The disclosure relates to a lighting module, particularly so a backlight module.
Backlight modules are commonly utilized in various flat screen displays. A backlight module usually includes a light source, a back plate and a light guiding plate. As the structure of the display becomes ever thinner, the light source generates heat that tends to cause bending of the back plate.
The most common solution presently is adding a heat sink to help conduct and dissipate the heat. However, such design does not dissipate heat efficiently enough to prevent the back plate from bending cause by the heat.
Therefore, an object of the disclosure is to provide a backlight module that can eliminate the aforesaid drawback of the prior art.
According to the disclosure, the backlight module includes a frame structure, a heat sink, a light source and a light guiding plate. The frame structure includes a cover unit that defines an airgap therein. The heat sink is located below the airgap of the cover unit. The light source directly contacts the heat sink. The light guiding plate is disposed to correspond in position to the light source for receiving light emitted from the light source. The heat sink is located between the light guiding plate and the cover unit.
Another object of the disclosure is to provide a backlight module that can eliminate the aforesaid drawback of the prior art.
According to the disclosure, the backlight module includes a frame structure, a heat sink, a light source and a light guiding plate. The frame structure includes a cover unit that defines an airgap therein. The heat sink is located below the airgap of the cover unit. The light source is disposed in the frame structure. The light guiding plate is disposed to correspond in position to the light source for receiving light emitted from the light source, and has a top end not higher than that of the cover unit.
Still another object of the disclosure is to provide a backlight module that can eliminate the aforesaid drawback of the prior art.
According to the disclosure, the backlight module includes a frame structure, a heat sink, a light source and a light guiding plate. The frame structure includes a cover unit that defines an airgap therein. The heat sink is located below the airgap of the cover unit, and has a main body and a protrusion that protrudes from a side surface of the main body distal from the cover unit. The light source is disposed in the frame structure. The light guiding plate is disposed to correspond in position to the light source for receiving light emitted from the light source, and is supported by the protrusion of the heat sink to be spaced apart from the main body of the heat sink.
Other features and advantages of the disclosure will become apparent in the following detailed description of the embodiments with reference to the accompanying drawings, of which:
Before the disclosure is described in greater detail, it should be noted that like elements are denoted by the same reference numerals throughout the disclosure.
With reference to
The frame structure 3 includes an outer frame 30, a cover unit 300 and a heat sink 33. The cover unit 300 includes a horizontal base plate 31 chat is horizontally disposed on the outer frame 30, and a vertical back plate 32 that is vertically disposed on an upper side of the base plate 31. The heat sink 33 is disposed on and directly contacts the back plate 32, and extends from the upper side of the base plate 31.
The light source 4 is disposed on the upper side of the horizontal base plate 31, directly contacts the heat sink 33, and includes a plurality of spaced-apart light emitting diodes (LEDs) 41. The light guiding plate 5 is disposed on the outer frame 30 to correspond in position to the light source 4 for receiving light emitted by the light source 4, has a top end not higher than that of the back plate 32, and is entirely covered by the cover unit 300. It should be noted that the structure of the outer frame 30, and the relationship between the outer frame 30 and the light guiding plate 5 are not the focus of the present disclosure and will not be illustrated and discussed further in detail.
The back plate 32 has a bottom end 321 that is connected to the upper side of the back plate 32, a predetermined on 322 between ⅓ and ¼ of a vertical height (H) of the back plate 32 from the bottom end 321, and an elongated horizontal through hole 323 formed within the predetermined zone 322. A horizontal length of the horizontal through hole 323 is not less than 80% of a horizontal length (L) of the back plate 32. The heat sink 33 has a top end that is disposed below a bottom end of the through hole 323 for dissipating heat generated by the LEDs 41. In this embodiment, the horizontal through hole 323 is substantially disposed at the center of the predetermined zone 322.
It is noted that, in this embodiment, the light guiding plate 5 is aligned with the light source 4 in a first direction (D1) (i.e., an up-down direction of the backlight module 2, see
The heat generated by the LEDs 41 is conducted to the back plate 32 via the base plate 31 and the heat sink 33. The heat is limited below the horizontal through hole 323 because the heat sink 33 is disposed below the horizontal through hole 323 and because the horizontal length of the horizontal through hole 323 is at least 80% of the horizontal length (L) of the back plate 32. In effect, the horizontal through hole 323 serves as an airgap to segregate the heat, to substantially reduce the amount of heat passing to the upper side of the back plate 32, and to effectively prevent bending of the back plate 32 caused by the heat.
Referring to
Referring further to
While the disclosure has been described in connection with what are considered the exemplary embodiments, it is understood that this disclosure is not limited to the disclosed embodiments but is intended to cover various arrangements included within the spirit and scope of the broadest interpretation so as to encompass all such modifications and equivalent arrangements.
Number | Date | Country | Kind |
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102127822 A | Aug 2013 | TW | national |
This application is a continuation-in-part (CIP) of co-pending U.S. patent application Ser. No. 14/161,897, filed on Jan. 23, 2014, which claims priority of Taiwanese Application No. 102127822, filed on Aug. 2, 2013.
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8382361 | Park | Feb 2013 | B2 |
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Number | Date | Country |
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103162271 | Jun 2013 | CN |
I349141 | Sep 2011 | TW |
Entry |
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Chinese Search Report issued in Application No. 2013103348553 dated Feb. 28, 2015 (w/ partial translation). |
Taiwanese Search Report issued in Application No. 102127822 dated May 28, 2015 (w/ trans.). |
Number | Date | Country | |
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20160041330 A1 | Feb 2016 | US |
Number | Date | Country | |
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Parent | 14161897 | Jan 2014 | US |
Child | 14919839 | US |