TREA

Asymmetrical arrangement of contact pads and connection bridges of a transponder chip module

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Information

  • Patent Grant
  • D942538
  • Patent Number
    D942,538
  • Date Filed
    Thursday, July 30, 2020
    3 years ago
  • Date Issued
    Tuesday, February 1, 2022
    2 years ago
  • US Classifications
    Field of Search
    • US
    • D19 9- 10
    • D14 435-437
    • D14 478-480
    • D14 480-495
    • D14 474
    • D14 217
    • D14 385
    • D14 383
    • 369 2751-2755
    • 369 044260
    • 369 100000
    • 369 052100
    • 369 272000
    • 369 273000
    • 369 280-288
    • 283 081-083
    • 720 718000
    • 435 006000
    • 435 287200
    • 216 002000
    • 216 020000
    • D11 80
    • 235 375000
    • 235 380000
    • 235 382500
    • 235 492000
    • 235 488000
    • 235 486000
    • 705 067000
    • 705 051000
    • 382 126000
    • 382 313000
    • 382 305000
    • CPC
    • G06K9/00973-00986
    • G06K19/063-0701
    • G06K19/0708-0712
    • G06K19/0715-07771
    • G06K19/083-18
    • G06K19/0721
    • G06K19/0772
    • G06K19/07722
    • G06K21/00-06
    • G06K2207/00-108
    • G06F3/08
    • G06F3/12
    • G06F7/40
    • G06F21/00
    • G06F21/30
    • G06F21/31
    • G06F21/32
    • G06F21/34
    • G06F21/45
  • International Classifications
    • 1908
    • Term of Grant
      15Years
Information
Abstract
Description


FIG. 1 is a perspective view of an embodiment of an asymmetrical arrangement of contact pads and connection bridges of a transponder chip module.



FIG. 2 is a front elevation view thereof.



FIG. 3 is a rear elevation view thereof.



FIG. 4 is a top plan view thereof.



FIG. 5 is a bottom plan view thereof.



FIG. 6 is a left side elevation view thereof; and,



FIG. 7 is a right side elevation view thereof.


The dot-dash-dot lines in the drawings are included for the purpose of illustrating portions of the asymmetrical arrangement of contact pads and connection bridges of the transponder chip module that form no part of the claimed design.


Claims
  • The ornamental design for an asymmetrical arrangement of contact pads and connection bridges of a transponder chip module, as shown and described.
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