Attenuator

Abstract

An attenuator includes a main body and a circuit board module, wherein the main body is made of an electrically conducting metal, and an installing portion is concavely disposed between both ends of the main body, and a portion of the circuit board module is disposed on the installing portion for reducing the contact area between the circuit board module and the main body, so as to lower the parasite capacitance of the attenuator between the circuit board module and the main body, and the circuit board module processes a signal introduced by the main body according to a predetermined attenuation.

Description

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view of a Pi network equivalent circuit;

FIG. 2 is a circuit diagram of a resistor equivalent circuit of a chip as depicted in FIG. 1;

FIG. 3 is schematic view of properties as depicted in FIG. 1;

FIG. 4 is a schematic view of a main body, a circuit board module and a casing of the present invention;

FIG. 5 is a schematic view of a main body and a circuit board module of the present invention;

FIG. 6 is a cross-sectional view of the present invention;

FIG. 7 is a circuit board module before installing resistors for 8 dB, 9 dB and 10 dB attenuators according to the present invention;

FIG. 8 is a circuit board module after installing resistors for 8 dB, 9 dB and 10 dB attenuators according to the present invention;

FIG. 9 is a circuit board module before installing resistors for 1 dB, 2 dB . . . 7 dB attenuators according to the present invention;

FIG. 10 is a circuit board module after installing resistors for 1 dB, 2 dB . . . 7 dB attenuators according to the present invention;

FIG. 11 is a circuit board module before installing resistors for 20 dB and 30 dB attenuators according to the present invention;

FIG. 12 is a schematic view of a circuit board module after installing resistors for 20 dB and 30 dB attenuators according to the present invention;

FIG. 13 is a schematic view of testing properties of a 1 dB attenuator;

FIG. 14 is a schematic view of testing properties of a 3 dB attenuator;

FIG. 15 is a schematic view of testing properties of a 6 dB attenuator;

FIG. 16 is a schematic view of testing properties of a 10 dB attenuator;

FIG. 17 is a schematic view of testing properties of a 20 dB attenuator; and

FIG. 18 is a schematic view of testing properties of a 30 dB attenuator.

Claims

1. An attenuator, comprising: a main body, having an installing portion concavely disposed between both ends of said main body; anda circuit board module, having a portion disposed on said installing portion and in contact with said main body.

2. The attenuator of claim 1, further comprising a first connection portion disposed between an end of said main body and said installing portion, and said first connecting portion comprising a first central conductor convexly disposed at a position facing said installing portion, such that said first central conductor is coupled precisely to said circuit board module and disposed at a position proximate to said first connecting portion.

3. The attenuator of claim 2, further comprising a second connecting portion disposed between another end of said main body and said installing portion, and said second connecting portion comprising a second central conductor convexly disposed at a position facing said installing portion, and said second central conductor is coupled precisely to said circuit board module and disposed at a position proximate to said second connecting portion.

4. The attenuator of claim 3, wherein said installing portion at its central position includes a groove, a protruding body disposed separately on both sides of said installing portion, and a shoulder portion disposed on said protruding body and proximate to said groove, and said shoulder portion is in contact separately with both sides of said circuit board module and proximate to the bottom of said circuit board module and the bottom of said circuit board module and proximate to both sides of said circuit board, and the bottom surface of said circuit board module 5 faces the position of said groove and is not in contact with said main body, and said circuit board module is installed and limited onto said installing portion.

5. The attenuator of claim 4, wherein said circuit board module comprises: a circuit board;a plurality of first solder pads, intervally disposed on said circuit board facing both sides of said protruding body; anda plurality of connecting layers, disposed between said first solder pad and said protruding body.

6. The attenuator of claim 5, wherein said first solder pad includes a groove disposed at a corresponding position of said protruding body and a gap formed between said groove and said protruding body, and said connecting layer is disposed in said gap.

7. The attenuator of claim 6, wherein said circuit board includes a plurality of second solder pads disposed between said first solder pads, and having their back facing said groove.

8. The attenuator of claim 7, wherein said second solder pad includes at least one first resistor disposed between said second solder and a first solder pad of at least one side of said circuit board module.

9. The attenuator of claim 8, wherein said second solder pads include at least one second resistance disposed between said solder pads.

10. The attenuator of claim 4, wherein a circuit board of said circuit board module includes three first solder pads separately disposed on both sides of said circuit board.

11. The attenuator of claim 10, wherein said circuit board includes two second solders disposed substantially in a U-shape between said first solder pad and on the opposite side of said groove, and an indent of said second solder pads faces the same side of said circuit board, such that said two first solder pads correspond to said indent of said second solder pads, and said other first solder pad corresponds a gap between said two second solder pads.

12. The attenuator of claim 11, wherein said central conductors are disposed on an opposite side of said second solder pads.

13. The attenuator of claim 12, wherein said circuit board includes a first resistor disposed between said second solder pad and said first solder pad facing an indent of said second solder pad.

14. The attenuator of claim 10, wherein said second solder pad includes a second resistor disposed at a corresponding side of said second solder pad.

15. The attenuator of claim 10, wherein said circuit board includes two T-shaped second solder pads and a rectangular second solder pad disposed between said two T-shaped second solder pad, and said two first solder pads correspond to said T-shaped second solder pads and proximate to said second solder pad, and another first solder pad corresponds to said rectangular second solder pad.

16. The attenuator of claim 15, wherein said first resistor is disposed between a side of said T-shaped second solder pad 56 proximate to said rectangular second solder pad and a side of said first solder pad facing said T-shaped second solder pad and proximate to said rectangular second solder pad.

17. The attenuator of claim 16, wherein said rectangular second solder pad includes a second resistor disposed on a corresponding side of said T-shaped second solder pad.

18. The attenuator of claim 17, wherein said central conductors are disposed precisely on an opposite side of said T-shaped second solder pad.

19. The attenuator of claim 18, wherein said main body includes a casing disposed around the periphery of said installing portion.

20. The attenuator of claim 19, wherein said main body is made of an electrically conducting metal for providing an electrically conducting grounding effect.