1. Technical Field
The present disclosure relates to a mechanism for attaching an electronic component to a device.
2. Description of Related Art
An electronic component, such as an expansion card, in an electronic device, is attached to a motherboard. An end of the expansion card is connected to the motherboard by a connector, and an opposite end of the expansion card is fastened to the motherboard with screws. Mounting the expansion card to the motherboard with screws is inefficient and requires the use of a tool, such as a screwdriver, which is inconvenient.
Many aspects of the present embodiments can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
A first connector 12 is fastened to the circuit board 10. Two mounting holes 13 are defined in the circuit board 10, beside the first connector 12.
The electronic component 30 includes a second connector 32 mounted to a first end of a bottom surface of the electronic component 30, and two through holes 33 defined in a second end of the electronic component 30 opposite to the first end.
Two supporting protrusions 26 respectively protrude up from two corners of the supporting plate 22 near a second side of the supporting plate 22 opposite to the first side. A pair of spaced and opposite engaging portions 27 perpendicularly extends up from a top surface of each supporting protrusion 26. Each engaging portion 27 includes a semi-cylindrical neck 271, and a tapered head 272 formed on a top of the neck 271. A lower portion of each head 272 is larger than the neck 271 and smaller than an upper portion of the head 272. Two feet 24 perpendicularly extend down from two corners of the supporting plate 22 near the first side. Each foot 24 includes a semi-cylindrical first protrusion 28 and a spaced semi-cylindrical second protrusion 29. The first protrusion 28 is shorter than the second protrusion 29. A stop tab 282 and a tapered head 291 are respectively formed at distal ends of the first protrusion 28 and the second protrusion 29, opposite to each other. An upper portion of the head 291 is larger than the second protrusion 29 and a lower portion of the head 291.
The electronic component 30 is placed on the circuit board 10, with the second connector 32 connected with the first connector 12, the engaging portions 27 extended through the corresponding through holes 33. The electronic component 30 is supported on the supporting protrusions 26. The resilient tab 251 is bent to allow the stop plate 252 to rotate toward the engaging portions 27. The two pairs of engaging portions 27 are deformed to extend the tapered heads 272 through the corresponding through holes 2521 so that the stop plate 252 abuts against bottoms of the heads 272 and a top of the electronic component 30. Thereby, the electronic component 30 is fastened to the circuit board 10.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their materials advantages, the examples hereinbefore described merely being exemplary embodiments.
Number | Date | Country | Kind |
---|---|---|---|
201210007173.7 | Jan 2012 | CN | national |
Relevant subject matter is disclosed in seven pending U.S. patent applications, all titled “ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT”, respectively filed on Mar. 20, 2012, with the application Ser. No. 13/424,390; on Mar. 22, 2012, with the application Ser. No. 13/426,629; on Mar. 23, 2012, with the application Ser. No. 13/427,923; on Mar. 29, 2012, with the application Ser. No. 13/434,791; on Apr. 12, 2012, with the application Ser. No. 13/444,874; on Apr. 13, 2012, with the application Ser. No. 13/445,935; and on Apr. 23, 2012, with the application Ser. No. 13/452,956, which are assigned to the same assignee as this patent application.