The invention will be described with reference to the accompanying drawings, wherein like numbers reference like elements.
Embodiments of the present invention will now be described with great circumstance with reference to the accompanying drawings. Note that elements, kinds, combinations, shapes, relative positions, and the like described in the embodiments do not limit the range of this invention, but are only examples unless the description gives a special statement.
The description of the operation of the rubidium atomic oscillator is omitted here because it is known, while an outline of the optical microwave unit 8 which is a major element of this invention will be next described.
The gas cell thermal cylinder 30 holding the Rb gas cell 6 is provided with the heater 4 heating the gas cell thermal cylinder 30 and temperature-controlled by the temperature control section 2 and the temperature sensor 15, so that metal in the Rb gas cell 6 of the optical microwave unit 8 is prevented from being liquidized and disturbing the transmission of the rubidium light. An exterior wall of the circular cylinder (cavity) is wound with a c-field coil which is not shown and gives a magnetic field to the Rb gas cell 6 in a spiral manner so as to obtain turnover frequency of 6.834 GHz. Further, the lamp thermal cylinder 20 holding the Rb lamp 5 is provided with the heater 3 heating the lamp thermal cylinder 20 and temperature-controlled by the temperature control section 2 and the temperature sensor 14, so that the Rb lamp 5 of the optical microwave unit 8 exhibits sufficient excitation spectral intensity and is controlled to have a constant temperature of about 100 degrees Celsius.
Further, on the elevational face of the casing 29, a lid 22 protecting the Rb lamp 5 is fixed by a screw 23, and to the lid 22, a glass window 28 for extracting light is provided. Further, a heater transistor (heater) 3 such as a three-terminal regulator is provided to be fixed at the both lateral faces of the casing 29 by the screw 21.
In the embodiment, the heater transistor 3 is provided to be fixed at the both lateral faces of the casing 29, but not limited. The heater transistor 3 may be provided on any places as long as the casing 29 has a small temperature gradient. Further, the transistor is used as the heater, but other heating elements are also available. The forming position of the recessed part 26 shown in the drawings is only an example. The recessed part 26 may be formed on other positions. Moreover, the size, the shape, and the depth of the recessed part 26 are not limited to the specific size, shape, and depth as long as the recessed part 26 is capable of housing the temperature sensor to cover and bury it by grease 24. However, it is understood that unmeaning enlargement of the shape or the depth increases consumed quantity of the grease 24 and produce disadvantageous cost of the elements, so that the minimum necessary size is preferable.
A method for sealing a temperature sensor of the embodiment will be next described with reference to the
The Rb lamp 5 needs to be maintained at constant temperature in order to stabilize the excitation of a rubidium atom. Therefore, the lamp thermal cylinder 20 is provided to hold the Rb lamp 5 therein. The lamp thermal cylinder 20 includes the transistor heater 3 heating the lamp thermal cylinder 20 and the temperature sensor 14 detecting the temperature of the lamp thermal cylinder 20. In order to increase the temperature detection sensitivity as much as possible, the embodiment fills the recessed part 26 provided to part of the lamp thermal cylinder 20 with the grease 24 and buries the temperature sensor 14 detecting the temperature of the lamp thermal cylinder 20 in the grease 24. The order of the processes may be exchanged. That is, the embodiment first disposes the temperature sensor 14 detecting the temperature of the lamp thermal cylinder 20 in the recessed part 26, and next fills the recessed part 26 with the grease 24, alternatively. These processes can improve the temperature detection responsiveness as much as possible, and prevent generation of air bubbles at the periphery of the temperature sensor 14.
Since the grease has higher fluidity than silicon rubber, it spreads into tiny spaces in the recessed part, thereby not generating vacancies or air bubbles between the temperature sensor and interior wall of the recessed part.
In addition, in order to detect the temperature of the lamp thermal cylinder 20 with high sensitivity, it is important to conduct the heat of the lamp thermal cylinder 20 to the temperature sensor 14 as fast as possible. Therefore, the grease 24 closely contacting the temperature sensor 14 needs to have high thermal conductivity. Using high thermal conductive silicon grease as the grease 24 can improve the conductivity of the heat. The grease is not limited to silicon grease, but may be non-silicon grease as long as it has sufficient fluidity and high thermal conductivity. Thus, the silicon grease has broad options.
Since the grease 24 filling the recessed part 26 does not harden due to its high fluidity, the opening 27 needs to be sealed after filling the recessed part 26 with the grease 24. The embodiment uses an adhesive 25 as a sealing member sealing the opening 27 of the recessed part. The adhesive 25 contacts the grease 24, so that the adhesive having high thermal conductivity is used here. This expands the whole conductive area. The lamp thermal cylinder 20 reaches extremely high temperature. Therefore, the adhesive having thermal resistance needs to be used as the adhesive 25 sealing the grease 24 so as not to transform or melt due to the heat.
Further, on the elevational face of the casing 39, a lid 32 protecting the Rb gas cell 6 is fixed by a screw 33, and to the lid 32, a glass window 38 for extracting light is provided. Thus, incident light from the front is transmitted to be detected its intensity by the photo-sensor 7. Further, a heater transistor (heater) 4 such as a three-terminal regulator is provided to be fixed on the both lateral faces of the casing 39 by the screw 31.
In the embodiment, the heater transistor 4 is provided on the both lateral faces of the casing 39, but not limited. The heater transistor 4 may be provided on any places as long as the casing 39 has a small temperature gradient. Further, the transistor is used as the heater, but other heating elements are also available. The forming position of the recessed part 26 shown in the drawings is only an example. The recessed part 26 may be formed on other positions. Moreover, the size, the shape, and the depth of the recessed part 26 are not limited to the specific size, shape, and depth as long as the recessed part 26 is capable of housing the temperature sensor to cover and bury it by grease 24. However, it is understood that unmeaning enlargement of the shape or the depth increases consumed quantity of the grease 24 and produce disadvantageous cost of the elements, so that the minimum necessary size is preferable.
Here, a description of a method for sealing the temperature sensor of the embodiment is omitted because it is same as the one shown in
The Rb gas cell 6 needs to be maintained at constant temperature in order to stabilize the excitation of a rubidium atom. Therefore, the gas cell thermal cylinder 30 is provided to hold the Rb gas cell 6 therein. The gas cell thermal cylinder 30 includes the transistor heater 4 heating the gas cell thermal cylinder 30 and the temperature sensor 15 detecting the temperature of the gas cell thermal cylinder 30. In order to increase the temperature detection sensitivity as much as possible, the embodiment fills the recessed part 26 provided to part of the gas cell thermal cylinder 30 with the grease 24 and buries the temperature sensor 15 detecting the temperature of the gas cell thermal cylinder 30 in the grease 24. The order of the processes may be exchanged. That is, the embodiment first disposes the temperature sensor 15 detecting the temperature of the gas cell thermal cylinder 30 in the recessed part 26, and next fills the recessed part 26 with the grease 24, alternatively. These processes improve the temperature detection responsiveness as much as possible, and prevent generation of air bubbles at the periphery of the temperature sensor 15.
In addition, in order to detect the temperature of the gas cell thermal cylinder 30 with high sensitivity, it is important to conduct the heat of the gas cell thermal cylinder 30 to the temperature sensor 15 as fast as possible. Therefore, the grease 24 closely contacting the temperature sensor 15 needs to have high thermal conductivity. Using high thermal conductive silicon grease as the grease 24 can improve the conductivity of the heat. The grease is not limited to silicon grease, but may be non-silicon grease as long as it has high thermal conductivity. Thus, the silicon grease has broad options.
Since the grease 24 filling the recessed part 26 does not harden due to its high fluidity, the opening 27 needs to be sealed after filling the recessed part 26 with the grease 24. The embodiment uses an adhesive 25 as a sealing member sealing the opening 27 of the recessed part. The adhesive 25 contacts the grease 24, so that the adhesive having high thermal conductivity is used here. This expands the whole conductive area. The gas cell thermal cylinder 30 reaches extremely high temperature. Therefore, the adhesive having thermal resistance needs to be used as the adhesive 25 sealing the grease 24 so as not to transform or melt due to the heat.
Number | Date | Country | Kind |
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2006-111868 | Apr 2006 | JP | national |