Claims
- 1. A ribbon comprising a flexible substrate with an untreated surface and a thermal transfer layer positioned on the other surface having a softening point in the range of 50.degree. C. to 250.degree. C., said thermal transfer layer comprising wax, binder resin, sensible material, optionally residual solvent and a polydimethylsiloxane gum in an amount of 0.02 to 10 weight percent based on total dry ingredients uniformly mixed therein, wherein the polydimethylsiloxane gum has a molecular weight and viscosity suitable for forming a backcoat for the thermal transfer ribbon.
- 2. A ribbon as in claim 1, wherein the flexible substrate comprises polyethylene terephthalate, wherein the wax has a melting point in the range of 40.degree. C. to 130.degree. C.; and the binder resin is a thermoplastic polymer resin having a melting point in the range of 100.degree. C. to 250.degree. C. and comprises 2 to 35 weight percent of the dry components.
- 3. A ribbon as in claim 2, wherein more than one wax is employed in the thermal transfer layer and the binder resin is ethylene vinyl acetate copolymer.
- 4. A ribbon as in claim 1, wherein the thermal transfer layer has a coat weight within the range of 1.9-4.3 g/m.sup.2.
- 5. A thermal transfer ribbon as in claim 1 which is rolled so as to contact the thermal transfer layer with the untreated surface of the flexible substrate which comprises a polyethylene terephthalate substrate.
- 6. A thermal transfer ribbon which comprises a flexible substrate, a thermal transfer layer coated on a surface of said flexible substrate, said thermal transfer layer having a softening point in the range of 50.degree. C. to 250.degree. C. and comprising wax, binder resin, sensible material, and a polydimethylsiloxane gum in an amount of 0.02 to 10 weight percent based on total dry ingredients uniformly mixed therein, and a backcoating of said polydimethylsiloxane gum on the opposite surface of said flexible substrate, which has migrated from a thermal transfer layer by contacting the opposite surface of said flexible substrate.
- 7. A thermal transfer ribbon as in claim 6, wherein the flexible substrate comprises polyethylene terephthalate, wherein the wax has a melting point in the range of 40.degree. C. to 130.degree. C.; and the binder resin is a thermoplastic polymer resin having a melting point in the range of 100.degree. C. to 250.degree. C. and comprises 2 to 35 weight percent of the dry components.
- 8. A thermal transfer ribbon as in claim 6, wherein the thermal transfer layer has a coat weight within the range of 1.9-4.3 g/m.sup.2.
- 9. A thermal transfer ribbon as in claim 6, wherein more than one wax is employed in the thermal transfer layer and the binder resin is ethylene vinyl acetate copolymer.
Parent Case Info
This is a continuation of application Ser. No. 08/662,734, filed on Jun. 10, 1996, now abandoned.
US Referenced Citations (20)
Foreign Referenced Citations (2)
Number |
Date |
Country |
0429666 |
Jun 1991 |
EPX |
0499195 |
Aug 1992 |
EPX |
Non-Patent Literature Citations (1)
Entry |
Patent Abstracts of Japan, vol. 010, No. 336(M-535), Nov. 14, 1986 & JP 61 139489 A (Ricoh Co. Ltd), Jun. 26, 1986. |
Continuations (1)
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Number |
Date |
Country |
Parent |
662734 |
Jun 1996 |
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