The disclosed embodiments generally relate to designs for semiconductor-based lasers. More specifically, the disclosed embodiments relate to the design of an athermal wavelength-division multiplexing (WDM) multistripe arrayed waveguide grating integrated-cavity (MAWGIC) laser.
In optical communication systems, wavelength-division multiplexing (WDM) can be used to greatly increase the communication capacity of optical fibers. The WDM technique involves multiplexing a number of wavelength-specific optical carrier signals onto a single optical fiber using different frequencies of laser light. In order to implement an AWG-based optical communication system, it is necessary to provide a multiwavelength laser that can be channeled into a single waveguide. To make such a system practical and cost-effective, the multiwavelength laser should ideally be integrated onto a semiconductor chip. It is also desirable for each of the multiple wavelengths to be athermal because if a wavelength drifts due to temperature variations, the performance of the associated optical carrier signal can be compromised.
Hence, what is needed is a design for an athermal laser, which can be cost-effectively integrated onto a semiconductor chip.
The disclosed embodiments provide a system that implements a multiwavelength laser. This system includes a set of reflective semiconductor operational amplifiers (RSOAs) and a broadband loop mirror having an input and an output. The system also includes an arrayed waveguide grating (AWG) multiplexer having inputs that are coupled to outputs of the set of RSOAs, and having an output that feeds into the input of the loop mirror. During operation of the system, each RSOA in the set of RSOAs forms a wavelength-specific lasing cavity with a specific passband of the AWG multiplexer and the broadband loop mirror. The wavelength-specific laser signals produced by the wavelength-specific lasing cavities combine at the output of the loop mirror to produce a multiwavelength signal, which is emitted through an output of the system.
In some embodiments, the AWG multiplexer comprises a reflective AWG, wherein signals travelling through arrayed waveguides in the AWG are reflected back through a single slab coupler.
In some embodiments, the AWG multiplexer is an athermal AWG multiplexer, which reduces wavelength drift caused by temperature variations.
In some embodiments, array arms of the athermal AWG have a composite silicon and silicon nitride structure, which provides an athermal reflective-AWG response.
In some embodiments, the system additionally includes a ring resonator coupled between the output of the AWG multiplexer and the input of the broadband loop mirror, wherein the ring resonator facilitates self-injection locking to provide additional bandpass filtering.
In some embodiments, the system additionally includes a ring resonator coupled between the output of the broadband loop mirror and the output of the multiwavelength laser, wherein the ring resonator facilitates self-injection locking to provide additional bandpass filtering.
In some embodiments, each RSOA in the set of RSOAs comprises a hybrid gain block coupled to an optical loop reflector.
In some embodiments, the broadband loop mirror comprises a Sagnac loop mirror.
In some embodiments, the output of the multiwavelength laser is coupled to a set of wavelength-specific optical transceivers.
In some embodiments, each wavelength-specific optical transceiver comprises: a wavelength-specific ring modulator for transmitting data on a wavelength-specific component of the multiwavelength signal produced by the multiwavelength laser; and a wavelength-specific ring-based add-drop filter for receiving data from a wavelength-specific component of a multiwavelength signal received from a remote source.
In some embodiments, the wavelength-specific ring modulator comprises an athermal InGaAsP/MOS/Si ring modulator, and the wavelength-specific ring-based add-drop filter comprises an athermal InGaAsP/MOS/Si ring resonator.
The patent or application file contains at least one drawing executed in color. Copies of this patent or patent application publication with color drawing(s) will be provided by the Office upon request and payment of the necessary fee.
The following description is presented to enable any person skilled in the art to make and use the present embodiments, and is provided in the context of a particular application and its requirements. Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present embodiments. Thus, the present embodiments are not limited to the embodiments shown, but are to be accorded the widest scope consistent with the principles and features disclosed herein.
The data structures and code described in this detailed description are typically stored on a computer-readable storage medium, which may be any device or medium that can store code and/or data for use by a computer system. The computer-readable storage medium includes, but is not limited to, volatile memory, non-volatile memory, magnetic and optical storage devices such as disk drives, magnetic tape, CDs (compact discs), DVDs (digital versatile discs or digital video discs), or other media capable of storing computer-readable media now known or later developed.
The methods and processes described in the detailed description section can be embodied as code and/or data, which can be stored in a computer-readable storage medium as described above. When a computer system reads and executes the code and/or data stored on the computer-readable storage medium, the computer system performs the methods and processes embodied as data structures and code and stored within the computer-readable storage medium. Furthermore, the methods and processes described below can be included in hardware modules. For example, the hardware modules can include, but are not limited to, application-specific integrated circuit (ASIC) chips, field-programmable gate arrays (FPGAs), and other programmable-logic devices now known or later developed. When the hardware modules are activated, the hardware modules perform the methods and processes included within the hardware modules.
The disclosed embodiments relate to a new design for a multistripe arrayed waveguide grating integrated-cavity (MAWGIC) laser, which has athermal performance characteristics and can be cost-effectively integrated onto a semiconductor chip. This new design is motivated by a number of previous developments in semiconductor-based photonic technologies.
A number of researchers have investigated various designs for a multistripe array grating integrated-cavity (MAGIC) laser. (See J. B. D. Soole, K. Poguntke, A. Scherer, H. P. LeBlanc, C. Chang-Hasnain, J. R. Hayes, C. Caneau, R. Bhat, and M. A. Koza, “Multistripe array grating integrated cavity (MAGIC) laser: a new semiconductor laser for WDM applications,” Electronics Letters, vol. 28, pp. 1805-1807, 1992. Also, see K. R. Poguntke, J. B. D. Soole, A. Scherer, H. P. LeBlanc, C. Caneau, R. Bhat, and M. A. Koza, “Simultaneous multiple wavelength operation of a multistripe array grating integrated cavity laser,” Applied Physics Letters, vol. 62, pp. 2024-2026, 1993.)
In another development, reflective AWGs implemented on silicon photonics have proven to provide a very compact implementation and also low crosstalk (below −25 dB). (See L. G. de Peralta, A. A. Bernussi, S. Frisbie, R. Gale, and H. Temkin, “Reflective arrayed waveguide grating multiplexer,” IEEE Photonics Technology Letters, vol. 15, pp. 1398-1400, 2003.)
Note that such reflective AWGs, which provide both multiplexing and demultiplexing functionality, can be used to replace the inverse-designed WDM multiplexer in the MAGIC laser to form a new type of WDM laser that we refer to as a WDM “multistripe arrayed waveguide grating integrated-cavity” (MAWGIC) laser, which can be fabricated through a wafer bonding process.
The AWG multiplexer and RSOAs illustrated in
During operation of WDM MAWGIC laser 400, each RSOA in the set of RSOAs 402 forms a wavelength-specific lasing cavity with a specific passband of the AWG multiplexer 404 and the broadband loop mirror 406. The wavelength-specific laser signals produced by the wavelength-specific lasing cavities combine at the output of the loop mirror 406 to produce a multiwavelength laser output. Note that the light blue lines illustrated in
The above-described athermal WDM MAWGIC laser can be used to provide wavelength-specific carrier signals for a set of optical transceivers in an optical communication system. For example,
As illustrated in
Note that a single WDM MAWGIC laser can be coupled to multiple multicore fibers. For example,
The optical communication system illustrated in
In order to operate properly, the athermal transceiver 518 described above requires an athermal modulator 504 and an athermal add-drop filter 508. The inventors have successfully demonstrated athermal ring modulators at both C-band and O-band. (See [Feng 2015] S. Feng, K. Shang, J. T. Bovington, R. Wu, B. Guan, K.-T. Cheng, J. E. Bowers, and S. J. Ben Yoo, “Athermal silicon ring resonators clad with titanium dioxide for 1.3 micron wavelength operation,” Opt. Express, vol. 23, no. 20, pp. 25653-25660, 2015, doi: 10.1364/OE.23.025653.) Also, recent demonstrations have shown that InGaAsP/MOS/Si capacitive Mach-Zehnder modulates with extremely high modulation efficiency (Vπ·L=0.047 V-cm) compared to standard silicon photonic modulators (Vπ·L˜1 V-cm).
Various modifications to the disclosed embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be applied to other embodiments and applications without departing from the spirit and scope of the present invention. Thus, the present invention is not limited to the embodiments shown, but is to be accorded the widest scope consistent with the principles and features disclosed herein.
The foregoing descriptions of embodiments have been presented for purposes of illustration and description only. They are not intended to be exhaustive or to limit the present description to the forms disclosed. Accordingly, many modifications and variations will be apparent to practitioners skilled in the art. Additionally, the above disclosure is not intended to limit the present description. The scope of the present description is defined by the appended claims.
This application claims priority under 35 U.S.C. § 119(e) to U.S. Provisional Application Ser. No. 63/040,262, entitled “Athermal Nanophotonic Lasers,” by inventor Sung-Joo Ben Yoo, filed on 17 Jun. 2020 (Attorney Docket No. UC18-295-2PSP), which is hereby incorporated herein by reference.
Filing Document | Filing Date | Country | Kind |
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PCT/US2021/037569 | 6/16/2021 | WO |
Number | Date | Country | |
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63040262 | Jun 2020 | US |