Patent Grant
8570234
1. Technical Field
The present invention relates to an assembly of a chip antenna and a circuit board, and relates more particularly to an assembly of a chip antenna and a circuit board including a ground layer that can radiate electromagnetic energy with the chip antenna.
2. Background
Due to the increasing need for high data column transmission, the technology for broadening of wireless networks is developing quickly. For example, the worldwide interoperability for microwave access (WiMax) technique supported strongly by international major companies such as Intel Corporation is rapidly emerging. According to the 802.16e standard, if the WiMax technique is applied, the wireless transmission frequency used between mobile devices such as notebooks and base stations can be in a range of from 2 to 6 GHZ, consequently capable of transmitting video and audio contents with better quality and instant messages.
In addition to the WiMax standard, the present invention can be embodied compliant with wireless standards such as GSM, DCS/PCS, GPS, BT, WiLan, WiFi, etc., and is not limited to the above-mentioned transmission bandwidths and methods of signal transmission.
During the rapid development of the communication industry, the performance of antennas has been a major key factor to the overall performance of wireless communication devices. However, as electronic devices are required to be compact, the antennas cannot perform as required within targeted frequency bands. Poor performance reflects the design difficulty of the antennas. Specifically, when the radiation metal surface area of a chip antenna is reduced, the electromagnetic wave emission efficiency of the antenna is decreased.
Thus, the issues relating to the reduced bandwidths and efficiencies of antennas due to miniaturization need to be resolved.
The present invention provides an assembly of a chip antenna and a circuit board. The ground layer in the circuit board and the chip antenna are integrally configured to radiate electromagnetic energy. Changes in the ground layer layout in the circuit board can have corresponding effects on resistance and reactance. Signals can be sent from the chip antenna to the ground layer, then radiated from the ground layer. Thus, the ground layer can be used as an electromagnetic radiation metal layer, consequently increasing the electromagnetic radiation efficiency and bandwidth. As a result, it is possible to resolve the issues relating to the reduced bandwidths and efficiencies of antennas due to miniaturization.
One embodiment of the present invention comprises a chip antenna and a circuit board. The circuit board comprises a ground layer. The ground layer includes a hollow region formed adjacent to a periphery of the ground layer. The hollow region of the ground layer can be used for configuring an input impedance of the circuit board. The chip antenna is disposed in the hollow region of the ground layer, electrically connecting to the ground layer. The chip antenna creates input impedance. The input impedance of the chip antenna is adjustable to achieve a conjugate impedance match between the chip antenna and the circuit board such that the circuit board and the chip antenna can simultaneously radiate electromagnetic energy. In one embodiment of the present invention, the hollow region of the ground layer is located at the center of a long edge of the circuit board.
The foregoing has outlined rather broadly the features of the present invention in order that the detailed description of the invention that follows may be better understood. Additional features of the invention will be described hereinafter, and form the subject of the claims of the invention. It should be appreciated by those skilled in the art that the conception and specific embodiment disclosed may be readily utilized as a basis for modifying or designing other structures or processes for carrying out the same purposes of the present invention. It should also be realized by those skilled in the art that such equivalent constructions do not depart from the spirit and scope of the invention as set forth in the appended claims.
The objectives of the present invention will become apparent upon reading the following description and upon reference to the accompanying drawings in which:
Through the configuration of the hollow region 1121 of the chip antenna 12, a desired input impedance of the circuit board 11 can be obtained. The adjustment of the input impedance of the circuit board 11 can allow the circuit board 11 and the chip antenna 12 to achieve a conjugate impedance match.
The chip antenna 12 includes a signal electrode (not shown). The signal electrode connects to a signal source (not shown). The chip antenna 12 further includes a ground electrode (not shown) connecting to the ground layer 112. In the present embodiment, the circuit board 11 and the ground layer 112 have a length LB and a width WB. The hollow region 1121 has a length LN and a width WN. The location and dimension of the hollow region 1121 affect the impedance of the ground layer 112. The adjustment of the input impedance of the chip antenna 12 can offset the reactance of the ground layer 112, and can extend the effective radiation metal surface of the antenna. As a result, the ground layer 112 and the chip antenna 12 can simultaneously emit electromagnetic energy. In other words, the ground layer 112 can be deemed a metal layer having a large area for effectively radiating electromagnetic waves carrying signals from the signal source into the atmosphere. The hollow region 1121 can have a shape of rectangle, regular polygon, or can be irregular.
The location and dimension of the hollow region 2121 affect the impedance of the ground layer 112. The adjustment of the input impedance of the chip antenna 12 can offset the reactance of the ground layer 212, and can extend the effective radiation metal surface of the antenna. As a result, the ground layer 212 and the chip antenna 12 can simultaneously emit electromagnetic energy.
Although the present invention and its objectives have been described in detail, it should be understood that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims. For example, many of the processes discussed above can be implemented in different methodologies and replaced by other processes, or a combination thereof.
Moreover, the scope of the present application is not intended to be limited to the particular embodiments of the process, machine, manufacture, composition of matter, means, methods and steps described in the specification. As one of ordinary skill in the art will readily appreciate from the disclosure of the present invention, processes, machines, manufacture, compositions of matter, means, methods, or steps, presently existing or later to be developed, that perform substantially the same function or achieve substantially the same result as the corresponding embodiments described herein may be utilized according to the present invention. Accordingly, the appended claims are intended to include within their scope such processes, machines, manufacture, compositions of matter, means, methods, or steps.
| Number | Date | Country | Kind |
|---|---|---|---|
| 99210231 U | May 2010 | TW | national |
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| 20110215972 | Wong et al. | Sep 2011 | A1 |
| Number | Date | Country | |
|---|---|---|---|
| 20110291910 A1 | Dec 2011 | US |
