This application is a national stage application under 35 U.S.C. § 371 of PCT International Application Serial No. PCT/CN2014/074527, filed on Apr. 1, 2014 and entitled “AUDIO ENHANCEMENT IN MOBILE COMPUTING”, which application is considered part of and is hereby incorporated by reference in its entirely in the disclosure of this application.
This application relates to the field of mobile computing, and more particularly to the use of mechanical drivers for enhancing audio outputs of mobile computing devices.
In an example, a mobile computing device is provided with mechanical drivers for enhancing audio output, including low-frequency audio. The mechanical drivers may be provided to supplement traditional speakers. In an embodiment, mechanical drivers are boosted in effectiveness by being disposed against a sturdy surface such as a desktop. When a user holds a convertible tablet up, such enhancement may be provided by enabling mechanical drivers that are disposed against a base or other structural member of the convertible tablet.
The present disclosure is best understood from the following detailed description when read with the accompanying FIGURES. It is emphasized that, in accordance with the standard practice in the industry, various features are not drawn to scale and are used for illustration purposes only. In fact, the dimensions of the various features may be arbitrarily increased or reduced for clarity of discussion.
In an example, a mobile computing device is provided with mechanical drivers for enhancing audio output, including low-frequency audio. The mechanical drivers may be provided to supplement traditional speakers. In an embodiment, mechanical drivers are boosted in effectiveness by being disposed against a sturdy surface, such as a desktop. When a user holds a convertible tablet up, such enhancement may be provided by enabling mechanical drivers that are disposed against a base or other structural member of the convertible tablet.
The following disclosure provides many different embodiments, or examples, for implementing different features of the present disclosure. Specific examples of components and arrangements are described below to simplify the present disclosure. These are, of course, merely examples and are not intended to be limiting. Further, the present disclosure may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed.
Different embodiments may have different advantages, and no particular advantage is necessarily required of any embodiment.
Reference is made to co-pending U.S. patent application Ser. No. 14/126,796, entitled “Augmenting Mobile Computing Device Audio Output Via Vibration Elements,” filed 16 Dec. 2013, which is incorporated herein by reference in its entirety.
In an example, convertible tablet 100 includes a base 130 and a tablet 180. In certain embodiments, base 130 may be communicatively and mechanically coupled to tablet 180. However, the communicative and mechanical coupling need not be a permanent arrangement. For example, in many convertible tablets, base 130 is provided to extend the abilities and functionality of a tablet 180. Base 130 may provide, for example, additional peripherals such as a full-size keyboard, a trackpad, speakers, additional communication ports, and in some cases an interface for a docking station that may provide additional extended functionality. In some cases, base 130 may also extend the computing capacity of tablet 180 by providing additional memory and/or processing power. It is therefore intended that base 130 and tablet 180 be understood only as nonlimiting examples. It is intended, therefore, that tablet 180 and base 130 should be understood only as nonlimiting examples of a first housing and second housing respectively, and that either may provide any of a plurality of functions.
Base 130 may include a plurality of mechanical drivers 110, which may be disposed and arranged in one or more useful configurations. The configuration disclosed herein with specificity should be understood to be only one example arrangement, and other designs may incorporate other arrangements according to design parameters. In this example, mechanical drivers 110 are divided into front bottom drivers 110-1 and rear bottom drivers 110-2. By way of example, there are two front bottom drivers 110-1, and two rear bottom drivers 110-2. Mechanical drivers 110 may be disposed within a casing 120 that provides an external shell and structural support for convertible tablet 100. In one example, mechanical drivers 110 are disposed so as to protrude slightly from casing 120 so that when casing 120 is laid on a working surface, mechanical drivers 110 are in direct mechanical contact with the working surface.
This arrangement may be better understood with reference to
However, convertible tablet 100 may include pads or feet disposed, for example, along the bottom of base 130, and by provisioning mechanical drivers 110 within said pads or feet, the end user's audio experience may be enhanced when convertible tablet 100 is placed on work surface 140.
In one embodiment, mechanical drivers 110 may be selectively activated based on the usage context of convertible tablet 100, as described in more detail throughout this Specification. In certain embodiments, it may be advantageous to enable only some of a plurality of mechanical drivers 110.
When enabled, mechanical drivers 110 may be used to drive a mechanical waveform onto work surface 140. This mechanical waveform, in one embodiment, is a low frequency waveform, so that work surface 140 essentially becomes a supplemental bass speaker.
In the example of
Convertible tablet 100 includes a processor 210 connected to a memory 220, having stored therein, by way of example, executable instructions for providing an operating system and an audio monitor daemon. Other components of convertible tablet 100 include a storage 250, peripherals 260, and audio subsystem 280.
In an example, processor 210 is communicatively coupled to memory 220 via a memory bus, which may be for example a direct memory access (DMA) bus. Processor 210 may be communicatively coupled to other devices via a system bus 270. As used throughout this Specification, a “bus” includes any wired or wireless interconnection line, network, connection, bundle, single bus, multiple buses, crossbar network, single-stage network, multistage network or other conduction medium operable to carry data, signals, or power between parts of a computing device, or between computing devices. It should be noted that these uses are disclosed by way of non-limiting example only, and that some embodiments may omit one or more of the foregoing buses, while others may employ additional or different buses. A power supply may distribute power to system devices via system bus 270, or via a separate power bus.
In various examples, a “processor” may include any combination of hardware, software, or firmware providing programmable logic, including by way of non-limiting example a microprocessor, digital signal processor, field-programmable gate array, programmable logic array, application-specific integrated circuit, or virtual machine processor.
Processor 210 may be connected to memory 220 in a DMA configuration via a DMA bus 270. To simplify this disclosure, memory 220 is disclosed as a single logical block, but in a physical embodiment may include one or more blocks of any suitable volatile or non-volatile memory technology or technologies, including for example DDR RAM, SRAM, DRAM, cache, L1 or L2 memory, on-chip memory, registers, flash, ROM, optical media, virtual memory regions, magnetic or tape memory, or similar. In certain embodiments, memory 220 may comprise a relatively low-latency volatile main memory, while storage 250 may comprise a relatively higher-latency non-volatile memory. However, memory 220 and storage 250 need not be physically separate devices, and in some examples may represent simply a logical separation of function. It should also be noted that although DMA is disclosed by way of non-limiting example, DMA is not the only protocol consistent with this Specification, and that other memory architectures are available.
Storage 250 may be any species of memory 220, or may be a separate device, such as a hard drive, solid-state drive, external storage, redundant array of independent disks (RAID), network-attached storage, optical storage, tape drive, backup system, cloud storage, or any combination of the foregoing. Storage 250 may be, or may include therein, a database or databases or data stored in other configurations, and may include a stored copy of operational software such as an operating system and a copy of the audio monitoring daemon. Many other configurations are also possible, and are intended to be encompassed within the broad scope of this Specification.
In one example, the audio monitoring daemon is a utility or program that carries out a method, such as method 1200 of
In one example, an audio monitoring daemon includes executable instructions stored on a non-transitory medium operable to perform method 1200 of
Peripherals 260 include any auxiliary device that connects to convertible tablet 100 but that is not necessarily a part of the core architecture of convertible tablet 100. A peripheral may be operable to provide extended functionality to convertible tablet 100, and may or may not be wholly dependent on convertible tablet 100. In some cases, a peripheral may be a computing device in its own right. Peripherals may include input and output devices such as displays, terminals, printers, keyboards, mice, modems, network controllers, sensors, transducers, actuators, controllers, data acquisition buses, cameras, microphones, speakers, or external storage by way of non-limiting example.
Audio subsystem 280 may include, for example, an audio digital signal processing system (DSP) 240, a class D amplifier 230, an audio codec 232 with an amplifier such as a class-D amplifier, speakers 160, and mechanical drivers 110.
Audio amplifiers 230 and 232 may include, for example, variations of class A, class B or class AB amplifiers, which include power output transistors to function as linear regulators for modulating the output voltage of the amplifier. Class D amplifiers, utilized in this embodiment, function as switching amplifiers with the switches either fully on or off, thereby significantly reducing the power consumption of the amplifiers.
In one illustrative example, audio amplifiers 230 and 232 may operate by first converting audio data input received from audio DSP 240 into modulated digital signals, which are then amplified and filtered to recover an analog output signal. Thus, class D amplifiers utilized by embodiments of the present Specification may include an analog-to-digital converter coupled to provide a digital output to a modulator; the modulator's output is received by a filter, functioning as a digital-to-analog converter, and the filter's output is subsequently transmitted to the audio output components described below. In class D amplifiers, only the digital signal is amplified by on/off digital signal processing, thus, class D amplifiers can have very high power efficiency since they provide substantially full output power, while minimizing internal power consumption.
In one embodiment, audio codec and class D amplifier 232 is provided to output audio data to speakers 160, while class D amplifier 230 is provided to output acoustical waveforms to mechanical drivers 110 to augment the output of speakers 160, as described below. Audio codec and class D Amplifier 232 is illustrated as including an audio codec (i.e., audio coder/decoder). A codec may be used to convert digital audio data into an analog audio signal for playback by an audio device such as speakers 160. In some cases, an audio controller (not shown) may also provide an interface between the audio codec with class D amplifier 232 and audio DSP 240. In some embodiments, the audio controller may be included in a chipset of processor 210. In other embodiments, select components of audio subsystem 280 may be provided as a separate integrated circuit or daughter board, in which case audio subsystem 280 may provide its own audio controller. The audio controller may send and receive audio data streams to and from audio codec with class D amplifier 232 over a data link.
In this embodiment, mechanical drivers 110 work in combination with speakers 160 to output audio data processed from audio DSP 240. In computing devices such as mobile computing devices, a small form factor of the device is used to increase portability by reducing device volume and weight; however, this reduced form factor creates limited internal volume for speaker design. This limited speaker volume may result in poor sound quality, especially for lower frequency audio data, which typically is output via larger speaker components.
Embodiments of the present Specification may use mechanical drivers 110 to enhance the audio output of a computing device such as convertible tablet 100. Mechanical drivers 110 may comprise any conventional vibrating elements including a mass element (i.e., counterweight) electrically driven via an actuator to produce the vibrations. The weight/mass of the mass element/counterweight may be selected based on the desired strength and frequency for the vibration components (i.e., lower frequencies may utilize larger/heavier mechanisms).
Thus, audio DSP 240 may process audio data and separately output some of the data for speakers 160 (such as higher frequency audio data), and some of the data for mechanical drivers 110 (such as lower frequency audio data). Mechanical drivers 110 may be driven based on the audio data from audio DSP 240. For example, mechanical drivers 110 may comprise actuators to oscillate mass elements based on received waveform data, and the audio data may be used to change this waveform data (e.g., increase amplitude, peak duration, etc.).
As shown in the detail of
As will be appreciated according to this FIGURE, when convertible tablet 100 is used in the configuration shown, front bottom driver 110-1 and rear bottom driver 110-2 may be enabled, while front top driver 110-3 and rear top driver 110-4 may be disabled. This may be, for example, because bottom drivers 110-1 and 110-2 are provided with a mechanical surface such as work surface 140 of
It should also be recognized that the placement of and disposition of convertible tablet 100 in
However, in some cases, user 410 may wish to experience the augmented audio capabilities of using mechanical drivers 110 while operating convertible tablet 100 as a simple tablet 180. In that case, user 410 may keep convertible tablet 100 substantially in a fully upward position, so that flip stand 420 mechanically engages bottom casing 430. In that case, rear bottom drivers 110-2 are located on an drive surface to operate against, namely flip stand 420. Thus, in this configuration, rear bottom drivers 110-2 may be enabled, while all other mechanical drivers 110 are disabled. It should be recognized that many other similar configurations are possible.
Also by way of example, tablet cover 510 may include a number of magnets 530 disposed substantially in the corners of tablet cover 510 to magnetically secure tablet cover 510 against tablet 180. This may help to protect touch surface 150.
In the example of
Referring to
Such a configuration is shown in
As is disclosed with more particularity in
As seen in
In block 1210, processor 210 (
In block 1220, audio subsystem 280 (
In block 1230, an accelerometer or other suitable transducer or sensor may be used to measure the effect of mechanical drivers 110 to determine if system vibration is adversely affecting convertible tablet 100. For example, a strong vibration may affect the clarity of viewing a display on touch surface 150, depending for example on the placement of the device and the nature of work surface 140. If mechanical drivers 110 are unacceptably negatively affecting system performance, then control passes to block 1280, in which processor 210 disables all mechanical drivers, and in block 1290, the method is done.
Returning to block 1230, if there is no adverse system effect, then in block 1240 one or more mechanical drivers 110 are selected for providing augmented audio. Mechanical drivers 110 may be selected according to any suitable scheme, including according to the schemes disclosed throughout the preceding FIGURES.
In block 1250, processor 210 may collect feedback data from an audio sensor that is part of audio subsystem 280. The audio sensor may include, for example, a microphone or other transducer. As the audio data at various frequencies may vary based on the environment surrounding the device, block 1250 provides a critical performance improvement.
In block 1260, processor 210 may use feedback from block 1250 to determine a maximum amplification threshold (e.g., resonance frequencies), as well as adjust additional equalization settings (e.g., vibration oscillation factors).
In block 1290, the method is done.
The foregoing outlines features of several embodiments so that those skilled in the art may better understand the aspects of the present disclosure. Those skilled in the art should appreciate that they may readily use the present disclosure as a basis for designing or modifying other processes and structures for carrying out the same purposes and/or achieving the same advantages of the embodiments introduced herein. Those skilled in the art should also realize that such equivalent constructions do not depart from the spirit and scope of the present disclosure, and that they may make various changes, substitutions, and alterations herein without departing from the spirit and scope of the present disclosure.
The particular embodiments of the present disclosure may readily include a system on chip (SOC) central processing unit (CPU) package. An SOC represents an integrated circuit (IC) that integrates components of a computer or other electronic system into a single chip. It may contain digital, analog, mixed-signal, and radio frequency functions; all of which may be provided on a single chip substrate. Other embodiments may include a multi-chip-module (MCM), with a plurality of chips located within a single electronic package and configured to interact closely with each other through the electronic package. In various other embodiments, the digital signal processing functionalities may be implemented in one or more silicon cores in Application Specific Integrated Circuits (ASICs), Field Programmable Gate Arrays (FPGAs), and other semiconductor chips.
In example implementations, at least some portions of the processing activities outlined herein may also be implemented in software. In some embodiments, one or more of these features may be implemented in hardware provided external to the elements of the disclosed FIGURES, or consolidated in any appropriate manner to achieve the intended functionality. The various components may include software (or reciprocating software) that can coordinate in order to achieve the operations as outlined herein. In still other embodiments, these elements may include any suitable algorithms, hardware, software, components, modules, interfaces, or objects that facilitate the operations thereof.
Additionally, some of the components associated with described microprocessors may be removed, or otherwise consolidated. In a general sense, the arrangements depicted in the FIGURES may be more logical in their representations, whereas the physical architecture may include various permutations, combinations, and/or hybrids of these elements. It is imperative to note that countless possible design configurations can be used to achieve the operational objectives outlined herein. Accordingly, the associated infrastructure has a myriad of substitute arrangements, design choices, device possibilities, hardware configurations, software implementations, equipment options, etc.
Any suitably-configured processor component can execute any type of instructions associated with the data to achieve the operations detailed herein. Any processor disclosed herein could transform an element or an article (for example, data) from one state or thing to another state or thing. In another example, some activities outlined herein may be implemented with fixed logic or programmable logic (for example, software and/or computer instructions executed by a processor) and the elements identified herein could be some type of a programmable processor, programmable digital logic, for example, an FPGA, an erasable programmable read only memory (EPROM), an electrically erasable programmable read only memory (EEPROM)), an ASIC that includes digital logic, software, code, electronic instructions, flash memory, optical disks, CD-ROMs, DVD ROMs, magnetic or optical cards, other types of machine-readable mediums suitable for storing electronic instructions, or any suitable combination thereof. In operation, processors may store information in any suitable type of non-transitory storage medium (for example, random access memory (RAM), read only memory (ROM), FPGA, EPROM, EEPROM, etc.), software, hardware, or in any other suitable component, device, element, or object where appropriate and based on particular needs. Further, the information being tracked, sent, received, or stored in a processor could be provided in any database, register, table, cache, queue, control list, or storage structure, based on particular needs and implementations, all of which could be referenced in any suitable timeframe. Any of the memory items discussed herein should be construed as being encompassed within the broad term ‘memory.’ Similarly, any of the potential processing elements, modules, and machines described herein should be construed as being encompassed within the broad term ‘microprocessor’ or ‘processor.’ Furthermore, in various embodiments, the processors, memories, network cards, buses, storage devices, related peripherals, and other hardware elements described herein may be realized by a processor, memory, and other related devices configured by software or firmware to emulate or virtualize the functions of those hardware elements.
Computer program logic implementing all or part of the functionality described herein is embodied in various forms, including, but in no way limited to, a source code form, a computer executable form, and various intermediate forms (for example, forms generated by an assembler, compiler, linker, or locator). In an example, source code includes a series of computer program instructions implemented in various programming languages, such as an object code, an assembly language, or a high-level language such as OpenCL, Fortran, C, C++, JAVA, or HTML for use with various operating systems or operating environments. The source code may define and use various data structures and communication messages. The source code may be in a computer executable form (e.g., via an interpreter), or the source code may be converted (e.g., via a translator, assembler, or compiler) into a computer executable form.
In the discussions of the embodiments above, the capacitors, buffers, graphics elements, interconnect boards, clocks, DDRs, camera sensors, dividers, inductors, resistors, amplifiers, switches, digital core, transistors, and/or other components can readily be replaced, substituted, or otherwise modified in order to accommodate particular circuitry needs. Moreover, it should be noted that the use of complementary electronic devices, hardware, non-transitory software, etc. offer an equally viable option for implementing the teachings of the present disclosure.
In one example embodiment, any number of electrical circuits of the FIGURES may be implemented on a board of an associated electronic device. The board can be a general circuit board that can hold various components of the internal electronic system of the electronic device and, further, provide connectors for other peripherals. More specifically, the board can provide the electrical connections by which the other components of the system can communicate electrically. Any suitable processors (inclusive of digital signal processors, microprocessors, supporting chipsets, etc.), memory elements, etc. can be suitably coupled to the board based on particular configuration needs, processing demands, computer designs, etc. Other components such as external storage, additional sensors, controllers for audio/video display, and peripheral devices may be attached to the board as plug-in cards, via cables, or integrated into the board itself. In another example embodiment, the electrical circuits of the FIGURES may be implemented as stand-alone modules (e.g., a device with associated components and circuitry configured to perform a specific application or function) or implemented as plug-in modules into application specific hardware of electronic devices.
Note that with the numerous examples provided herein, interaction may be described in terms of two, three, four, or more electrical components. However, this has been done for purposes of clarity and example only. It should be appreciated that the system can be consolidated in any suitable manner. Along similar design alternatives, any of the illustrated components, modules, and elements of the FIGURES may be combined in various possible configurations, all of which are clearly within the broad scope of this Specification. In certain cases, it may be easier to describe one or more of the functionalities of a given set of flows by only referencing a limited number of electrical elements. It should be appreciated that the electrical circuits of the FIGURES and its teachings are readily scalable and can accommodate a large number of components, as well as more complicated/sophisticated arrangements and configurations. Accordingly, the examples provided should not limit the scope or inhibit the broad teachings of the electrical circuits as potentially applied to a myriad of other architectures.
Numerous other changes, substitutions, variations, alterations, and modifications may be ascertained to one skilled in the art and it is intended that the present disclosure encompass all such changes, substitutions, variations, alterations, and modifications as falling within the scope of the appended claims. In order to assist the United States Patent and Trademark Office (USPTO) and, additionally, any readers of any patent issued on this application in interpreting the claims appended hereto, Applicant wishes to note that the Applicant: (a) does not intend any of the appended claims to invoke paragraph six (6) of 35 U.S.C. section 112 as it exists on the date of the filing hereof unless the words “means for” or “steps for” are specifically used in the particular claims; and (b) does not intend, by any statement in the specification, to limit this disclosure in any way that is not otherwise reflected in the appended claims.
There is disclosed in an example 1, an apparatus comprising:
There is disclosed in an example 2, the apparatus of example 1, wherein a mechanical driver of the first species is disposed substantially above a mechanical driver of the second species, and wherein at least one of the mechanical drivers is operable to provide a waveform to cancel a feedback of the other mechanical driver.
There is disclosed in an example 3, the apparatus of example 1, further comprising logic, at least partly implemented in hardware, to enable mechanical drivers disposed against an external drive surface.
There is disclosed in an example 4, the apparatus of example 1, further comprising logic, at least partly implemented in hardware, to enable mechanical drivers disposed against a surface of a computing device housing the apparatus.
There is disclosed in an example 5, the apparatus of example 1, further comprising a drive plate disposed against at least one of the mechanical drivers and configured to act as a drive surface when the mechanical driver outputs an acoustic waveform.
There is disclosed in an example 6, the apparatus of example 1, further comprising logic, at least partly implemented in hardware, to calibrate the mechanical drivers by determining whether audio enhancement by use of the mechanical drivers is suitable for a usage context.
There is disclosed in an example 7, the apparatus of example 6, further comprising logic, at least partly implemented in hardware, to select one or more of the mechanical drivers for use in the usage context.
There is disclosed in an example 8, the apparatus of example 7, wherein selecting one or more of the mechanical drivers comprises selecting drivers disposed against an external drive surface.
There is disclosed in an example 9, the apparatus of example 7, wherein selecting one or more of the mechanical drivers comprises sensing a position of a first housing of a computing device relative to a second housing of the computing device.
There is disclosed in an example 10, the apparatus of example 7, wherein selecting one or more of the mechanical drivers comprises sensing a position of a flip stand of a computing device.
There is disclosed in an example 11, the apparatus of example 7, wherein selecting one or more of the mechanical drivers comprises selecting a mechanical driver disposed against a rigid display surface of a computing device.
There is disclosed in an example 12, a system comprising:
There is disclosed in an example 13, the system of example 12, wherein a mechanical driver of the first species is disposed substantially above a mechanical driver of the second species, and wherein at least one of the mechanical drivers is operable to provide a waveform to cancel a feedback of the other mechanical driver.
There is disclosed in an example 14, the system of example 12, further comprising logic, at least partly implemented in hardware, to enable mechanical drivers disposed against an external drive surface.
There is disclosed in an example 15, the system of example 12, further comprising logic, at least partly implemented in hardware, to enable mechanical drivers disposed against a surface of a computing device housing the apparatus.
There is disclosed in an example 16, the system of example 12, further comprising a drive plate disposed against at least one of the mechanical drivers and configured to act as a drive surface when the mechanical driver outputs an acoustic waveform.
There is disclosed in an example 17, there is disclosed in an example 16, the system of example 12, further comprising logic, at least partly implemented in hardware, to calibrate the mechanical drivers by determining whether audio enhancement by use of the mechanical drivers is suitable for a usage context.
There is disclosed in an example 19, the system of example 17, further comprising logic, at least partly implemented in hardware, to select one or more of the mechanical drivers for use in the usage context.
There is disclosed in an example 20, the system of example 18, wherein selecting one or more of the mechanical drivers comprises selecting drivers disposed against an external drive surface.
There is disclosed in an example 21, the system of example 18, wherein selecting one or more of the mechanical drivers comprises sensing a position of a first housing of the computing device relative to a second housing of the computing device.
There is disclosed in an example 22, the system of example 18, wherein selecting one or more of the mechanical drivers comprises sensing a position of a flip stand of the computing device.
There is disclosed in an example 23, the system of example 18, wherein selecting one or more of the mechanical drivers comprises selecting a mechanical driver disposed against a rigid display surface of the computing device.
There is disclosed in an example 24, a method comprising:
There is disclosed in an example 25, the method of example 24, wherein selecting one or more of the mechanical drivers comprises selecting drivers disposed against an external drive surface.
There is disclosed in an example 26, the method of example 24, wherein selecting one or more of the mechanical drivers comprises sensing a position of a first housing of a computing device relative to a second housing of the computing device.
There is disclosed in an example 27, the method of example 24, wherein selecting one or more of the mechanical drivers comprises sensing a position of a flip stand of a computing device.
There is disclosed in an example 28, the method of example 24, wherein selecting one or more of the mechanical drivers comprises selecting a mechanical driver disposed against a rigid display surface of the computing device.
Filing Document | Filing Date | Country | Kind |
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PCT/CN2014/074527 | 4/1/2014 | WO | 00 |
Publishing Document | Publishing Date | Country | Kind |
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WO2015/149276 | 10/8/2015 | WO | A |
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