Relevant subject matter is disclosed in two pending U.S. patent applications, both titled “ATTACHMENT MECHANISM FOR ELECTRONIC COMPONENT”, respectively filed on Mar. 22, 2012 and Mar. 23, 2012, with the application Ser. Nos. 13/426,629, and 13/427,923, which are assigned to the same assignee as this patent application.
1. Technical Field
The present disclosure relates to a mechanism for attaching an electronic component to a device.
2. Description of Related Art
An electronic component, such as an expansion card, in an electronic device, is attached to a motherboard. An end of the expansion card is connected to the motherboard by a connector, and an opposite end of the expansion card is fastened to the motherboard with screws. Mounting the expansion card to the motherboard with screws is inefficient and requires the use of a tool, such as a screwdriver, which is inconvenient.
Many aspects of the present embodiments can be better understood with reference to the drawings. The components in the drawings are not necessarily drawn to scale, the emphasis instead being placed upon clearly illustrating the principles of the present embodiments. Moreover, in the drawings, all the views are schematic, and like reference numerals designate corresponding parts throughout the several views.
The disclosure, including the accompanying drawings, is illustrated by way of example and not by way of limitation. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
A first connector 12 is fastened to the circuit board 10. A mounting hole 13 is defined in the circuit board 10, beside the first connector 12.
A second connector 32 is fastened to a first end of a bottom surface of the electronic component 30. A through hole 33 is defined in a second end of the electronic component 30 opposite to the first end.
To fasten the electronic component 30, the through hole 33 is aligned with the top resilient blocks 25. The electronic component 30 is manipulated down so that the top resilient blocks 25 and abutting blocks 251 are deformed by a sidewall bounding the through hole 33. After the top resilient blocks 25 and abutting blocks 251 pass through the through hole 33, the top resilient blocks 25 self-restore to make the top abutting blocks 251 abut against a top surface of the electronic component 30. Opposite sides of the electronic component 30 abut against the corresponding guiding surfaces 282. The cantilevers 26 with the hooks 28 are deformed away from each other. After the bottom surface of the electronic component 30 abuts against the top end surface of the main body 22, the hooks 28 engage with the corresponding sides of the electronic component 30. The second connector 32 is connected to the first connector 12. Therefore, the electronic component 30 is fastened to the attachment mechanism.
It is believed that the present embodiments and their advantages will be understood from the foregoing description, and various changes may be made thereto without departing from the spirit and scope of the description or sacrificing all of their materials advantages, the examples hereinbefore described merely being exemplary embodiments.
Number | Date | Country | Kind |
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201110438370.X | Dec 2011 | CN | national |