workability can be enhanced.
To form the above-described interlayer insulating layer 12, a resin varnish containing a thermoplastic resin to be the interlayer insulating layer 12 is coated and baked on the conductor strand 11.
This baked layer of the thermoplastic resin can be formed by coating and baking a resin varnish containing a thermoplastic resin on only one of four outer peripheries of the conductor strand 11 having a rectangular cross-section. In this case, a desired constitution can be obtained, by masking the sides other than the side necessary for coating, and by coating the varnish only on the one necessary side. Specific baking conditions depend on the shape of a furnace to be used. For example, if the furnace is an about 5 m-sized vertical furnace by natural convection, the baking can be achieved by setting the passing time period to 10 to 90 sec at the temperature of 400 to 500° C.
To form the adhesion layer 13, it can be formed by preferably coating and baking a resin varnish containing a thermoplastic resin on the outer periphery of the assembled conductor 10. The method of coating the resin varnish may be in a usual manner. Examples of the coating method include a method of employing a die for a varnish coating, which has been manufactured so as to be similar to the shape of the assembled conductor 10; and a method of employing a die that is called “universal die”, which has been formed in a curb shape, when the cross-sectional shape of the assembled conductor 10 is quadrangle. The assembled conductor 10 having the resin varnish coated thereon is baked by a baking furnace in a usual manner. Although specific baking conditions depend on the shape of a furnace to be used, in the case where the furnace is an about 5 m-sized vertical furnace by natural convection, the baking can be achieved by setting the passing time period to 10 to 90 sec at the furnace temperature of 400 to 500° C.
As the insulating outer layer 14, at least one layer or a plurality of layers is provided on the outside of the adhesion layer 13. The insulating outer layer 14 is supposed to strengthen an adhesion force with respect to the assembled conductor 10 by the adhesion layer 13.
A method of forming the foregoing insulating outer layer 14 is carried out by, for example, extrusion molding by using an extrusion-moldable thermoplastic resin. In this point, the thermoplastic resin has a melting point of 270° C. or more, preferably 300° C. or more, further preferably 330° C. or more. The upper limit of this melting point is 450° C. or less, preferably 420° C. or less, and further preferably 400° C. or less. This melting point can be determined with a differential scanning calorimeter (DSC). Further, such a thermoplastic resin is excellent in adhesion strength between the stacked multi-layer conductor member and the layer on the outer periphery of the stacked multi-layer conductor member and excellent in solvent resistance, in addition to anti-heat aging property.
The insulating outer layer 14 has relative permittivity of 4.5 or less, preferably 4.0 or less, and further preferably 3.8 or less, in that a partial discharge inception voltage can be more increased. The relative permittivity can be measured by a commercially available permittivity measurement device. The measuring temperature and frequency are changed as needed. In the present specification, the values measured at 25° C. and 50 Hz are adopted, unless otherwise specified.
Examples of the extrusion-moldable thermoplastic resin having relative permittivity of 4.5 or less include polyetheretherketone, a modified polyetheretherketone, a thermoplastic polyimide, and the like.
For the insulating outer layer 14, use may be, particularly preferably, made of any of thermoplastic resins having a melting point of 270° C. or more and 450° C. or less and having relative permittivity of 4.5 or less. As the thermoplastic resin, one kind may be used alone, or more than one kind may be used. In the case where at least two kinds are mixed and at least two kinds of melting points exist, if the at least two kinds of melting points include a resin having a melting point of 270° C. or more, the thus mixture in combination may be suitable. For example, use may be made of a polyaryletherketone (PAEK: melting point 343° C.) containing an aromatic ring, an ether bond and a ketone bond and which is represented by polyetheretherketone. Alternatively, use may be made of a modified PEEK (melting point 345° C.) in which other thermoplastic resin(s) is (are) mixed in PEEK. Alternatively, use may be made of at least one thermoplastic resin selected from the group consisting of PAEK, a modified PEEK, and a thermoplastic polyimide (TPI: melting point 388° C.). Further, the modified PEEK is, for example, a mixture in which polyphenylsulfone (PPSU) is added to PEEK, the mixing rate of PPSU being lower than PEEK.
The extrusion temperature conditions in extrusion molding of the insulating outer layer 14 are set adequately depending on the thermoplastic resin to be used. Stated as an example of a preferable extrusion temperature, specifically, in order to make the fusing viscosity appropriate for extrusion-coating, the extrusion temperature is set to a temperature higher than the melting point of the thermoplastic resin by about 40° C. to 60° C. In this way, the insulating outer layer 14 of the thermoplastic resin is formed by temperature-setting extrusion molding. In this case, in forming the insulating outer layer in the production process, it is not necessary to pass the insulating outer layer into a baking furnace, so that there is an advantage that the thickness of the insulating outer layer 14 can be thickened.
In the assembled wire 1 according to this preferable embodiment, the assembled conductor 10 and the adhesion layer 13 on the outer periphery thereof adhere to one another at a high strength of adhesion. Further, the adhesion strength between the adhesion layer 13 and the insulating outer layer 14 is high in adhesion. The adhesion strength between the assembled conductor 10 and the adhesion layer 13 on the outer periphery thereof, and the adhesion strength between the adhesion layer 13 and the insulating outer layer 14 are measured, for example, in the same manner as “5.2 Stretch test” of “JIS C 3216-3 Winding wires-Test methods-Part 3 Mechanical properties”, and whether a float in the specimen after stretching is present or absent can be examined with the naked eye.
The assembled wire 1 of the present invention may be configured to transversely align the above-described assembled conductors 10 in multi-lines and to entirely cover them with both the adhesion layer 13 and the insulating outer layer 14. Even by such a multi-line configuration, the same performance as the single-line configuration can be obtained.
The assembled wire (rectangular wire) 1 of the present invention as described above is preferably applied to a coil, which constitutes motors of a hybrid vehicle or an electric vehicle, as an example of the electrical equipment. For example, the rectangular wire 1 can be used for a winding wire which forms a stator coil of the rotating electrical machine (motor) as described in JP-A-2007-259555. The constitution in which such an assembled wire of the present invention is stacked has an advantage that a current loss is minor even in the high-frequency region.
The present invention will be described in more detail based on examples given below, but the invention is not meant to be limited by these.
A conductor strand 11 (see
A polyethylene terephthalate (PET) film to be a layer of a thermoplastic resin to be used for the interlayer insulating layer 12 was applied onto, only one plane in the width (the transverse) direction of the conductor strand 11, to give the conductor strand 11. The thus-obtained conductor strand 11 was stacked with two layers in the thickness direction, to obtain the assembled conductor 10 (see
In formation of the adhesion layer 13, a polyetherimide (PEI) varnish was coated on the assembled conductor 10, with using a die having a shape similar to the shape of the assembled conductor 10. As PEI, use was made of trade name: ULTEM 1010, manufactured by SABIC Innovative Plastics Japan Co., Ltd. Then, the thus-coated assembled conductor 10 was got through an 8 m-length baking furnace set to 450° C. at the baking speed so that the baking time became 15 seconds. The polyetherimide varnish was prepared by dissolving the polyetherimide in N-methyl-2-pyrrolidone (NMP). At this one baking step, a polyetherimide layer with thickness 3 μm was formed. By adjusting a varnish concentration, the polyetherimide layer with thickness 3 μm was formed, to obtain the adhesion layer 13 with the 3 μm-thick coating layer.
With the assembled conductor 10 further having the adhesion layer 13 formed thereon, a layer (see
The assembled wire 1 was prepared in the same manner as in Example 1, except that the respective coating thickness of the interlayer insulating layer 12 or the insulating outer layer 14 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the number of stacked layers of conductor strands 11 was made to be six, and that the respective coating thickness of the interlayer insulating layer 12 or the insulating outer layer 14 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the respective coating thickness of the interlayer insulating layer 12, the adhesion layer 13, or the insulating outer layer 14 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the interlayer insulating layer 12 was changed to be composed of polyethylene naphthalate (PEN), and that the respective coating thickness of the interlayer insulating layer 12, the adhesion layer 13, or the insulating outer layer 14 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the interlayer insulating layer 12 was changed to be composed of polyetherimide (PEI), that the insulating outer layer 14 was changed to be composed of polyphenylenesulfide (PPS), that the adhesion layer 13 was changed to be composed of polyphenyl sulfone (PPSU), and that the respective coating thickness of the interlayer insulating layer 12, the adhesion layer 13, or the insulating outer layer 14 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 7, except that the number of stacked layers of conductor strands 11 was made to be six, that the interlayer insulating layer 12 was changed to be composed of polyamide 6T (PA6T), and that the coating thickness of the interlayer insulating layer 12 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the interlayer insulating layer 12 was changed to be composed of polyamide 9T (PA9T), that the adhesion layer 13 was changed to be composed of polyethersulfone (PES), and that the respective coating thickness of the adhesion layer 13 or the insulating outer layer 14 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the interlayer insulating layer 12 was changed to be composed of modified polyetheretherketone (modified PEEK).
The assembled wire 1 was prepared in the same manner as in Example 1, except that the number of stacked layers of conductor strands 11 was made to be four.
The assembled wire 1 was prepared in the same manner as in Example 7, except that the adhesion layer 13 was changed to be composed of phenyl sulfone (PSU).
The assembled wire 1 was prepared in the same manner as in Example 1, except that the adhesion layer 13 was changed to be composed of polypropylene (PP), and that the respective coating thickness of the interlayer insulating layer 12 or the insulating outer layer 14 was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the interlayer insulating layer 12 was changed to be composed of thermoplastic polyimide.
The assembled wire 1 was prepared in the same manner as in Example 1, except that the interlayer insulating layer 12 was changed to be composed of polypropylene (PP).
The assembled wire 1 was prepared in the same manner as in Example 1, except that the insulating outer layer 14 was changed to be composed of polyamide 66 (PA66).
The assembled wire 1 was prepared in the same manner as in Example 3, except that the adhesion layer 13 was changed to be divided into the following two layers, that the adhesion layer at the conductor strand 11 side was made to be composed of polyamide 9T (PA9T), that the adhesion layer at the insulating outer layer 14 side was made to be composed of polyetherimide (PEI), and that the respective coating thickness of these two adhesion layers was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 2, except that the adhesion layer 13 was changed to be divided into the following two layers, that the adhesion layer at the conductor strand 11 side was made to be composed of polyamide 9T (PA9T), that the adhesion layer at the insulating outer layer 14 side was made to be composed of polyetherimide (PEI), and that the respective coating thickness of these two adhesion layers was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 3, except that the interlayer insulating layer 12 was changed to be composed of polyamide 6T (PA6T), that the adhesion layer 13 was changed to be divided into two layers, that the adhesion layer at the conductor strand 11 side was made to be composed of polyamide 9T (PA9T), that the adhesion layer at the insulating outer layer 14 side was made to be composed of polyetherimide (PEI), and that the respective coating thickness of the interlayer insulating layer 12 and these two adhesion layers was changed to the thickness as shown in Table 1.
The assembled wire 1 was prepared in the same manner as in Example 3, except that the adhesion layer 13 was changed to be divided into two layers, that the adhesion layer at the conductor strand 11 side was made to be composed of polyetherimide (PEI), that the adhesion layer at the insulating outer layer 14 side was made to be composed of polyethersulfone (PES), and that the respective coating thickness of the interlayer insulating layer 12, the insulating outer layer 14, and these two adhesion layers was changed to the thickness as shown in Table 1.
In Comparative Example 1, the assembled wire was prepared in the same manner as in Example 1, except that the interlayer insulating layer 12 was not provided.
In Comparative Example 2, the rectangle wire was prepared in the same manner as in Example 1, except that the number of stacked layers of conductor strands 11 was made to be seven.
In Comparative Example 3, the assembled wire was prepared in the same manner as in Example 1, except that the interlayer insulating layer was changed to be composed of polyamideimide (PAI), that the adhesion layer 13 was changed to be composed of polyphenyl sulfone (PPSU), and that the respective coating thickness of the interlayer insulating layer 12 or the adhesion layer 13 was changed to the thickness as shown in Table 1.
In Comparative Example 4, the assembled wire was prepared in the same manner as in Example 1, except that the adhesion layer 13 was not provided.
In Comparative Example 5, the assembled wire was prepared in the same manner as in Example 1, except that the thickness of the adhesion layer 13 was changed to 15 μm.
The following evaluations were conducted, on the assembled wires of Examples 1 to 20 and Comparative Examples 1 to 5, produced in these ways. The results of these evaluations are shown in Table 1.
The wire terminal was welded under the conditions of: welding current 30 A; and welding time 0.1 seconds, by generating arc discharge. When a welding ball arose at the wire terminal, the welding was judged as operable. On the other hand, when the welding ball did not arise but flowed, the welding was judged as inoperable. Further, when black soot generated on the periphery of the welded area, the welding was also judged as inoperable. That is:
As shown in
As shown in
As shown in
As shown in
The acceptance criterion is “A” or “B” judgment.
Note that the “the periphery of the welded area” means a range of about 5 mm in the line direction from the welded terminal.
Under the conditions of 1,000 Hz, 2.16 A, and 138 Vrms, an AC magnetic field generator was put into operation, thereby generating AC magnetic field of 50 mT. When a sample is set in the magnetic field, heat generation due to eddy current is caused. The amount of heat generation at this time was measured and was defines as a current loss (W). A current loss W0 was calculated, of the assembled wire in which a polyetheretherketone resin was extrusion-coated on a non-multilayered conductor, as described above.
When the ratio of current losses W and W0 of each sample was 0.8 or less (inhibition ratio of the current loss is 20% or more), high-frequency property was judged as being good and rated as “B”. Further, when the ratio is 0.4 or less (inhibition ratio of the current loss is 60% or more), high-frequency property was judged as being excellent and rated as “A”. On the other hand, when the ratio is more than 0.8 (inhibition ratio of the current loss is less than 20%), high-frequency property was judged as being poor and rated as “D”.
P=EI cos ϕ In this regard, ϕ=tan−1(Ls·2πf/Rs)
E (V): Measured value of input voltage
Ls (H): Measured value of inductance
I (A): Measured value of input current
Rs (Ω): Measured value of resistance
With regard to the assembled wire 1 formed by extrusion-coating the adhesion layer 13, the insulating outer layer 14, and the like on the assembled conductor 10, the cross-section thereof was cut and observed. At this time, the cross-section was checked for a tilt and a misalignment of the multilayer. With regard to the tilt, whether the angle to the direction of the multilayer to be stacked is nothing was checked. Further, with regard to the misalignment, evaluation was conducted in accordance with the criteria shown in
As shown in
As shown in
As shown in
As shown in
The acceptance criterion is “A”, “B”, or “C” judgment.
Note that, in
The adhesiveness between the assembled conductor 10 and the insulating outer layer 14 in the assembled wire 1 was evaluated, through the following bending workability test.
A 300 mm-long straight specimen was cut out of each of the produced assembled wires 1. A scratch (incision) of about 5 μm in depth and 50 μm in length was put, on a central part of the insulating outer layer 14 at the edge face of this straight specimen, using a dedicated jig, respectively, in both the longitudinal direction and the vertical direction. In this instance, the insulating outer Layer 14 and the assembled conductor 10 adhere to each other through the adhesion layer 13, which were not peeled off each other. Herein, the edge face means a face that is axially formed in a row by a lateral side (thickness, a side along the vertical direction in the drawing of
The straight specimen with this scratch at the top was bent centering on the iron core having a diameter of 1.0 mm at 180° (in a U-shape), and this state was continued for 5 minutes. Progression of peeling off of the assembled conductor 10 from the insulating outer layer 14 occurred near the top of the straight specimen was observed with the naked eye.
In this test, the case where the scratch formed in any of the longitudinal direction and the vertical direction of the insulating outer layer 14 did not spread and the insulating outer layer 14 was not peeled off from the assembled conductor 10, was judged as “acceptance” and was rated as “A”. The case where the scratch formed in at least one of the longitudinal direction and the vertical direction of the insulating outer layer 14 spread and the insulating outer layer 14 was peeled off entirely from, for example, the assembled conductor 10, was judged as “failure” and was rated as “D”.
As is shown in Table 1, it was found that Examples 1 to 20 are each excellent in everything with respect to weldability, high-frequency property, molding property, and bending workability. In the forgoing Examples 1 to 20, in a case where the thickness of the interlayer insulating layer is more than 50 μm and 100 μm or less, the evaluation of weldability became “B”. In a case where the thickness of the interlayer insulating layer is 10 μm or more and 50 μm or less, the evaluation of weldability resulted in “A” or “B”. Further, in a case where the number of stacked layers of the conductor strands 11 was two, the evaluation of high-frequency property became “B”, while in a case where the number of stacked layers of the conductor strands 11 was three or more, the evaluation of high-frequency property became “A”. Furthermore, in a case where the thickness of the adhesion layer is 3 μm or more and 10 μm or less, misalignment in the transverse direction of the conductor strand 11 was minor and the evaluation of molding property became “A” or “B”. Furthermore, in all of Examples having an adhesion layer, the evaluation of bending workability became “A”.
In contrast, in Comparative Example 1 in which the number of stacked layers of the conductor strands 11 was one, the evaluation of high-frequency property was “D”. In Comparative Example 2 in which the number of stacked layers of the conductor strands 11 was too many, the evaluation of molding property was “D”. Further, in Comparative Example 3 for which the interlayer insulating layer was composed of not any thermoplastic resin, but a thermosetting resin of polyamideimide (PAI), any welding ball was not formed and soot was occurred on the periphery of the welded place. For this reason, the evaluation of weldability was “D”. Further, in Comparative Examples 4 and 5 in which the adhesion layer was not provided or was too thick, misalignment in the transverse direction of the conductor strands 11 became too large, and the evaluation of molding property was “D”. Furthermore, in Comparative Examples 1 to 3, and 5 having the adhesion layer, the evaluation of bending workability was excellent as high as “A”. However, in Comparative Example 4 without any adhesion layer, the evaluation of bending workability became “D”, because the insulating outer layer was peeled off from the conductor strands.
Having described our invention as related to the present embodiments and examples, it is our intention that the invention not be limited by any of the details of the description, unless otherwise specified, but rather be construed broadly within its spirit and scope as set out in the accompanying claims.
This application claims priority on Patent Application No. 2015-227868 filed in Japan on Nov. 20, 2015, which is entirely herein incorporated by reference.
| Number | Date | Country | Kind |
|---|---|---|---|
| 2015-227868 | Nov 2015 | JP | national |
This application is a Continuation of PCT International Application No. PCT/JP2016/083815 filed on Nov. 15, 2016, which claims priority under 35 U.S.C. § 119 (a) to Japanese Patent Application No. 2015-227868 filed in Japan on Nov. 20, 2015. Each of the above applications is hereby expressly incorporated by reference, in its entirety, into the present application.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/JP2016/083815 | Nov 2016 | US |
| Child | 15982751 | US |
