Claims
- 1. A baking finish of low solvent content comprising (A) an acrylate resin, (B) an epoxy resin, and (C) a mixture of organic solvents, with or without pigment, catalyst and other conventional auxiliaries, the acrylate resin (A) being a copolymer containing .alpha.,.beta.-olefinically unsaturated carboxylic acid copolymerized units having a K value (measured by the Fikentscher method) of less than 15 and an acid number of from 70 to 250 mg of KOH/g; the epoxy resin (B) containing at least 2 oxirane groups per molecule, and the organic solvent mixture (C) comprising from 20 to 80% by weight of a solvent having a boiling point of from 100.degree. to 280.degree. C. and a dielectric constant of from 2 to 4.99 and from 80 to 20% by weight of a solvent having a boiling point from 80.degree. to 200.degree. C. and a dielectric constant of from 5 to 27, the weight ratio of the components (A):(B) being from 9:1 to 6:4 and the weight ratio of the components (A+B):(C) being from 7:3 to 5:5, wherein the acrylate resin (A) has a mean molecular weight Mn of from 1500 to 3000 and an inhomogeneity (Mw/Mn), measured by gel permeation chromatography of from 1.5 to 2.0, said acrylate resin (A) being a copolymer of from 12 to 25% by weight of acrylic acid or methacrylic acid, from 5 to 70% by weight of one or more esters of acrylic acid or methacrylic acid from the group consisting of ethyl acrylate, methyl methacrylate, ethyl methacrylate, butyl methacrylate, 2-ethylhexyl acrylate n-butyl acrylate, from 5 to 70% by weight of styrene and from 0 to 20% by weight of an alkanediol monoester of acrylic acid or methacrylic acid.
- 2. A baking finish as set forth in claim 1 wherein an acrylate resin (A) is used which has been manufactured from the monomers at temperatures of from 170.degree. to 280.degree. C. and pressures of from 1.5 to 30 bars in the presence or absence of a free-radical initiator and an organic solvent.
- 3. A baking finish as set forth in claim 1 wherein the solids content is more than 70% by weight.
- 4. A baking finish as set forth in claim 1 wherein the organic solvent mixture (C) is a mixture of from 30 to 70% by weight of an aromatic hydrocarbon mixture having a boiling range of from 150.degree. to 270.degree. C. and containing more than 80% by weight of aromatics with from 70 to 30% by weight of an alcohol mixture having a boiling point range of from 80.degree. to 200.degree. C., or a mixture of said alcohol mixture with at least one compound boiling at from 80.degree. and 200.degree. C. and selected from glycol monoalkyl ethers and glycol monoalkyl acetates.
- 5. A baking finish as set forth in claim 1 wherein the epoxy resin (B) has an epoxide value of from about 0.2 to 0.7 mole of epoxide/100 g of material.
- 6. A baking finish as set forth in claim 1 wherein the carboxyl/epoxide ratio of the acrylate resin (A) to the epoxy resin (B) is from 0.3:1 to 3:1.
- 7. A process of preparing a coated substrate, comprising:
- spraying a baking finish according to claim 1 on said substrate to produce a coating on said substrate, and
- baking said coated substrate to produce a coated substrate with a baked finish.
Priority Claims (1)
Number |
Date |
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Kind |
2728459 |
Jun 1977 |
DEX |
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Parent Case Info
This is a continuation, of application Ser. No. 820,721, filed Aug. 1, 1977 now abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3065195 |
Vasta |
Nov 1962 |
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3940353 |
Martorano |
Feb 1976 |
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Continuations (1)
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Number |
Date |
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Parent |
820721 |
Aug 1977 |
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