Information
-
Patent Grant
-
6598727
-
Patent Number
6,598,727
-
Date Filed
Wednesday, March 13, 200222 years ago
-
Date Issued
Tuesday, July 29, 200321 years ago
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Inventors
-
Original Assignees
-
Examiners
- Ellis; Christopher P.
- Ridley; Richard
Agents
- Varndell & Varndell, PLLC
-
CPC
-
US Classifications
Field of Search
US
- 221 186
- 221 187
- 221 194
- 221 200
- 221 202
- 221 204
- 221 190
- 414 415
- 414 7451
- 414 7457
- 414 7974
- 414 798
- 198 396
- 198 7521
- 198 533
- 198 536
- 198 5502
-
International Classifications
-
Abstract
An automatic wire alignment apparatus that can rapidly align wires on an alignment plate is provided. The apparatus includes an elongated alignment plate 10 having parallel grooves 11 for respectively holding a single wire A, a wire supply box 20, vibration generator 30 for vibrating the wire supply box 20. The vibrating causes the wires A in the wire supply box 20 to descend toward the alignment plate 10. A conveyor 40 moves the wire supply box 20, so that the wire supply box 20 is moved relative to the alignment plate 10 in a direction perpendicular to the grooves 11 in the alignment plate 10, and the wires A respectively descend into grooves 11 in the alignment plate 10.
Description
BACKGROUND OF THE INVENTION
1. Field of the Invention
The present invention pertains to an automatic wire alignment apparatus, and more particularly, to an automatic wire alignment apparatus that individually houses wires in grooves formed in an alignment plate.
2. Description of the Related Art
For example, in a heat exchange apparatus or similar apparatus, a multiplicity of wires used to maintain the spaces between coolant pipes formed in a zigzag shape and to increase the heat release surface area are fixed to the coolant pipes using a method such as soldering or welding.
Incidentally, in the heat exchange apparatus described above, the a multiplicity of wires must be aligned parallel to each other when they are placed on the coolant pipes.
As a result, in order to promote ease of assembly, the necessary number of a multiplicity of wires described above are aligned and housed beforehand in grooves formed in an aligning plate, and the a multiplicity of wires aligned in the alignment plate grooves are held in that state by an electromagnet or like means and placed on the coolant pipes formed in a zigzag shape.
However, because the above process of aligning and housing the a multiplicity of wires in the alignment plate grooves is performed manually, it requires considerable time and labor.
SUMMARY OF THE INVENTION
Accordingly, an object of the present invention is to provide an automatic wire alignment apparatus that can rapidly place wires into grooves formed in an alignment plate.
The automatic wire alignment apparatus pertaining to the present invention includes an elongated alignment plate in which is formed parallel grooves each of which houses a wire, a wire supply box that houses a multiplicity of wires, vibration generating means that causes the wire supply box to vibrate, thereby causing the wires located in the wire supply box to descend toward the alignment plate, and conveyance means that moves one or both of the alignment plate and the wire supply box, wherein the wire supply box is moved by the conveyance means relative to the alignment plate in a direction perpendicular to the grooves in the alignment plate, and the wires that are caused to descend from the wire supply box are housed individually in each groove in the alignment plate.
According to the automatic wire alignment apparatus of this invention, the wires contained in the wire supply box are caused to descend via vibration, and the wires that have descended are sequentially housed in grooves formed in an alignment plate due to the movement of the wire supply box relative to the alignment plate.
In the automatic wire alignment apparatus pertaining to the present invention, the side plates of the above wire supply box, which are located across the width of the alignment plate, are placed on the wire supply box in a vertically movable fashion, and each side plate is urged by a spring such that the bottom edge thereof is in continuous contact with the alignment plate.
According to the automatic wire alignment apparatus of this invention, because each side plate of the wire supply box is urged by a spring such that the bottom edge thereof is in continuous contact with the alignment plate, the wires are reliably forced downward by the side plates into the grooves in the alignment plate.
Furthermore, in the automatic wire alignment apparatus pertaining to the present invention, the inner edge surface of each side plate is formed as a slanted surface.
According to this invention, the wires are reliably guided and forced downward into the grooves in the alignment plate by the slanted surface formed on the inner edge surface of each side plate.
BRIEF DESCRIPTION OF THE DRAWINGS
FIG. 1
is a conceptual cross-section showing the automatic wire alignment apparatus pertaining to the present invention; and
FIG. 2
is a partial cross-section showing an expanded view of the important components of the automatic wire alignment apparatus pertaining to the present invention.
DESCRIPTION OF THE PREFERRED EMBODIMENTS
The automatic wire alignment apparatus pertaining to the present invention will now be explained with reference to an embodiment thereof shown in the drawings.
FIG. 1
is a conceptual cross-section of the automatic wire alignment apparatus pertaining to the present invention.
FIG. 2
is a partial cross-section showing an expanded view of the important components of the automatic wire alignment apparatus pertaining to the present invention.
The automatic wire alignment apparatus shown in the drawings includes an elongated alignment plate
10
in which are formed parallel grooves
11
each of which houses a wire A, a wire supply box
20
that houses a multiplicity of wires A, vibration generating means
30
that causes the wire supply box
20
to vibrate, thereby causing the wires A located in the wire supply box
20
to descend toward the alignment plate
10
, and conveyance means
40
that moves the wire supply box
20
.
The wire supply box
20
has a wire housing unit
23
that is formed by side plates (edge plates)
21
and side plates
22
in a rectangular shape as seen from a plan view perspective. The edge plates
21
are each supported by the wire supply box
20
such that they are in slidable contact with one of two rails
24
, and are each forced downward by one of two springs
25
. The inner surface of the bottom edge of each edge plate
21
is formed as a slanted surface
26
, as shown in
FIG. 2
, and the width of the bottommost edge is set to be identical to the diameter of each wire A. The wire supply box
20
is located such that it straddles the alignment plate
10
, and is placed on the top surface of the alignment plate
10
via a low-friction material
27
applied to the bottom surface of the wire supply box
20
. Moreover, this wire supply box
20
has a linking plate
28
located between the side plates
22
and below the alignment plate
10
and extending the full distance therebetween.
The vibration generating means
30
is located below the alignment plate
10
. This vibration generating means
30
has a vibration platform
33
placed on a rail
32
that is constructed on the top surface of a frame
31
, as well as a vibrating cylinder
34
that is located in the center of the frame
31
. The plunger
34
a
of the cylinder
34
is located adjacent to the vibration platform
33
. Furthermore, an adherence cylinder
35
with a precision regulator is located on the top surface of the vibration platform
33
. Adherence means
36
is located on the tips
35
a
of the piston rods
35
a
of this precision regulator-equipped adherence cylinder
35
. The adherence means
36
adheres to the linking plate
28
of the wire supply box
20
, and keeps the wire supply box
20
in contact with the alignment plate
10
through the application of a constant fixed pressure. The frame
31
is movably located via a rail
37
located parallel to the alignment plate
10
.
The conveyance means
40
is located below the vibration generating means
30
. The conveyance means
40
comprises a rod-less cylinder
41
and is located such that it can travel along the rail
37
of the vibration generating means
30
. This rod-less cylinder
41
is linked to the frame
31
of the vibration generating means
30
via a damper
42
.
The automatic wire alignment apparatus having the construction described above is operated as follows.
When the rod-less cylinder
41
of the conveyance means
40
is operated, the frame
31
of the vibration generating means
30
is moved along the rail
37
via the damper
42
. The wire supply box
20
is then moved along the alignment plate
10
via the precision regulator-equipped adherence cylinder
35
.
During this time, the vibration cylinder
34
of the vibration generating means
30
is operated. The vibration generated by the vibration cylinder
34
is transmitted to the vibration platform
33
via the plunger
34
a
, and is further transmitted to the wire supply box
20
via the precision regulator-equipped adherence cylinder
35
.
In other words, in this automatic wire alignment apparatus, the wire supply box
20
is moved along the alignment plate
10
while being vibrated by the rod-less cylinder
41
and the vibration generating means
30
.
Therefore, the wires A located in the wire housing unit
23
are in part compelled to descend to the top of the alignment plate
10
due to vibration, and the wires A that have descended are sequentially guided to the grooves
11
in the vibration plate
10
by one of the slanted surfaces
26
of the edge plates
21
and become housed in the grooves
11
, as shown in FIG.
2
. While this is taking place, if a wire A becomes wedged between the edge of the edge plate
21
and the alignment plate
10
, the edge plate
21
escapes upward, the wire A is prevented from being permanently wedged between the edge plate
21
and the alignment plate
10
, and the wire A is pressed into the groove
11
by the edge of the edge plate
21
.
Because the vibration of the vibration generating means
30
is absorbed by the damper
42
, it is not transmitted to the rod-less cylinder
41
.
The wires A housed in the grooves
11
in the alignment plate
10
are conveyed to another location either on their own or together with the alignment plate
10
, while their alignment is maintained via the use of an electromagnet or like means.
In the above embodiment, the wire supply box
20
, the vibration generating means
30
and the like are moved while the alignment plate
10
is kept stationary, but it is acceptable if the alignment plate
10
is moved while the wire supply box
20
, the vibration generating means
30
and the like are kept stationary.
Moreover, in the above embodiment, means to move the wire supply box
20
, means to cause the wire supply box
20
to vibrate and other components are located below the alignment plate
10
, but it is naturally acceptable if such components are located above or beside the wire supply box
20
.
In addition, the vibration generating means
30
, the conveyance means
40
and the like are not limited to the constructions disclosed in the above embodiment, and other configurations known to persons familiar with the conventional art may be adopted.
As described above, according to the automatic wire alignment apparatus pertaining to the present invention, the wires housed in the wire supply box descend due to vibration, and these wires that have descended are sequentially housed in grooves formed in an alignment plate, due to the movement of the wire supply box relative to the alignment plate.
Furthermore, according to the automatic wire alignment apparatus pertaining to the present invention, because each side plate of the wire supply box is urged by a spring such that the [bottom] edge thereof is in continuous contact with the alignment plate, the wires are reliably forced downward into the grooves in the alignment plate by the edge plates.
Moreover, according to the automatic wire alignment apparatus pertaining to the present invention, the wires are reliably guided and forced downward into the grooves in the alignment plate by the slanted surface formed on the inner edge surface of each side plate.
Claims
- 1. An automatic wire alignment apparatus that comprises:an elongated alignment plate in which are formed parallel grooves each of which houses a single wire; a wire supply box that houses a multiplicity of wires; vibration generating means that causes the wire supply box to vibrate, thereby causing the wires located in the wire supply box to descend toward the alignment plate; and conveyance means that moves said wire supply box; wherein said wire supply box is moved relative to said alignment plate by said conveyance means in a direction perpendicular to the grooves in said alignment plate, and the wires that were caused to descend from said wire supply box are housed individually in each groove in said alignment plate.
- 2. The automatic wire alignment apparatus according to claim 1, wherein side plates of said wire supply box arranged across a width of said alignment plate are arranged on said wire supply box in a vertically movable fashion, and each said side plate is urged by a spring such that the bottom edge thereof is in continuous contact with said alignment plate.
- 3. The automatic wire alignment apparatus according to claim 2, wherein the inner edge surface of each said side plate is formed as a slanted surface.
Priority Claims (1)
Number |
Date |
Country |
Kind |
2001-115059 |
Apr 2001 |
JP |
|
US Referenced Citations (11)