Claims
- 1. A metallic composition having a substantially reduced tendency to lose reversibility between its martensitic and austenitic state as compared with its normal tendency to do so at a given temperature.
- 2. An alloy comprising copper and a metal selected from a group consisting of zinc and aluminum, said alloy having a substantially reduced tendency to lose reversibility between its martensitic and austenitic state as compared with its normal tendency to do so at a given temperature.
- 3. The alloy of claim 2 wherein said metal is zinc.
- 4. The alloy of claim 3 and wherein said alloy contains a third metal selected from the group consisting of aluminum, manganese, silicon and tin.
- 5. The alloy of claim 4 wherein said third metal is silicon.
- 6. The alloy of claim 4 wherein said third metal is aluminum.
- 7. The alloy of claim 4 wherein the third metal is manganese.
- 8. The alloy of claim 2 wherein said metal is aluminum.
- 9. The alloy of claim 7
- wherein said alloy contains a third metal selected from a group consisting of manganese, silicon, tin and zinc.
- 10. The alloy of claim 2 comprising 60-85 wt. % copper, 0 to about 40 wt. % zinc, 0 to about 5 wt. % silicon, 0 to about 14 wt. % aluminum and 0 to about 15 wt. % manganese.
- 11. A method of inhibiting loss of reversibility between the martensitic and austenitic states in a metallic composition comprising holding said composition at a temperature above the M.sub.s temperature while in the austenitic state for a time sufficient to reduce said loss, said holding temperature being one at which there is no significant transformation of the metallic composition to a phase that undergoes no reversible austenite-martensite transformation.
- 12. The process of claim 10 wherein, prior to said holding step, said composition is heated to a temperature substantially above room temperature and is then quenched.
- 13. The process of claim 11 wherein said quenching elevated temperature is a temperature at which the composition is at least substantially wholly in the austenitic state.
- 14. A method according to claim 11 wherein the M.sub.s temperature of the composition is below room temperature and the holding temperature is from about 50.degree. to 125.degree. C.
- 15. A method according to claim 14 wherein the holding time is from about 5 minutes to about 4 hours.
- 16. An alloy comprising copper and a metal selected from the group consisting of zinc and aluminum having a substantially reduced tendency to lose reversibility between its martensitic and austenitic state, said alloy being the product of the process comprising holding said composition at a temperature above the M.sub.s temperature while in the austenitic state for a time sufficient to reduce said tendency to lose reversibility, said holding temperature being one at which there is no significant transformation of the alloy to a phase that undergoes no reversible austenite-martensite transformation.
- 17. An alloy according to claim 16 wherein during said holding, the alloy is substantially free of externally applied stress.
- 18. The alloy of claim 17 wherein said metal is zinc.
- 19. The alloy of claim 18 wherein said alloy contains a third metal selected from the group consisting of aluminum, manganese, silicon and tin.
- 20. The alloy of claim 17 wherein said metal is aluminum.
- 21. The alloy of claim 20 wherein said alloy contains a third metal selected from the group consisting of manganese, silicon, tin and zinc.
- 22. The alloy of claim 17 comprising 60-85 wt. percent copper, 0 to about 40 wt. percent zinc, 0 to about 5 wt. percent silicon, 0 to about 14 wt. percent aluminum and 0 to about 15 wt. percent manganese.
RELATED APPLICATIONS
This application is a continuation-in-part of application Ser. No. 417,067 filed Nov. 19, 1973 and now abandoned.
US Referenced Citations (4)
Number |
Name |
Date |
Kind |
3567523 |
Jackson et al. |
Mar 1971 |
|
3748197 |
Willson et al. |
Jul 1973 |
|
3783037 |
Brook et al. |
Jan 1974 |
|
3802930 |
Brook et al. |
Apr 1974 |
|
Continuation in Parts (1)
|
Number |
Date |
Country |
Parent |
417067 |
Nov 1973 |
|