Patent Application
20110167998
The present invention relates to survivability enhancement and more particularly to a ballistic laminate constructed of a plurality of layers of non-fibrous high modulus ultra high molecular weight polyethylene.
Survivability enhancement is a well-known objective for armored vehicles or fixed or mobile armored structures in a combat or other high threat environment. If a high-energy projectile strikes a vehicle, the survivability of the occupants and the vehicle can be compromised by the release of spall, which is a spray of high velocity metallic or ceramic debris into the vehicle's interior. Vehicles, ships, aircraft, or structures in a high threat environment are therefore frequently equipped with a spall liner, which is designed to suppress the spall generated when a projectile penetrates the vehicle's interior.
Spall liners are typically comprised of a compressed panel. The compressed panel usually includes a plurality of layers of high modulus, high tensile strength fabric bonded together by a resinous adhesive. If a projectile penetrates the armor of a vehicle, the spall liner absorbs the force of the projectile, with each separate layer delaminating and absorbing some portion of the force of the projectile and thereby dissipating the energy of the projectile as it advances through the spall liner.
Although many different spall liners have been proposed, further enhancements in spall suppression are highly desirable for increasing survivability of armored vehicles and structures.
The invention is a ballistic-resistant panel formed of a plurality of sheets of high modulus high molecular weight polyethylene tape. The sheets of high modulus polyethylene tape include tape strips bonded together at their edges by heat and pressure or by thermoplastic adhesive combined with heat and pressure. The strips of UHMWPE (ultra high molecular weight polyethylene) tape include a width of at least one inch and a modulus of greater than 1400 grams per denier. The ballistic-resistant panel may include a backing layer of conventional high modulus fibers embedded in resin. A wide variety of adhesives were found acceptable for bonding the sheets of high modulus polyethylene tape together for forming the ballistic-resistant panels of the present invention.
The ballistic-resistant panel formed of UHMWPE (ultra high molecular weight polyethylene) Tensylon tape of the present invention includes several advantages over the prior art, including:
These and other objects and advantages of the present invention will be better understood by reading the following description along with reference to the drawings.
The following is a listing of part numbers used in the drawings along with a brief description:
The present invention relates to ballistic laminates having a plurality of layers of high modulus material, either all or some portion of which layers are constructed of non-fibrous, high modulus, ultra high molecular weight polyethylene tape of the type described in U.S. patent application Ser. No. 11/787,094, filed on Apr. 13, 2007, the contents of which are incorporated herein in their entirety by reference thereto. The non-fibrous, high modulus, UHMWPE tape is produced by Tensylon High Performance Materials, Inc. of Monroe, N.C., and sold under the name TENSYLON®. As used in this application, the term “high modulus” refers to materials having a modulus greater than 1,000 grams per denier (gpd).
In order to form an improved strike-face for a ballistic-resistant panel according to the present invention, adhesive was applied to one side of a plurality of webs of unidirectional UHMWPE tape. The webs of adhesive-coated unitape were bonded into a unidirectional or unitape sheet, sheeted, and then cross-plied with additional sheets of adhesive-coated unitape. The cross-plied sheets were molded by heat and pressure into a ballistic laminate. Several conventional adhesives were tested for their effectiveness in forming a ballistic laminate. The test procedure included the following steps:
In order to test the effectiveness of TENSYLON® non-fibrous, high modulus UHMWPE tape as a high modulus component in ballistic-resistant panels, adhesive was applied to one side of Tensylon 19,000 denier tape, hereinafter “Tensylon tape”. The 19,000 denier Tensylon tape included nominal dimensions of 1.62 inches in width, 0.0025 inch in thickness, and a tensile modulus of at least 1,400 grams per denier (gpd). Some of the adhesives were in the form of adhesive scrims, which were laminated to one side of the Tensylon tape, and others were resinous adhesive dispersed in a solvent, which was coated on a release film and then transferred to one side of the Tensylon tape. Preferably, the Tensylon tape has viscosity-average molecular weight of at least 2,000,000, a width of at least 1.0 inch, a thickness of between 0.0015 and 0.004 inch, a with to thickness ration of at least 400:1, a denier of 6,000 or greater, and a modulus of greater than 1,400 grams per denier.
With reference to
For those adhesives in the form of a resin suspended in a solvent, the resin was applied to one side of a silicone release sheet. With reference to
The specific adhesives tested and significant measured properties are presented in Table 1 below:
The adhesives tested included Polyethylene-PO4401 (A1), Polyethylene-PO4605 (B1), Polyethylene-DO184B (C1), Polyurethane-DO187H (D1), and Polyethylene-DO188Q (E1), which are all available from Spunfab, Ltd. of Cayahoga Falls, Ohio; Kraton D1161P (F1), which is available from Kraton Polymers U.S., LLC of Houston, Tex.; Macromelt 6900 (G1), which is available from Henkel Adhesives of Elgin, Ill.; and Noveon-Estane 5703 (H1), which is available from Lubrizol Advanced Materials, Inc. of Cleveland, Ohio. Adhesives A1 through E1 were applied to the Tensylon tape by the laminator/fuser 20 depicted in
The adhesive-coated unidirectional Tensylon tape, commonly termed “unitape” and consisting of eight strips of UHMWPE tape fused at their edges, was then cut into 12-inch by 12-inch sheets.
To form a ballistic-resistant panel, cross-plied sheets of adhesive-coated Tensylon were stacked until a stack of cross-plied Tensylon of approximately 2.0 psf (pounds per square foot) was obtained. Several of the nominal 2.0 psf stacks were pressed at a pressure of 150 psi and several at a pressure of 3,000 psi. The press cycle included 30 minutes at a temperature of 250° F. to 260° F. and cooling under full pressure to below 120° F. before release thereby forming ballistic-resistant panels of nominally 2.0 psf areal density.
With reference to
The ballistic-resistant panels were then tested for ballistic resistance. Projectiles of 0.30 caliber FSP (Fragment Simulated Projectile) per MIL-P-46593A were fired at the 2.0 psf test panels to obtain ballistics properties of the panels bonded with the various adhesives. The velocities in fps (feet per second) at which 50% of the projectiles failed to penetrate the target (V50) were determined per MIL-STD-662F. Data for the resultant ballistic-resistant panels formed at 150 psi are shown in Table 2 and data for the resultant ballistic-resistant panels formed at 3,000 psi are shown in Table 3 below:
A summary of the data suggest that the 3000 psi ballistic-resistant panels molded with adhesives A1, B1, and C1 rated slightly higher for ballistic performance than did the 150 psi panels. Adhesives B1 and C1 were essentially equal in performance. The V50 results suggest that all of the test panels were acceptable for ballistic resistance of 0.30 caliber fragment simulated projectiles.
Ballistic-resistant panels were then prepared to test the performance of Tensylon tape versus conventional high modulus fibers. Dyneema HB25 cross-plied fibers embedded in resin, available from DSM Dyneema B.V., Urmond, the Netherlands, were formed into a 2.0-psf panel. A panel formed of 100% HB25 as the high modulus component was used as a control sample or baseline. A nominal 2.0-psf panels was also formed of 100% high modulus Tensylon tape. Various other combinations of Tensylon tape and HB25 were formed into ballistic-resistant panels to test the ballistic resistance of panels with various amounts of Tensylon tape in place of the conventional high modulus component and to also test whether the Tensylon tape was more effective in various configurations, such as 1) alternating sheets of Tensylon tape and conventional high modulus component, 2) Tensylon tape as a strike-face at the front of the ballistic-resistant panel, and 3) Tensylon tape as the backing material with conventional high modulus component forming the strike face, and 4) varying the ratio of Tensylon tape to conventional high modulus component. Several of these variations were molded into panels at 150 psi and 250° F. as shown in Table 4 below, and several molded into panels at 150 psi and 210° F. as shown in Table 5. The ballistic-resistant panels were tested with 0.30 caliber FSP rounds and the V50 results recorded.
Table 4 includes, left to right in columns 1 to 7:1) the high modulus composition, 2) the baseline V50 test result for panels formed of one high modulus component, 3) the V50 test result for panels formed with a Tensylon strike-face, 4) the V50 test result for panels formed with HB25 as the strike-face, 5) the calculated V50, and 6) the delta V50 which is the difference between the calculated V50 and the actual V50 recorded in columns 3, 4, or 5. The calculated V50 is determined by the Rule of Mixtures wherein the property of a composite is proportional to the volume fractions of the materials in the composite, thus the calculated V50 for a 50/50 ratio of Tensylon C and HB25 is V50=0.5 (1650)+0.5 (2250) or V50 (calculated)=1950. The Tensylon C (Ten C) and Tensylon A (Ten A) were panels molded with different adhesives.
Thus, if the Delta V50 is within plus or minus 50 fps, the Rule of Mixtures is a good predictor of the final V50 value, and there is no effect from the manner in which the separate high modulus components are combined in the panel. Thus the V50 for alternating layers of Tensylon tape and HB25, which is represented by line 4 of the table, is predicted by the Rule of Mixtures. However, if the absolute value of the Delta V50 is significantly greater than 50 fps for several of the test panels, it implies that the order in which the high modulus components are arranged in the ballistic-resistant panel is statistically significant. Thus, where the Tensylon tape is placed with respect to front or back in the ballistic-resistant panel has a significant effect on the ballistic performance of the panel. A Delta V50 that is greater than +50 fps indicates a higher ballistic resistance result than expected by the Rule of Mixtures and thus an advantageous configuration of high modulus components within the panel. A Delta V50 that is less than −50 fps indicates a lower ballistic resistance result than expected by the Rule of Mixtures and thus an undesirable configuration of high modulus components within the panel.
Therefore, it can be concluded from the test results in Table 4 that the compositions in rows 5 and 10 through 12 are advantageous for producing a panel with high ballistic resistance. Column 1 shows the high modulus composition of these panels are 25% Tensylon/50% HB25/25% Tensylon (panel 5), 25% Tensylon/75% HB25 (panels 10 and 11), and 50% Tensylon/50% HB25 (panel 12). Results therefore show that a strike-face consisting of high modulus UHMWPE Tensylon tape improves the performance of ballistic-resistant panels. In the final ballistic-resistant panel, the adhesive was less than 20 weight percent of the total weight of the panel.
Table 5 includes ballistic test results for panels of various compositions of Tensylon UHMWPE tape and HB25 fibers molded at 150 psi and 210° F. The ballistic-resistant panels were tested with 0.30 caliber FSP rounds and the V50 velocities recorded.
As reference to Table 5 shows, the ballistic resistance for the 2.0 psf panels molded at 150 psi and 210° F. was improved significantly with Tensylon UHMWPE tape used as the strike face of the panel. The improvement in ballistic resistance with the addition of Tensylon tape as the strike face therefore occurred with panels molded at 250° F. (Table 4) as well as at 210° F. (Table 5).
Table 6 includes ballistic test results for 3.8 nominal psf ballistic-resistant panels composed of Tensylon UHMWPE tape and aramid fabric molded with SURLYN® resin at 150 psi and 250° F. SURLYN® is an ethylene/methacrylic acid copolymer available from DuPont Packaging and Industrial Polymers of Wilmington, Del. The aramid fabric is produced commercially by Barrday, Inc. under the trade name Barrday Style 1013. The aramid fabric was composed of 3,000 denier Kevlar® 29 in fabrics of 14 oz/yd2 weight. One ply of 1.5-mil CAF film (SURLYN® resin) was used between each ply of Tensylon tape. (As a result of aramid fabric and Tensylon tape weight variances, it was difficult to match areal densities. The ballistic-resistant panels were tested with 0.30 caliber FSP rounds and the V50 velocities recorded.
As shown in Table 6, the test panel with a Tensylon tape strike face had ballistic resistance of 2632 fps, which was significantly higher than that predicted by the Rule of Mixtures.
Table 7 includes ballistic test results for 3.8 nominal psf ballistic-resistant panels composed of Tensylon UHMWPE tape and HB25 and tested with an NIJ Level III M80 ball projectile (U.S. military designation for 7.62 mm full metal jacketed bullet).
As shown in Table 7 for nominal 3.8 psf composite ballistic-resistant panels, the Tensylon UHMWPE tape had a beneficial effect when placed as the strike-face of the ballistic-resistant panel, including a V50 velocity of 2880 fps for the ballistic-resistant panel in which the Tensylon tape comprised the strike-face and 50% of the high modulus component and a V50 velocity of 2897 fps for the ballistic-resistant panel in which the Tensylon tape comprised the strike-face and 25% of the high modulus component.
Table 8 includes ballistic test results for a spall liner for simulated armor with facings of aluminum and High Hardness Steel (HHS) and various backing compositions including various weights of HB25 and various compositions including HB25 and Tensylon tape. All of the armor designs including Tensylon tape as a high modulus component had positive results for rifle threat relative to the requirement.
Table 9 includes ballistic test results for a simulated spall liner including the following various configurations: 1) a baseline configuration of ¼″ Ultra High Hard Steel (UHHS) and 1.1 psf of KEVLAR® Reinforced Plastic (KRP), 2) baseline plus 25-mm of HB25 spaced 25-mm behind the KRP, 3) baseline plus 25-mm of high modulus components comprised of 25% Tensylon and 75% HB25 spaced 25-mm behind the KRP, and 4) baseline plus 25-mm of high modulus components comprised of 50% Tensylon and 50% HB25 spaced 25-mm behind the KRP. Test results included the spall cone angle measured at layers 1 and 3 and the average number of fragments that penetrated at layers 1 and 3. The spall cone angle and average number of fragments through for a spall liner including 25% and 50% Tensylon tape were similar to those obtained for a spall liner of 100% HB25.
In another embodiment, ballistic-resistant panels were constructed using Tensylon tape as the high modulus component to determine the effect of molding pressure and temperature on ballistic resistance. Table 10 includes ballistic test results for 2.0 psf panels comprised of cross-plied layers of 1.62-inch width Tensylon UHMWPE tape, with a first series of panels molded at 150 psi and at various temperatures and a second series of panels molded at 500 psi and at various temperatures. The cross-plied layers of Tensylon UHMWPE tape were interleaved with a low density polyolefin scrim (Spunfab PO4605) and pressed and bonded at the various pressures and temperatures recorded in the table. The last entry in Table 10, Tensylon*, was comprised of layers of 1.62-inch Tensylon tape woven into a fabric using a basket weave with the weft arranged at 90° with respect to the warp. The woven layers were pressed with an 18-micron low density polyethylene film to form a 2.2 psf ballistic-resistant panel. The ballistic-resistant panels were tested with 0.30 caliber FSP rounds per MIL-P-46593A and the average V50 velocities recorded.
As shown in
Although the embodiments of ballistic-resistant panels describe above were prepared at specific parameters, other variations of processing conditions are possible without departing from the scope of the invention. For example, although the Tensylon UHMWPE tape in adjacent layers of the ballistic-resistant panel were oriented at 0° and 90° respectively, other orientations are possible, such as 0° and 45° in adjacent layers, or 0°, 45°, and 90° for each three successive layers. Preferably the direction of orientation of the tape in each of the interleaved layers of non-fibrous ultra high molecular weight polyethylene tape is at an angle of at least 30 degrees with respect to the direction of orientation of the tape in an adjacent layer. Although the specific molding temperatures tested herein were between 180 and 280° F., it is believed that molding temperatures between 150° F. and 300° F. are acceptable for forming a ballistic-resistant panel according to the present invention. Although specific molding pressures of 150, 500, and 3000 psi were tested, it is believed that molding pressures between 100 and 4000 psi are acceptable for forming ballistic-resistant panels according to the present invention.
Although in one embodiment herein the Tensylon tape was woven into a fabric using a basket weave, it is within the scope of the present invention to form the Tensylon tape into fabric using any fabric weave, such as plain weave, twill weave, satin weave, and the like.
Having thus described the invention with reference to a preferred embodiment, it is to be understood that the invention is not so limited by the description herein but is defined as follows by the appended claims.
This application is a Continuation-In-Part of U.S. patent application Ser. No. 11/821,659, filed on Jun. 25, 2007 and entitled “Non-Fibrous High Modulus Ultra High Molecular Weight Polyethylene Tape for Ballistic Applications” and is a Continuation-In-Part of U.S. patent application Ser. No. 11/787,094, filed on Apr. 13, 2007 and entitled “Wide Ultra High Molecular Weight Polyethylene Sheet and Method of Manufacture”, of which the entire contents of said applications are incorporated herein in their entirety by reference thereto.
| Number | Date | Country | |
|---|---|---|---|
| Parent | 11821659 | Jun 2007 | US |
| Child | 11881863 | US | |
| Parent | 11787094 | Apr 2007 | US |
| Child | 11821659 | US |
