Patent Application
20130235600
Automatic vehicle exterior light control systems provide a significant convenience function for drivers by alleviating the burden of manually switching between high and low beam headlights in response to changing traffic conditions. It is known that drivers, on average, do not utilize their high beam headlights as often as is appropriate. High beam headlights can provide from two to four, or more, times the visibility distance at night as compared to low beam headlights. Thereby, a driver of a controlled vehicle is enabled to detect an obstacle or pedestrian at night earlier than otherwise would be the case. There is a safety benefit during night time driving introduced by automating the beam switching task and increasing the average utilization of high beam headlights.
Known systems designed to automatically control vehicle exterior lights utilize a forward looking digital imaging system to acquire images of the scene generally in front of the controlled vehicle, to analyze the images and to detect headlights of oncoming vehicles and taillights of leading vehicles. It has become apparent that repeatable and predictable vehicle to vehicle system operation suffers when misalignment is present in the corresponding imaging assemblies.
What are needed are automatic vehicle exterior light control systems that provide improved features to accurately detect related images generally forward of a controlled vehicle. Systems configured to automatically account for minor imager assembly misalignments are also needed.
The present invention provides automatic vehicle exterior light control systems that provide improved features to accurately detect related images generally forward of a controlled vehicle. Systems configured to automatically account for minor imager assembly misalignments are also provided.
In at least one embodiment, an imager assembly mounting means is provided that insures accurate alignment of an imager assembly with respect to the desired field of view. In a related embodiment, an imager assembly mounting means provides for quick installation within an associated controlled vehicle.
In at least one embodiment, features are provided within the imager assembly mounting means that insure proper selection for the specific controlled vehicle requirements. In a related embodiment, incorrect assembly is prevented.
In at least one embodiment, an imager assembly mounting means is provided that exploits use of snap together components for quick and efficient manufacturing. In a related embodiment, a minimum of tools are required for assembling the imager assembly mounting means.
In at least one embodiment, various improvements of the present invention are integrated with other vehicular systems. In at least one related embodiment, the various integrated systems are configured to share components for improved operation and, or, to lower associated costs.
Other advantages of the present invention will become apparent when reading the following detail description in light of the figures, examples and appended claims.
a depicts a perspective view of an interior rearview mirror assembly;
b depicts a second perspective view of the mirror assembly of
a and 16b depict actual image sensor alignment values;
Referring initially to
Turning now to
When viewed from an image sensor's perspective, and as used herein, the x-axis is a longitudinal axis associated with a controlled vehicle (i.e. the optical axis of the image sensor), the y-axis is a cross-car axis associated with a controlled vehicle (i.e. horizontal axis of the image sensor) and the z-axis is a vertical axis of an associated controlled vehicle (i.e. vertical axis of the image sensor). Vertical rotation of the image sensor refers to rotation about the y-axis, defined in terms of up/down angular motion. Horizontal rotation of the image sensor refers to rotation about the z-axis, defined in terms of left/right angular motion. Skew rotation of the image sensor refers to rotation about the x-axis. Angular variation of an imager board installed in a controlled vehicle has a direct effect on the optical axis of the image sensor. Angular rotation shifts the “sweet spot” and the field of view causing increased field limit in one direction and decreased field limit in another direction. Positional variation of an imager board installed in a controlled vehicle has minimal effect on performance of an associated automatic vehicle exterior light control system. Millimeters of positional movement, which is a typical tolerance, causes little angular variation of the optical axis (i.e. typically less than 0.001 degree) at distances of 300 meters or greater. A preferred nominal image sensor field of view when incorporated in an automatic vehicle exterior light control system is approximately 12 degrees left, approximately 12 degrees right, approximately 4 degrees up and approximately 4 degrees down with respect to the optical axis.
Associated mechanical variations may be due to anyone, or a combination, of: 1) carrier/baffle tolerance, board surface; 2) carrier/baffle tolerance, registration portions; 3) attachment member, carrier/baffle mounting surface; 4) attachment member, button receptacle and 5) imager board thickness. Table 1 summarizes angular variations.
Expected controlled vehicle level variations may include anyone or combinations of: 1) windshield form, sag tolerance; 2) sheet metal variation; 3) adhesive thickness; 4) windshield position; 5) button position; 6) button rotation; 7) “Bigfoot” button; 8) button adhesive; 9) vehicle attitude build variation and 10) vehicle load. Tables 2 through 4 contain summaries of data related to vehicle level variations.
Turning now to
Imager board 410, 510 is provided with an image sensor with lens 411. In a preferred embodiment, the imager board will also include an image sensor control logic and timing circuit, communication line drivers and wire harness receptacle 413. Optionally, the imager board may comprise a processor for receiving and, at least partially, processing images obtained from the image sensor. In a preferred embodiment, the image sensor and at least one other device selected from the group comprising; 1) an image sensor control logic; 2) an ND converter; 3) a low voltage differential signal line driver; 4) a temperature sensor; 5) a control output; 6) a voltage regulator; 7) a second image sensor; 8) a microprocessor; 9) a moisture sensor and 10) a compass are integrated in a common ASIC, most preferably on a common silicon wafer. Preferably, the image sensor with lens 411 includes lens cover snap portions 412 for engaging lens cover 420, 520 snap clips 421. The lens cover has an aperture 422 for alignment with the optical axis of the image sensor and lens. Various suitable optical systems, such as those depicted and described in commonly assigned U.S. Pat. Nos. 5,990,469; 6,008,486; 6,130,421; 6,130,448; 6,049,171; and 6,403,942 and U.S. Patent Application Attorney Docket number AUTO 318V1; the disclosures of which are incorporated herein in their entireties by reference; may be employed.
An imager board wiring harness (not shown) is preferably provided with plugs on either end thereof. The imager board is preferably provided with a male receptacle 413 for receiving one of the plugs of the imager board wiring harness (not shown).
With additional reference to
Once the imager board is in place upon the carrier/baffle, the imager board retainer 445, 545 is placed such that the imager board is retained upon the carrier/baffle. Preferably, the imager board retainer comprises hinge portions 446 that are received within the hinge receptacles 534, 834 with the imager board retainer substantially perpendicular to the carrier/baffle. The imager board retainer is preferably then pivoted around the hinge portions such that the clip portions 447 are received within clip receptacles 535, 835 and retained therein via interlocking clips. It should be understood that the imager board retainer may be configured to snap in place at three, four or more points in lieu of the hinge portions on one end.
A far field baffle 450, 550 is snapped onto the carrier/baffle such that the aperture 452, 552 is aligned with the baffle aperture 832 and such that the far field baffle snap clips 451, 551 are engaged with far field snap portions 443 on either side of the baffle. The far field baffle, in part, defines the field of view of the associated image sensor.
The carrier/baffle 430, 530 is placed proximate the attachment member 455, 555, 655, 755 such that the registration portions 837 are received within the registration receptacles 456, 556, 656. Four fasteners 475, 575 are placed through fastener slots 457, 557, 657, 757 and received within fastener receptacles 841 to secure the carrier/baffle to the attachment member. Alternatively, an alignment shim assembly 458 may be provided with individually removable alignment shims 459. Each alignment shim is provided with at least a first graduation 459a and, preferably, with second and third graduations 459b, 459c, respectively. The alignment shims may provide a means for expanding the applicability of any one accessory and rearview mirror mount assembly 405, 505 to a broader array of vehicles and windshield configurations. Preferably, the fasteners are threaded screws and the fastener receptacles are provided with mating threads. Optionally, the fasteners and fastener receptacles may be configured with interference fit functionality such that the fasteners are pressed into the fastener receptacles. It should be understood that the carrier/baffle may be configured to snap onto the attachment member in lieu of using fasteners.
The transparent cover 480, 580 is attached to the front housing 485, 585 such that the transparent cover is fixed to the front housing to close the aperture 486. The transparent cover may be assembled with a spring clip 481 using housing interlocks 481a, 481b and spring clip interlocks (shown as elements 1589a, 1589b in
With further reference to
As further shown in
With additional reference to
In a preferred embodiment, the attachment member is provided with stiffeners 759 located proximate the fastener slots 457, 657, 757. Most preferably, the attachment member is provided with a ground connector feature 758 for facilitating connection of the ground connector (shown as element 1417 in
As can be seen from
It should be understood that materials other than zinc may be used for the attachment member such as steel, steel alloys, aluminum, aluminum alloy, rigid plastics, polymers, and the like. It is within the scope of the present invention to use composite materials such as fiber class, fiber reinforced plastics, etc.
Turning now to
Imager board 910, 1010 is provided with an image sensor with lens. In a preferred embodiment, the imager board will also include an image sensor control logic and timing circuit, communication line drivers and wire harness receptacle 913. Optionally, the imager board may comprise a processor for receiving and, at least partially, processing images obtained from the image sensor. In a preferred embodiment, the image sensor and at least one other device selected from the group comprising; 1) an image sensor control logic; 2) an ND converter; 3) a low voltage differential signal line driver; 4) a temperature sensor; 5) a control output; 6) a voltage regulator; 7) a second image sensor; 8) a microprocessor; 9) a moisture sensor and 10) a compass are integrated in a common ASIC, most preferably on a common silicon wafer. Preferably, the image sensor with lens includes lens cover snap portions for engaging lens cover 920, 1020 snap clips. The lens cover has an aperture for alignment with the image sensor and lens.
An imager board wiring harness (not shown) is preferably provided with plugs on either end thereof. The imager board is preferably provided with a male receptacle 913 for receiving one of the plugs of the imager board wiring harness.
In a preferred assembly method, an imager board and an imager board wiring harness are provided and the wiring harness is plugged into the associated receptacle 913. The lens cover is snapped onto the lens and the imager board is placed on the carrier/baffle such that alignment pins are received within alignment holes such that the imager with lens and lens cover are aligned with the baffle aperture. Preferably, the alignment pins and, or, holes are slightly tapered such that the pins are initially freely received within the alignment holes then become snug once the imager board is pressed into place upon the carrier/baffle. Preferably, the lens cover is further secured in place by the lens cover retainers. It should be understood that the baffle may be a separate part that snaps in place on a separate carrier.
Once the imager board is in place upon the carrier/baffle, the imager board retainer 945, 1045 is placed such that the imager board and compass sensor board are retained upon the carrier/baffle. Preferably, the imager board retainer comprises hinge portions that are received within the hinge receptacles with the imager board retainer substantially perpendicular to the carrier/baffle. The imager board retainer is preferably then pivoted around the hinge portions such that the clip portions are received within clip receptacles and retained therein via interlocking clips. It should be understood that the imager board retainer may be configured to snap in place at four points in lieu of the hinge portions on one end.
A far field baffle is preferably snapped onto the carrier/baffle such that the aperture is aligned with the baffle aperture and such that the far field baffle snap clips are engaged with far field snap portions on either side of the baffle. The far field baffle, in part, defines the field of view of the associated image sensor.
The carrier/baffle 930, 1030 is placed proximate the attachment member 955, 1055 such that the registration portions are received within registration receptacles. Once the carrier/baffle is aligned with the attachment member the four fasteners 975, 1075 are placed through fastener slots 957, 1057 and received within fastener receptacles to secure the carrier/baffle to the attachment member. Preferable, the fasteners are threaded screws and the fastener receptacles are provided with mating threads. Optionally, the fasteners and fastener receptacles may be configured with interference fit functionality such that the fasteners are pressed into the fastener receptacles. It should be understood that the carrier/baffle may be configured to snap onto the attachment member in lieu of using fasteners.
The transparent cover 980, 1080 is attached to the front housing 985, 1085 such that the transparent cover is fixed to the front housing to close the aperture 986, 1086. The transparent cover may be assembled with a spring clip 981 using housing interlocks (shown as elements 1581a, 1581b in
Turning now to
Imager board 1110, 1210 is provided with an image sensor with lens. In a preferred embodiment, the imager board will also include an image sensor control logic and timing circuit, communication line drivers and wire harness receptacle 1113. Optionally, the imager board may comprise a processor for receiving and, at least partially, processing images obtained from the image sensor. In a preferred embodiment, the image sensor and at least one other device selected from the group comprising; 1) an image sensor control logic; 2) an ND converter; 3) a low voltage differential signal line driver; 4) a temperature sensor; 5) a control output; 6) a voltage regulator; 7) a second image sensor; 8) a microprocessor; 9) a moisture sensor and 10) a compass are integrated in a common ASIC, most preferably on a common silicon wafer. Preferably, the image sensor with lens includes lens cover snap portions for engaging lens cover 1120, 1220 snap clips. The lens cover has an aperture for alignment with the image sensor and lens.
An imager board wiring harness is preferably provided with plugs on either end thereof. The imager board is preferably provided with a male receptacle 1113 for receiving one of the plugs of the imager board wiring harness.
In a preferred assembly method, an imager board and an imager board wiring harness are provided and the wiring harness is plugged into the associated receptacle 1113. The lens cover is snapped onto the lens and then the imager board is placed on the carrier/baffle such that alignment pins are received within alignment holes such that the imager with lens and lens cover are aligned with the baffle aperture. Preferably, the alignment pins and, or, holes are slightly tapered such that the pins are initially freely received within the alignment holes then become snug once the imager board is pressed into place upon the carrier/baffle. Preferably, the lens cover is further secured in place by lens cover retainers. It should be understood that the baffle may be a separate part that snaps in place on a separate carrier.
Once the imager board is in place upon the carrier/baffle, the imager board retainer 1145, 1245 is placed such that the imager board and compass sensor board are retained upon the carrier/baffle. Preferably, the imager board retainer comprises hinge portions that are received within the hinge receptacles with the imager board retainer substantially perpendicular to the carrier/baffle. The imager board retainer is preferably then pivoted around the hinge portions such that the clip portions are received within clip receptacles and retained therein via interlocking clips. It should be understood that the imager board retainer may be configured to snap in place at four points in lieu of the hinge portions on one end.
A far field baffle 1150, 1250 is snapped onto the carrier/baffle such that the aperture is aligned with the baffle aperture and such that the far field baffle snap clips are engaged with far field snap portions on either side of the baffle. The far field baffle, in part, defines the field of view of the associated image sensor.
The carrier/baffle 1130, 1230 is placed proximate the attachment member 1155, 1255 such that the registration portions are received within registration receptacles. Once the carrier/baffle is aligned with the attachment member, the four fasteners 1175, 1275 are placed through fastener slots and received within fastener receptacles to secure the carrier/baffle to the attachment member. Preferable, the fasteners are threaded screws and the fastener receptacles are provided with mating threads. Optionally, the fasteners and fastener receptacles may be configured with interference fit functionality such that the fasteners are pressed into the fastener receptacles. It should be understood that the carrier/baffle may be configured to snap onto the attachment member in lieu of using fasteners.
The transparent cover 1180, 1280 is attached to the front housing 1185, 1285 such that the transparent cover is fixed to the front housing to close the aperture 1186. The transparent cover may be assembled with a spring clip 1181 using housing interlocks (shown as elements 1581a, 1581b in
The accessory and rearview mirror mount assembly 1105, 1205 embodiment depicted in
Turning now to
Imager board 1310, 1410 is provided with an image sensor with lens 1311. In a preferred embodiment, the imager board will also include an image sensor control logic and timing circuit, communication line drivers and wire harness receptacle 1313. Optionally, the imager board may comprise a processor for receiving and, at least partially, processing images obtained from the image sensor. In a preferred embodiment, the image sensor and at least one other device selected from the group comprising; 1) an image sensor control logic; 2) an ND converter; 3) a low voltage differential signal line driver; 4) a temperature sensor; 5) a control output; 6) a voltage regulator; 7) a second image sensor; 8) a microprocessor; 9) a moisture sensor and 10) a compass are integrated in a common ASIC, most preferably on a common silicon wafer. Preferably, the image sensor with lens 1311 includes lens cover snap portions 1312 for engaging lens cover 1320, 1420 snap clips 1321. The lens cover has an aperture 1322 for alignment with the image sensor and lens.
Imager board wiring harness 1315, 1415 is preferably provided with plugs 1316 on either end thereof. In a preferred embodiment, the imager board wiring harness comprises nine pin plugs and receptacles with all nine pins aligned in a common plane. The imager board wiring harness preferably comprises seven similarly sized individually insulated conductors bundled together with a larger insulated ground conductor spirally wound around the seven conductors with a shielded outer jacket placed over the seven conductors and the ground wire. Preferably, the seven wires are all terminated within an associated plug, on the end opposite the imager board receptacle end, with a grounded connection on pins 1 and 6, a positive data clock connection on pin 2, a negative data clock on pin 3, an unregulated positive 12 volt connection on pin 4, an unregulated 12 volt reference connection on pin 5, positive data connection on pin 7 and a negative data connection on pin 8. Preferably, the imager board receptacle end of the imager board wiring harness is identical to the opposite end except for the fact that the larger insulated ground wire is not terminated in the plug, it is instead terminated with a ground connector 1317, 1417.
As shown in
In a preferred assembly method, a compass sensor board and a compass board wiring harness are provided and the wiring harness is plugged into the associated receptacle. An imager board and an imager board wiring harness are provided and the wiring harness is plugged into the associated receptacle. The compass sensor board is then placed within compass board receptacle 1442 of the carrier/baffle 1330, 1430. The lens cover is snapped onto the lens and then the imager board is placed on the carrier/baffle such that the alignment pins 1431 are received within the alignment holes 1414 such that the imager with lens and lens cover are aligned with the baffle aperture. Preferably, the alignment pins and, or, holes are slightly tapered such that they are initially freely received within the alignment holes then become snug once the imager board is pressed into place upon the carrier/baffle. Preferably, the lens cover is further secured in place by the lens cover retainers. It should be understood that the baffle may be a separate part that snaps in place on a separate carrier.
Once the compass sensor board and imager board are in place upon the carrier/baffle, the imager board retainer 1345, 1445 is placed such that the imager board and compass sensor board are retained upon the carrier/baffle. Preferably, the imager board retainer comprises hinge portions 1346, 1446 that are received within the hinge receptacles 834 with the imager board retainer substantially perpendicular to the carrier/baffle. The imager board retainer is preferably then pivoted around the hinge portions such that the clip portions 1347, 1447 are received within clip receptacles and retained therein via interlocking clips. It should be understood that the imager board retainer may be configured to snap in place at four points in lieu of the hinge portions on one end.
A far field baffle 1350, 1450 is snapped onto the carrier/baffle such that the aperture 1352, 1452 is aligned with the baffle aperture and such that the far field baffle snap clips 1351, 1451 are engaged with far field snap portions on either side of the baffle. The far field baffle, in part, defines the field of view of the associated image sensor.
The carrier/baffle 1330, 1430 is placed proximate the attachment member 1355, 1455 such that the registration portions are received within the registration receptacles 1356, 1456. Once the carrier/baffle is aligned with the attachment member and the compass board wiring harness is threaded through the lower aperture the four fasteners 1375, 1475 are placed through fastener slots 1357, 1457 and received within fastener receptacles to secure the carrier/baffle to the attachment member. Preferable, the fasteners are threaded screws and the fastener receptacles are provided with mating threads. Optionally, the fasteners and fastener receptacles may be configured with interference fit functionality such that the fasteners are pressed into the fastener receptacles. It should be understood that the carrier/baffle may be configured to snap onto the attachment member in lieu of using fasteners.
The transparent cover 1380, 1480 is attached to the front housing 1385, 1485 such that the transparent cover is fixed to the front housing to close the aperture 1386. Preferable, the transparent cover is fixed to the front cover with heat staking and/or adhesive. Alternately, the transparent cover may be integrally molded with the front housing, assembled with spring clips or use of an elastic boot. Preferably, the transparent cover is substantially transparent to light rays in the visible spectrum, however, incorporates an infrared and, or, ultra violet spectral filter characteristic. Thereby, substantially blocking infrared and, or, ultra violet light rays from impinging upon the image sensor. Front housing 1385, 1485 is preferable provided with a recessed periphery with snap interlock 1387, 1487 to engage an inner perimeter with snap interlock 1393, of a rear housing 1390, 1490. The front housing and rear housing combine to define an enclosure.
Turning now to
a and 16b depict actual results of data relating to the alignment of image sensors installed in two different controlled vehicle types. The variations shown are for vehicles of the same type compared to one another. It is preferably to maintain an overall sensor field of view within a +/−2.5 degree range from a nominal design value.
Turning now to
Automatic vehicle exterior light control system performance may be affected by shifts in the image sensor optical axis. When misalignment is present, often even the most frequently encountered light sources will not be focused in the correct pixel zones expected by the corresponding image analysis algorithms. Algorithms to self calibrate the alignment of the image sensor with the longitudinal axis of the vehicle may be provided to correct for minor misalignment when pixels around the perimeter of the imager are so configured. It should be understood that a mechanical image sensor repositioning means may be provided that allows either automatic and, or, manual image sensor alignment. The automatic means may comprise inputs from other controlled vehicle equipment such as pitch sensors, yaw sensors, turning sensors, breaking sensors, acceleration sensors, load sensors, etc. In plant calibration and, or, dynamic calibration means may be provided.
Automatic vehicle exterior light control system performance may be impacted when the field of view of the image sensor is limited horizontally. When misalignment is present reduced curve performance often is experienced, high beam headlight glare to passing vehicles is often experienced and high beam headlights often return to full brightness and, or, incorrect aim before an on-coming car is past. Table 5 and 6 and
Automatic vehicle exterior light control system performance may be affected by limiting the image sensor vertical field of view. Reduced hill performance is often experienced. It is difficult to quantify loss in performance because headlamp light output varies greatly through vertical angles.
The above description is considered that of the preferred embodiments only.
Modifications of the invention will occur to those skilled in the art and to those who make or use the invention. Therefore, it is understood that the embodiments shown in the drawings and described above are merely for illustrative purposes and not intended to limit the scope of the invention, which is defined by the following claims as interpreted according to the principles of patent law, including the doctrine of equivalents.
This application is a continuation of U.S. patent application Ser. No. 10/783,273 filed Feb. 20, 2004, and now published as U.S. Pat. App. Publ. No. 2004/0164228, which claims priority, under 35 U.S.C. §119(e), to U.S. provisional patent application Ser. No. 60/448,793, filed on Feb. 21, 2003. The disclosure of the above mentioned applications are hereby incorporated herein in their entirety by reference.
| Number | Date | Country | |
|---|---|---|---|
| 60448793 | Feb 2003 | US |
| Number | Date | Country | |
|---|---|---|---|
| Parent | 10783273 | Feb 2004 | US |
| Child | 13855912 | US |
