Automated Electronic Circuit Manfacturing Using Ink Jet Technology

Information

• NSF Award
• 8760091

Owner

• MicroFab Technologies Inc

• Award Id

  8760091

• Award Effective Date

  1/1/1988 - 37 years ago

• Award Expiration Date

  7/31/1988 - 37 years ago

• Award Amount

  $ 49,600.00

• Award Instrument

  Standard Grant

The feasibility of producing electronic circuit boards, flexible circuits, and integrated circuit packages using ink jet technology will be evaluated. If successful, this method could be interfaced with computer aided design systems to produce rapid turnaround of prototypes. Packaging is currently one of the pacing items in most custom circuit development. Application to four specific circuit processes will be evaluated: integrated tape automated bonding, conventional integrated packaging, flex circuits, and printed boards. The feasibility of producing the above will be examined using a variety of materials (both conductive and masking) and substrates. If the project is successful, a Phase II proposal will be submitted.

• Program Officer

  Ritchie B. Coryell

• Min Amd Letter Date

  1/6/1988 - 37 years ago

• Max Amd Letter Date

  1/6/1988 - 37 years ago

• ARRA Amount

• Name

  MicroFab Technologies Inc

• City

  PLANO

• State

  TX

• Country

  United States

• Address

  1104 SUMMIT AVE STE 110

• Postal Code

  750748592

• Phone Number

  9725788076

• First Name

  David

• Last Name

  Wallace

• Email Address

  david.wallace@microfab.com

• Start Date

  1/1/1988 12:00:00 AM

• Name

  Engineering-Electrical

• Code

  55

• Name

  Engineering-Mechanical

• Code

  56

• Name

  Industrial Technology

• Code

  308000