Patent Application
20240205580
This disclosure generally relates to headsets. More particularly, the disclosure relates to audio headsets with removably coupled earphones.
Conventional headphones include a set of earcups joined by a headband. In some configurations, the earcups, associated wiring, and/or electronics in the headband may benefit from servicing.
All examples and features mentioned below can be combined in any technically possible way.
Various implementations include audio headsets. In particular aspects, an audio headset includes: a pair of earphones; a headband connecting the pair of earphones; and a cable connecting the pair of earphones through the headband, where the earphones are removably coupled with one another such that the audio headset is operational with only one of the earphones.
Implementations may include one of the following features, or any combination thereof.
In certain cases, the headband includes a first headband segment, a second headband segment, and a spring connecting the first headband segment and the second headband segment.
In some aspects, the spring is located at a top portion of the audio headset when worn by a user.
In particular implementations, the spring includes a slot, and the cable extends from the first headband segment to the second headband segment through the slot.
In certain cases, the spring is located at a hinge between the first headband segment and the second headband segment, where the hinge is visible from an exterior of the audio headset, and the cable is visually obstructed at the exterior of the audio headset.
In some implementations, the spring includes at least one torsion spring that provides a linear clamping force on the headband.
In particular aspects, the linear clamping force enhances acoustic performance for the audio headset across a variety of users having distinct head sizes. In some examples, the enhanced acoustic performance is characterized by an improved acoustic seal, improved communications, and/or improved noise cancelation and/or active noise reduction.
In some cases, a portion of the cable extending through the headband is positioned in an in-line switchback configuration to mitigate mechanical stress on the cable in response to adjustment (e.g., vertical adjustment) of at least one of the earphones. For example, the in-line switchback configuration can be along an arced plane or path defined by an arc axis, where the cable has a uniform height but switches back (or squiggles) around the axis. In certain cases, the switchback configuration allows for an amount of extension in the earphones to accommodate distinct head sizes. In some cases, the extension amount is equal to approximately 50 millimeters (mm) to approximately 70 mm, and in particular cases, approximately 60 mm.
In particular implementations, the headset further includes a removable cable holder in at least one section of the headband for enabling removal of the portion of the cable.
In certain aspects, the headset further includes an adjustment limiter for preventing unintentional removal of the removable cable holder.
In some cases, the headset further includes a circuit board in the headband, where the cable includes a first section connected with a first one of the earphones and a first side of the circuit board, and a second section connected with a second one of the earphones and a second side of the circuit board. In some examples, the circuit board includes a printed circuit board (PCB), such as a PCB-A.
In particular aspects, through-headband wiring of the cable mitigates mechanical stress on the connection between the first section and the circuit board and the second section and the circuit board.
In certain implementations, the headset further includes a removable cap on at least a portion of the headband, where the cap enables access to at least one of the connection between the first section and the circuit board or the connection between the second section and the circuit board.
In some cases, the headset further includes at least one grounding wire connected with the circuit board for providing electro-static discharge (ESD) protection for the audio headset. In some examples, the grounding wire provides ESD protection from the metal in the torsion spring. In further examples, the grounding wire is the only grounding point for the headband cable.
In particular aspects, the first section has a multi-pin segment connector for connecting with the circuit board.
In certain implementations, the second section is fixed to the circuit board.
In some aspects, each earcup includes a driver, and the cable connects with each earcup proximate an acoustically sealed back volume behind the driver. In certain examples, the wiring in each earcup is part of a sealed assembly behind the ear. In further examples, the sealed assembly can enhance passive noise attenuation in the headset.
In particular cases, the audio headset is operational with only one of the earphones such that with one of the earphones removed, a remaining earphone is connected to a power source, enables audio output, and enables audio communication.
In certain aspects, each of the earphones contains a separate microprocessor for enabling independent operation thereof.
In some cases, the pair of earphones includes a pair of earcups.
In particular implementations, the pair of earcups includes a pair of earbuds, a pair of on-ear headphones, or a pair of near-ear headphones.
In certain aspects, the headset further includes an electro-acoustic transducer in each of the earcups for providing an audio output to a user.
Two or more features described in this disclosure, including those described in this summary section, may be combined to form implementations not specifically described herein.
The details of one or more implementations are set forth in the accompanying drawings and the description below. Other features, objects and benefits will be apparent from the description and drawings, and from the claims.
It is noted that the drawings of the various implementations are not necessarily to scale. The drawings are intended to depict only typical aspects of the disclosure, and therefore should not be considered as limiting the scope of the implementations. In the drawings, like numbering represents like elements between the drawings.
This disclosure is based, at least in part, on the realization that an audio headset can benefit from removably coupled earphones that enable servicing, replacement, and/or modularity in operation. In certain examples, an audio headset includes a removably coupled earphone. In particular examples, the audio headset is configured to operate with only one of the coupled earphones.
Commonly labeled components in the FIGURES are considered to be substantially equivalent components for the purposes of illustration, and redundant discussion of those components is omitted for clarity.
A headphone refers to a device that fits around, on, or in an ear and that radiates acoustic energy into the ear canal. Headphones are sometimes referred to as earphones, earpieces, headsets, earbuds or sport headphones, and can be wired or wireless. A headphone includes an acoustic driver to transduce audio signals to acoustic energy. The acoustic driver may be housed in an earphone, which in particular cases, is an earcup. While some of the figures and descriptions following may show a single earphone, an earphone may be a single stand-alone unit or one of a pair of earphones (each including a respective acoustic driver and earcup), one for each ear. An earphone may be connected mechanically to another earphone, for example by a headband and/or by leads that conduct audio signals to an acoustic driver in the earphone. An earphone may include components for wirelessly receiving audio signals. An earphone may include components of an active noise reduction (ANR) system. Earphones may also include other functionality such as a microphone so that they can function as a headset.
In an around or on-the-ear headset, the headset may include a headband and at least one earphone that is arranged to sit on or over an ear of the user. In order to accommodate heads of different sizes and shapes, the earphones are configured to pivot about the vertical and/or horizontal axes, and to translate for some distance along the vertical axis.
Headsets according to various implementations can include a pair of earphones (e.g., on-ear, over-ear, or in-ear) with a headband connecting the earphones. A cable extends through the headband and connects the earphones. The earphones are removably coupled with one another such that the headset is operational with only one of the earphones. In various implementations, the removably coupled earphone(s) can be serviced, replaced, and/or stored while the headset remains operational with the other one of the earphones.
In some cases, the headband 30 can include a first headband segment 40 and a second headband segment 50 that are connected by a spring 60. In various implementations, the spring 60 is located at a top portion of the headset 10 when worn by a user, e.g., proximate the crown or mid-scalp region of the user's head. In certain examples, the spring 60 is optional, such that the headband 30 can be formed of a continuous headband spring (also called a “continuous spring section”), such as described in U.S. Pat. No. 10,743,106 (“Headphone Earcup Mount in Continuous Headband-Spring Headphone System,” issued Aug. 11, 2020), which is incorporated by reference in its entirety.
In some implementations, as depicted in the partial cut-away perspective of the headset 10 in
The spring 60 can include at least one torsion spring that provides a linear clamping force on the headband 30, e.g., a linear clamping force between headband segments 40, 50. In certain cases, the spring 60 can include multiple segments, which may or may not be coupled. In a particular example, as illustrated in the cut-away view of a portion of the headset 10 in
As illustrated in
In particular aspects, through-headband wiring of the cable 70 mitigates mechanical stress on the connection between the first section 140 and the circuit board 130 and the second section 160 and the circuit board 130. In certain implementations, e.g., as illustrated in
In some cases, as seen most clearly in
As noted herein, the cable 70 can connect the earphones 20 through the headband 30 and enable the earphones 20 to be removably coupled with one another (and the headband 30). In some cases, a portion 250 of the cable 70 extending through the headband 30 is positioned in an in-line switchback configuration 260 to mitigate mechanical stress on the cable 70 in response to adjustment (e.g., vertical adjustment) of at least one of the earphones 20. For example, the in-line switchback configuration 260 can be along an arced plane or path defined by an arc axis (a) (
In some cases, e.g., as shown in
As noted herein, in some aspects, each earcup 20 includes a driver (also referred to as an electro-acoustic transducer herein) for providing an audio output to a user. As illustrated in the partially cut-away view of an earcup 20B in
As noted herein, the headset 10 is operational with only one of the earphones 20 (e.g., earphone 20A), such that with one of the earphones removed (e.g., earphone 20B), the remaining earphone 20A is connected to a power source, enables audio output (e.g., at the driver), and enables audio communication (e.g., via a communications device in the microprocessor at each earphone and/or the circuit board 130).
While earphones 20 are illustrated herein as including a pair of over-ear headphones, it is understood that the earphones 20 can include any suitable form of earcup or earphone, e.g., a pair of earbuds, a pair of on-ear headphones, or a pair of near-ear headphones.
In contrast to conventional audio headsets, various implementations include audio headsets that are configured to operate modularly, for example, with one earphone removed from the headset. Further, the audio headsets disclosed according to implementations enable access to individual earphones, e.g., for servicing, replacement and/or modular operation. The audio headsets disclosed herein also include a spring system for enhancing occlusion of the earphones on the user's ear while shielding the user from internal wiring in the headset. Further, the audio headsets disclosed herein can effectively hide cabling from the user's perspective. When compared with conventional headsets, the audio headsets disclosed according to various implementations can provide enhanced modularity, servicing, aesthetic appeal, and comfort for users.
Various mating features and mechanical interfaces are illustrated and described herein. These mating features can enable snap-fit and/or friction-fit interaction between components in the headset 10, e.g., enabling coupling and decoupling of earphones 20 from the headset 10. Particular mating features illustrated herein can include recesses and corresponding protrusions or tabs. Additional example mating features can include pin/slot configurations, tongue/groove configurations, rivet configurations, adhesive couplings, press-fit couplings, snap-fit couplings, welded couplings and/or other known mating couplings. Certain coupling configurations can be combined, e.g., using a threaded coupling with an adhesive such as a glue. Additionally, intervening materials or components such as washers, lubricants, or sleeves can be located between mating features in some implementations.
One or more components described herein can be formed according to known manufacturing methods, e.g., molding, casting, forging or additive (e.g., three-dimensional) manufacturing, and can be formed from known materials, e.g., a metal such as aluminum or steel, a thermoplastic material (e.g., polycarbonate (PC) or acrylonitrile butadiene styrene (ABS)) or a composite material (e.g., PC/ABS). Certain components can include materials used for damping motion, such as silicone, a thermoplastic (e.g., POM) or a thermoplastic elastomer (TPE).
In various implementations, components described as being “coupled” to one another can be joined along one or more interfaces. In some implementations, these interfaces can include junctions between distinct components, and in other cases, these interfaces can include a solidly and/or integrally formed interconnection. That is, in some cases, components that are “coupled” to one another can be simultaneously formed to define a single continuous member. However, in other implementations, these coupled components can be formed as separate members and be subsequently joined through known processes (e.g., soldering, fastening, ultrasonic welding, bonding). In various implementations, electronic components described as being “coupled” can be linked via conventional hard-wired and/or wireless means such that these electronic components can communicate data with one another. Additionally, sub-components within a given component can be considered to be linked via conventional pathways, which may not necessarily be illustrated.
A number of implementations have been described. Nevertheless, it will be understood that additional modifications may be made without departing from the scope of the inventive concepts described herein, and, accordingly, other implementations are within the scope of the following claims.
