This disclosure generally relates to damping materials used to absorb or attenuate acoustic and/or mechanical vibrations, and deals more particularly with a method and apparatus for automated placement of damping materials on structures.
Damping materials are used in a variety of applications to dampen or attenuate acoustic and/or mechanical vibrations in a structure. For example acoustic dampening materials are commonly used in parts of vehicles to reduce the noise in passenger cabins produced by external sources such as engines and turbulent airflow.
In aircraft applications, patches of viscoelastic material have been added to various parts of an aircraft structure in order to reduce noise and vibration. These patches may be relatively expensive to install, in part due to the hand labor required to fit, cut and bond the patches to uniquely shaped structures on the aircraft. Moreover, these patches add weight to the aircraft which may reduce operating efficiency since several hundred and even thousands of such patches may be required for a typical commercial aircraft.
More recently, relatively lightweight composite laminates have been devised which may incorporate viscoelastic materials that act to absorb and thereby attenuate vibration in aircraft structures. While these new damping materials have a number of advantages, their widespread use on aircraft structures may be limited because of the time and manual labor required for their installation, particularly where the aircraft structure has a complicated geometry and precise hand placement of the viscoelastic material on or within the lamina of the structure is required.
Accordingly, there is a need for automated placement of damping materials on structures such as aircraft which reduces the need for hand labor to install the material, and which may provide rapid placement of the materials with high placement accuracy.
The disclosed embodiments provide for automated placement of acoustic damping materials which reduces reliance on hand labor for installation and may result in higher placement accuracy. A method and apparatus are provided for placing damping materials at high laydown rates, and which are compatible with the layup and assembly processes commonly used to produce large scale aircraft at higher production rates.
According to one method embodiment, damping material may be installed on a structure using a material placement head. The material placement head is moved over the structure and is used to place the damping material on the structure. The head compacts the damping material against the structure, and the movement of the head may be controlled using a programmed computer.
According to another method embodiment damping acoustic vibrations in a structure is performed. A vibration damping tape is produced, and automatic tape placement equipment is employed to place the tape in any of various configurations as a single strip or as multiple side-by-side strips, either of which may be continuous or discontinuous. The tape may include a removable backing which is removed and accumulated on a take-up spool as the tape is being placed on the structure.
According to another embodiment, apparatus is provided for placing damping material on a structure. The apparatus includes a material placement head for placing damping material on the structure, and means for moving the head over the structure. Control means are provided for controlling the operation of the head and the movement of the head. The head may include a supply of damping material, means for dispensing the damping material from the supply, and means for compacting the damping material on the structure. The damping material may be in the form of a tape which is placed by the head as strips onto the structure.
The disclosed embodiments therefore satisfy the need for a method and apparatus for rapidly placing damping material on a structure at high laydown rates with high placement accuracy, and which reduces the need for hand labor.
Referring first to
The damping tape 20 may have a width “W” and may comprise any of a wide range of materials which, as mentioned above, act to reduce the transmission of vibrations. Examples of suitable damping materials that may be used in connection with the disclosed embodiments may be found, without limitation, in US Patent Publication 2008/0277057 A1 published Nov. 13, 2008, the entire disclosure of which is incorporated by reference herein.
Referring particularly to
Referring again to
The material placement head 36 broadly includes a tape supply 40 which dispenses lengths of tape 20 that may be cut by a tape cutter 46, and compacted onto the structure 24 by a compaction roller 48. A tension control 52 may be provided to apply tension to the tape 20 as it is dispensed from the tape supply 40 so that proper tension is applied to the tape 20 until it is placed. Proper tape tension is desired so that the tape 20 feeds properly through the placement head 36 and the tape 20 is held substantially taught against the compaction roller 48 as the tape is being placed onto the structure 24. In the case of the tape 20 illustrated in
A backing take-up device 44 is provided for taking up the backing 30b as it is being removed by the backing remover 42. In other embodiments, a second backing take-up device (not shown) may be provided on the head 36 to take up the upper backing 30a removed from the tape 20. As the head 36 is being moved over the structure 24 by the robotic device 38, a tape cutter 46 cuts the dispensed tape 20 to length while the compaction roller 48 is compacting the cut length of tape 20 onto the structure 24.
Attention is now directed to
The backing remover 42 (
The compaction roller 48 is mounted on a powered compaction slide 80 which is vertically reciprocable, and may selectively displace the compaction roller downwardly into engagement with the structure 24. At the end of the placement of a strip 26 of tape 20, the slide 80 may be powered upwardly so that the compaction roller 48 disengages the structure 24 until the next strip 26 of tape 20 is ready to be placed. The entire material placement head 36 may be releasably mounted on a later discussed robotic device (not shown) by means of a mount 78. Additional details of the material placement head 36 may be at least similar to those disclosed in U.S. Pat. Nos. 4,699,683 and 5,700,347, and US Patent Publication No, 2006/0118244 A1 published Jun. 8, 2006, the entire disclosures of which are incorporated by reference herein. It should be noted here that although the illustrated material placement head 36 has been described as being capable of placing a single strip 26 of tape 20 on a structure 24, other embodiments of the placement head 36 may include multiple tape dispensing mechanisms capable of simultaneously placing multiple strips 26 of tape 20 on a structure 24.
While the material placement head 36 discussed above in connection with
A material placement head 106 is particularly adapted to place the units 102 on a structure 24. The details of the material placement head 106 will vary, depending upon the size and shape of the units 102, and the particular application. Generally, the material placement head 106 may be mounted on a robotic device 38 and may include a manipulator 108 which places the units 102 in desired locations on the structure 24. The manipulator 108 may comprise, for example and without limitation, a pick and place mechanism (not shown). A storage device 100 for holding a supply of the units 102 as well as a dispenser 104 may be carried on the material placement head 106. The storage device 100 may comprise, for example and without limitation a cartridge arrangement in which the units 102 are stacked and individually moved by the dispenser 104 to the material placement head 106 which places the units 102 onto the structure 24.
Operator input/output controls 118 may allow an operator to program the computer 110 and alter the software programs 114 as required. Data such as part numbers and other information relating to the structure 24 or the operation of the placement head 36 may be stored in a memory 116. Also, the memory 116 can be used to store the boundaries 25 (
At 132, tape is dispensed from the spool 54 and the head 36 is moved along a path that has been programmed in the computer 128. As the tape is being dispensed from the spool 54, the lower backing 30b is separated and accumulated on the take up spool 70, as shown at step 134. As the tape is being dispensed and fed to the compaction roller 48, the tape 20 is compacted against the structure 24, as shown at 136. At 138, the tape 20 being placed is cut to length for each tape strip 26.
Embodiments of the disclosure may find use in a variety of potential applications, particularly in the transportation industry, including for example, aerospace, marine and automotive applications. Thus, referring now to
Each of the processes of method 150 may be performed or carried out by a system integrator, a third party, and/or an operator (e.g., a customer). For the purposes of this description, a system integrator may include without limitation any number of aircraft manufacturers and major-system subcontractors; a third party may include without limitation any number of vendors, subcontractors, and suppliers; and an operator may be an airline, leasing company, military entity, service organization, and so on.
As shown in
Systems and methods embodied herein may be employed during any one or more of the stages of the production and service method 150. For example, components or subassemblies corresponding to production process 150 may be fabricated or manufactured in a manner similar to components or subassemblies produced while the aircraft 152 is in service. Also, one or more apparatus embodiments, method embodiments, or a combination thereof may be utilized during the production stages 158 and 160, for example, by substantially expediting assembly of or reducing the cost of an aircraft 152. Similarly, one or more of apparatus embodiments, method embodiments, or a combination thereof may be utilized while the aircraft 152 is in service, for example and without limitation, to maintenance and service 166.
Although the embodiments of this disclosure have been described with respect to certain exemplary embodiments, it is to be understood that the specific embodiments are for purposes of illustration and not limitation, as other variations will occur to those of skill in the art.
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