Patent Application
20110126904
The present application claims priority to and benefits of Chinese Patent Application No. 200910188449.4, filed with the State Intellectual Property Office of the People's Republic of China (SIPO) on Nov. 27, 2009, the entire content of which is hereby incorporated by reference.
The disclosure relates to a solar cell, more particularly to a backplane for a solar cell and a solar cell having the same.
Solar energy is becoming more popular. The solar cell usually has a laminated structure, which comprises a transparent cover, a silicon substrate, a sealing film and a backplane. The backplane may enhance the mechanical strength and the sealing performance of the cell. Generally, it is required that the material of the backplane has the properties of high strength, high insulation, anti-aging, and high corrosion resistance.
In one aspect, a backplane for a solar cell comprises a metal substrate having first and second opposing major surfaces, and an insulating layer on at least one major surface of the metal substrate. The insulating layer comprises a resin selected from the group consisting of phenolic resins, epoxy resins, amino resins, and combinations thereof.
In another aspect, a backplane for a solar cell comprises a metal substrate having first and second opposing major surfaces; a coating layer on the first and second major surfaces of the metal substrate; and an insulating layer on the coating layer. The insulating layer comprises a resin selected from the group consisting of phenolic resins, epoxy resins, amino resins, and combinations thereof.
In yet another aspect, a solar cell comprises a backplane and a silicon substrate. The backplane comprises a metal substrate having first and second opposing major surfaces, and an insulating layer on at least one major surface of the metal substrate. The insulating layer comprises a resin selected from the group consisting of phenolic resins, epoxy resins, amino resins, and combinations thereof.
Exemplary embodiments of the present disclosure will be described in detail based on the following figures.
It will be appreciated by those of ordinary skill in the art that the disclosure may be embodied in other specific forms without departing from the spirit or essential character thereof. The presently disclosed embodiments are therefore considered in all respects to be illustrative and not restrictive.
A backplane for a solar cell comprises a metal substrate and an insulating layer on the metal substrate. The metal substrate has first and second opposing major surfaces. The insulating layer can be coated on one major surface, or both major surfaces of the metal substrate. The insulating layer can be any suitable insulating material. Preferably, the insulating layer is a polymer material. More preferably, the insulating layer is made from a resin selected from the group consisting of phenolic resins, epoxy resins, amino resins, and combinations thereof.
In some embodiments, the insulating layer is formed by electrophoresis. During the electrophoresis process, the metal substrate is an electrode in an electrophoretic solution. The electrophoretic solution comprises a resin material. Under an external electric field, the particles of the resin material can migrate directionally and deposit onto the surface of the metal substrate to form an insulating layer.
The metal substrate can be any suitable metal material. In some embodiments, the metal substrate is selected from the group consisting of stainless steel, iron, copper, aluminum, and combinations thereof. In some embodiments, the thickness of the metal substrate is from about 0.1 mm to about 1.5 mm.
The metal substrate may enhance the strength of the backplane, and has good heat dissipation and low transmission of water vapor. In some embodiments, a solar cell comprises a silicon substrate, a sealing film and a backplane. The insulating layer may have a good adhesive force to the sealing film of the solar cell. It may enhance the insulating performance between the solar cell panel and the backplane.
In some embodiments, the phenolic resins are the polymers formed by the polycondensation of phenols and aldehydes. In other embodiments, the phenolic resins are selected from the group consisting of phenol-formaldehyde resins, phenylamine-modified phenolic resins, nitrile butadiene rubber-modified phenolic resins, and combinations thereof.
In some embodiments, the epoxy resins are macromolecules having two or more epoxy groups. In other embodiments, the epoxy resins are selected from the group consisting of bisphenol A epoxy resins, novolac epoxy resins, propanetriol epoxy resins, polyurethane-modified epoxy resins, and combinations thereof.
In some embodiments, the amino resins are formed by the polycondensation of amino compounds and formaldehyde. In other embodiments, the amino resins are selected from the group consisting of phenyl glycidyl ether amino resins, urea-formaldehyde resins, melamine formaldehyde resins, and combinations thereof.
In some embodiments, the thickness of the insulating layer is from about 10 μm to about 100 μm.
The metal substrate comprises first and second major surfaces. In some embodiments, the first major surface is an outside surface and the second major surface is the inside surface. The outside surface is exposed to air. The inside surface is attached to the sealing film of the solar cell. In some embodiments, both of the two major surfaces are coated with an insulating layer. Preferably, the two insulating layers are made from different resin materials. In one embodiment, the insulating layer on the outside surface is made from the resins having good water-tightness and good weatherability. The insulating layer on the inside surface is made from the resins having good insulating and adhesive performances.
Referring to
In some embodiments, the metal substrate comprises a coating layer on one or both of its surfaces. The coating layer can be any suitable material. Preferably, the coating layer comprises a material selected from zinc, nickel, and tin. More preferably, the coating layer is zinc. In one embodiment, the metal substrate has one coating layer on one surface. In another embodiment, the metal substrate has two coating layers on both surfaces respectively. The coating layer can be applied onto the surfaces of the metal substrate by any suitable method, such as plating.
Referring to
In some embodiments, the thickness of the coating layer is about 2 μm to about 50 μm.
In the harsh environment, some water vapor may get through the insulating layer to the metal substrate. The coating layer may ensure the anti-corrosion ability of the metal substrate.
In one embodiment, the insulating layer is formed by electrophoresis. This method may provide an insulating layer with good compactness and hardness. Using metal substrates and electrophoresis processes may lower the cost.
The present disclosure also provides a solar cell containing the backplane of the present disclosure. The solar cell comprises a backplane of the present disclosure, and a silicon substrate on the backplane. Preferably, the solar cell comprises a transparent cover, a silicon substrate, a sealing film, and a backplane. The transparent cover is disposed on the silicon substrate. The sealing film is disposed between the silicon substrate and the backplane. More preferably, the solar cell comprises another sealing film disposed between the transparent cover and the silicon substrate. The backplane comprises a metal substrate and an insulating layer on the metal substrate. The insulating layer comprises a resin material selected from the group consisting of phenolic resins, epoxy resins, amino resins, and combinations thereof.
In some embodiments, the transparent cover is glass. The sealing film comprises ethylene vinyl acetate copolymer (EVA).
Hereinafter, the invention will be described in details with reference to the following embodiments.
A stainless steel substrate with two zinc coating layers on both major surfaces is used to form a backplane. The thickness of the stainless steel substrate is 0.5 mm. The thickness of the coating layer is 15 μm.
The first major surface of the stainless steel substrate is coated with a propanetriol epoxy resin layer by electrophoresis. The second major surface of the stainless steel substrate is coated with a polyurethane-modified epoxy resin layer by electrophoresis. The thickness of the propanetriol epoxy resin layer is 30 μm. The thickness of the polyurethane-modified epoxy resin layer is 35 μm.
The backplane is labeled as A1.
An aluminum substrate is used to form a backplane. The thickness of the aluminum substrate is 0.7 mm.
The first major surface of the aluminum substrate is coated with a polyurethane-modified epoxy resin layer by electrophoresis. The second major surface of the aluminum substrate is coated with a melamine formaldehyde resin layer by electrophoresis. The thickness of the polyurethane-modified epoxy resin layer is 40 μm. The thickness of the melamine formaldehyde resin layer is 30 μm.
The backplane is labeled as A2.
A stainless steel substrate with two zinc coating layers on both major surfaces is used to form a backplane. The thickness of the stainless steel substrate is 0.5 mm. The thickness of the plating coating is 15 μm.
Both major surfaces of the stainless steel substrate are coated with polyurethane-modified epoxy resin layers by electrophoresis. The thickness of the polyurethane-modified epoxy resin layer is 30 μm.
The backplane is labeled as A3.
A stainless steel substrate with two zinc coating layers on both major surfaces is used to form a backplane. The thickness of the stainless steel substrate is 0.3 mm. The thickness of the plating coating is 10 μm.
The first major surface of the stainless steel substrate is coated with a nitrile butadiene rubber-modified phenolic resin layer by electrophoresis. The second major surface of the stainless steel substrate is coated with a polyurethane-modified epoxy resin layer by electrophoresis. The thickness of the nitrile butadiene rubber-modified phenolic resin layer is 25 μm. The thickness of the polyurethane-modified epoxy resin layer is 35 μm.
The backplane is labeled as A4.
A stainless steel substrate with two zinc coating layers on both major surfaces is used to form a backplane. The thickness of the stainless steel substrate is 0.6 mm. The thickness of the plating coating is 8 μm.
The first major surface of the stainless steel substrate is coated with a nitrile butadiene rubber-modified phenolic resin layer by electrophoresis. The second major surface of the stainless steel substrate is coated with a polyurethane-modified epoxy resin layer by electrophoresis. The thickness of the nitrile butadiene rubber-modified phenolic resin layer is 20 μm. The thickness of the polyurethane-modified epoxy resin layer is 30 μm.
The backplane is labeled as A5.
A copper substrate with two zinc coating layers on both major surfaces is used to form a backplane. The thickness of the copper substrate is 0.5 mm. The thickness of the plating coating is 16 μm.
The first major surface of the copper substrate is coated with a polyurethane-modified epoxy resin layer by electrophoresis. The second major surface of the copper substrate is coated with a phenyl glycidyl ether amino resin layer by electrophoresis. The thickness of the polyurethane-modified epoxy resin layer is 42 μm. The thickness of the phenyl glycidyl ether amino resin layer is 20 μm.
The backplane is labeled as A6.
A TPT material is used to form a backplane. The backplane is formed by binding and heat-pressing the three films of polyvinyl fluoride/polyethylene terephthalate/polyvinyl fluoride (PVF/PET/PVF) successively. The thickness of the PVF film is 25 μm. The thickness of the PET film is 0.3 mm.
The backplane is labeled as AC1.
(1) Insulating Performance.
Using the method of UL1703, the backplanes of A1-A6 and AC1 are tested at a high-voltage of 3000 V. The results are recorded in Table 1.
(2) Transmission of Water Vapor.
The transmission of water vapor is tested using the method of ASTM F-1249, CaCl2 moisture absorption. The testing parameters are: temperature of 38° C., humidity of 90%, and time of 24 hours. The results are recorded in Table 1.
(3) Heat Dissipation.
The backplanes of A1-A6 and AC1 are used to prepare solar cell batteries with a size of 300×300 mm. The batteries are placed outdoor in the sun for about 2 hours. Then, the average temperature of each battery is tested by an infrared thermometer. The results are recorded in Table 1.
From Table 1, the backplanes of the embodiments of the present disclosure have better performances on transmittance of water vapor and heat dissipation. Furthermore, the cost of the backplanes of the embodiments in the present disclosure is lower than that of the TPT backplanes.
Many modifications and other embodiments of the present disclosure will come to mind to one skilled in the art to which the present disclosure pertains having the benefit of the teachings presented in the foregoing description. It will be apparent to those skilled in the art that variations and modifications of the present disclosure may be made without departing from the scope or spirit of the present disclosure. Therefore, it is to be understood that the invention is not to be limited to the specific embodiments disclosed and that modifications and other embodiments are intended to be included within the scope of the appended claims. Although specific terms are employed herein, they are used in a generic and descriptive sense only and not for purposes of limitation.
| Number | Date | Country | Kind |
|---|---|---|---|
| 200910188449.4 | Nov 2009 | CN | national |
