Claims
- 1. A multi-station molding system for use with bottom and top molds that are assembleable into mold sets, said system comprising:
- a means for placing at least one package which comprises a lead frame and a semiconductor chip into a cavity located within said bottom and top molds;
- a means for inserting molding material into said cavity to encapsulate, in liquid form, said semiconductor chip of said package, said means for inserting being operably separate from said means for placing;
- a means for curing said liquid molding material to form a solid encapsulation of said semiconductor chip during cycling and transporting away from said means for inserting of said bottom and top molds assembled together with said package located therein, said means for curing having clamp means coupled to a plurality of walking beams for holding together said bottom and top molds during said cycling and being operably separate from said means for placing and said means for inserting; and
- a means for positioning said package for removal therefrom.
- 2. A multi-station molding system for use with bottom and top molds that are assembleable into mold sets, said system comprising:
- a means for placing at least one article into a cavity located within said bottom and top molds;
- a means for inserting molding material into said cavity to encapsulate, in liquid form, at least a portion of said article, said means for inserting being operably separate from said means for placing;
- a means for curing said liquid molding material to form a solid encapsulation of said at least a portion of said article during the cycling and transporting away from said means for inserting of said bottom and top molds assembled together with said article located therein, said means for curing having clamp means coupled to a plurality of walking beams for holding together said bottom and top molds during said cycling and being operably separate from said means for placing and said means for inserting; and
- a means for positioning said article for removal therefrom.
- 3. The molding system as in claim 1 wherein said means for placing, said means for inserting, and said means for curing are in-line with each other.
Parent Case Info
This is a Division of application Ser. No. 586,855, filed March 6, 1984 now U.S. Pat. No. 4,575,328.
US Referenced Citations (11)
Foreign Referenced Citations (4)
Number |
Date |
Country |
2114366 |
Nov 1972 |
DEX |
2425493 |
Dec 1975 |
DEX |
0105332 |
Jun 1982 |
JPX |
0048316 |
Mar 1985 |
JPX |
Divisions (1)
|
Number |
Date |
Country |
Parent |
586855 |
Mar 1984 |
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