The present invention relates generally to the field of audio headsets, and more particularly to a headset including improved comfort and functionality.
Headphones are often used to output audio to a user via a pair of ear cups. Similar to headphones, headsets typically output audio to a user and also include a microphone to, for example, facilitate communicating with others.
Headsets may be used for various applications, such as video gaming. Video games have become increasingly complex and allow gamers to play against individuals via the internet. In addition to the visual aspects of the video games, audio plays an important part in providing the gaming experience. Usually, a gamer will wear a headset that provides game audio to the user's ears, as well as includes a microphone to allow the gamers to communicate with each other.
Game audio often refers to audio generated by a video game, usually during game play. Such audio may include musical soundtracks, sound effects, and other audio. The importance of game audio often depends on the type of video game or the type of interactions involved. For example, in puzzles games, audio may serve to enhance the game play but may not be crucial for proper gamer interaction with the video game. In contrast, game audio may play an important or even crucial role in achieving favorable results for certain video games. For instance, the ability to hear sounds of the surrounding gaming environment may be important in a first-person shooter. Examples of audio that gamers rely on may include footsteps of approaching enemies, doors opening, vehicles, and other game audio. Based on the audio received, a gamer may, for example, communicate with teammates, anticipate their next move, determine their next response, or perform a certain action.
With the increased depth and complexity of video games, users may wear a headset for prolonged or extended periods of time. However, wearing conventional headphones for many hours may cause ear fatigue and discomfort. One major discomfort results from the temperature increase around the gamer's ear after a period of use. This discomfort grows as the length of continuous use extends. In addition, most headsets often do not sufficiently exclude ambient noise.
Conventional headsets also often include fixed constructions such that there is little or no opportunity to easily upgrade or interchange individual components. As a result, conventional headsets may be difficult to repair and may require replacement after a limited number of uses.
Therefore, there is a need for an improved headset.
The present invention relates generally to the field of audio headsets, and more particularly to a headset including improved comfort and functionality.
In one aspect, the headset may include one or more earcup assemblies and a headband assembly. The headband assembly may include a bracket having one or more slots. Each slot of the bracket may be configured to receive a locking mechanism. The locking mechanism may be operable for adjusting a distance between the headband assembly and the one or more earcup assemblies. Further, the headset may include a post that is pivotally attach to an earcup assembly and the locking mechanism to facilitate pivotal movement of the earcup assembly with respect to the headband assembly.
The headband assembly may further include a cushion assembly removably coupled to the bracket. In addition, the cushion assembly may be configured to connect to one or more stoppers of the headband assembly. The cushion assembly may include a top section detachably coupled to a bottom section via, for example, a hook and loop fastener. The top section may include a channel for guiding a flat wire.
The locking mechanism of the headset may be a cam assembly including a housing and thumb pad. The housing may contain a cam and a lockpad. The thumb pad may include a rod having a pin that is configured to interface with the cam. In operation, when thumb pad is rotated, locking mechanism may be configured to compress and secure to the bracket. When unlocked, the user may adjust a distance between the headband assembly and the earcup assembly.
The earcup assemblies of the headset may include a frame, a driver assembly, and an earpad. The driver assembly may be detachably connected to the frame. The earpad may be detachably connected to the driver assembly. As a result, a user may easily interchange various components of each earcup assembly.
It is also contemplated that the earpad is formed of one or more layers. One layer may be configured to cover the remaining layers and formed of an acoustically absorbent material, such as alcantara. Another layer may be a memory foam layer that provides additional comfort to a user. Yet another layer may be a cooling layer, such as a cooling gel to, for example, reduce ear fatigue and discomfort.
The earcup assembly may further comprise a bayonet mount configured to couple with a corresponding bayonet fastener. In addition, the earcup assembly may include an input port. For example, one earcup assembly may include a first input port configured to couple with an audio source and the other earcup assembly may include a second input port configured to couple with a microphone.
While the invention is susceptible to various modifications and alternative forms, specific exemplary embodiments thereof have been shown by way of example in the drawings and have herein been described in detail. It should be understood, however, that there is no intent to limit the invention to the particular embodiments disclosed, but on the contrary, the intention is to cover all modifications, equivalents, and alternatives falling within the scope of the invention as defined by the appended claims.
Embodiments are illustrated by way of example and not limitation in the figures in the accompanying drawings, in which like references indicate similar elements and in which:
The present invention relates generally to audio headsets and more particularly to a headset including improved comfort and functionality. The headset may be shaped to provide a comfortable and proper seal to, for example, reduce ambient noise. In addition, the headset may be configured to include various interchangeable components and may further include several input ports. Advantageously, the headset may be modular and also may facilitate coupling with one or more interfaces, such as an audio source and a microphone.
Turning now to the drawings wherein like numerals represent like components,
As shown, headset 100 also may include a bracket 140 pivotally coupling earcup assembly 104 to locking mechanism 110. Bracket 140 may be curved to conform to the shape of earcup assembly 104. Bracket 140 may be configured to facilitate pivotal movement of earcup assembly 104 with respect to the headband assembly 102 such that a force on the head of the user may be spread evenly around their ears.
Exemplary Headband Assembly 100
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In addition to coupling to headband 106 via stoppers 114, top section 116 of cushion assembly 112 may include a knob (not shown) configured to be inserted into an aperture 160 (
Bottom segment 118 of cushion assembly 112 may be detachably coupled to top segment 116 by a hook-and-loop type fastener. It is further contemplated that segments 116, 118 of padding 120 may be detachably coupled to one another via, for example, buttons, hooks, clasps, pins, or other known fasteners.
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Exemplary Locking Mechanism 110
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Cam 144 may be substantially circular and may include a front surface 162 and a substantially flat back surface 164. As shown, front surface 162 of cam 144 also may include protrusions 166 and depressions 168, each of which is configured to align with protrusions 172 and/or depressions 173 of lockpad 142, as detailed below.
In an exemplary operation, a rotation of thumb pad 136 results in a corresponding rotation of cam 144. While thumb pad is shown to rotate approximately 90 degrees, other rotations are contemplated including, for example, 180 degrees and 360 degrees.
As shown, rotation of thumb pad 136 may correspond to an unlocked position 182 or a locked position 184 of locking mechanism 110. More specifically, when thumb pad 136 is rotated to unlocked position 182, pin 139 may interface with cavity 180 to turn cam 144 such that protrusions 172 of lockpad 142 align with depressions 168 of cam 144. When thumb pad 136 is rotated to locked position 184, pin 139 may interface with cavity 180 to turn cam 144 such that protrusions 172 of lockpad 142 align with protrusions 166 of cam 144. In other words, when rotating thumb pad 136, depressions 168 of cam 144 may correspond to unlocked position 182 and protrusions 166 of cam 144 may correspond to locked position 184.
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Exemplary Earcup Assembly 104
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The height of earcup assembly 104 may range between about eighty millimeters to about one hundred and twenty millimeters, and preferably between about ninety millimeters and one hundred millimeters. In one embodiment, earcup assembly 104 has an approximate height of about ninety-five millimeters.
The width of earcup assembly 104 may range between about sixty millimeters to about ninety millimeters, and preferably between about seventy millimeters and eighty millimeters. In one embodiment, earcup assembly 104 has an approximate height of about seventy-five millimeters.
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Frame 124 may be formed of a plastic material or the like that can be curved (such as by molding) to the desired shape and size. As shown, frame 124 may include an interior surface 123 and an exterior surface 125. Interior surface 123 may include ribs 196 and connectors 198. Ribs 196 may be configured to reinforce the structure of frame 124. Connectors 198 of frame 124 may facilitate attachment to, for example, driver assembly 186 having corresponding connectors 204 (
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Frame 124 also may include several openings, such as a wire opening 129, an interface opening 130, and a post opening 131. Wire opening 129 may be configured to receive wire 122. As shown in
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Driver assembly 186 may facilitate converting an electrical signal to a sound wave and outputting the converted sound wave to a user. Driver assembly 186 may include an input port 132 (
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Further, earpad 126 may include one or more layers to, for example, reduce user ear fatigue and discomfort. As shown in
Second layer 209 may be a gel layer, which may be defined by an encasement of cooling gel. The second layer 209 may be adapted to absorb and retain cool temperatures and resist absorbing heat given off by a wearer's head. It is also contemplated that the second layer 209 may be configured to provide additional cushioning from impacts resulting from the customary use of the earpad 126. A thickness of second layer 209 may range between about four millimeters and about eight millimeters, and preferably between about five millimeters and about seven millimeters. In one embodiments, a thickness of second layer 209 may be about six millimeters.
Third layer 210 may be a membrane formed from an acoustically absorbent material and/or perforated leather, such as Alcantara. Third layer 210 may wrap around or cover other layers, such as first layer 208 and second layer 209. A thickness of third layer 210 may range between about a quarter of a millimeter and about three quarters of a millimeter, and preferably between about a third of a millimeter and about half of a millimeter. In one embodiments, a thickness of third layer 210 may be about four tenths of a millimeter.
In sum, headset 100 may be shaped to provide a comfortable and proper seal to a user. In addition, headset 100 may be configured to include various interchangeable components and may further include several input ports. Advantageously, the headset may be modular and also may facilitate coupling with one or more interfaces, such as an audio source and a microphone.
Further modifications and alternative embodiments of various aspects of the invention will be apparent to those skilled in the art in view of this description. Accordingly, this description is to be construed as illustrative only and is for the purpose of teaching those skilled in the art the general manner of carrying out the invention. It is to be understood that the forms of the invention shown and described in the application are to be taken as examples of embodiments. Components may be substituted for those illustrated and described in the application, parts and processes may be reversed, and certain features of the invention may be utilized independently, all as would be apparent to one skilled in the art after having the benefit of this description of the invention. Changes may be made in the elements described in the application without departing from the spirit and scope of the invention as described in the following claims.