Many electronic devices use voltage regulators. Such voltage regulators vary with regard to input voltage or range, output voltage or range, and performance parameters (e.g., power efficiency, output voltage (VOUT) ripple, resistance to temperature change, resistance to input voltage variance, resistance to electromagnetic interference (EMI), etc.). One type of voltage regulator is called a bandgap voltage reference (VBG) circuit. VBG circuits are designed to provide a constant direct-current (DC) voltage reference (VREF) output regardless of DC input voltage (VIN) variance, temperature variance, and loading variance.
In an example, a bandgap voltage reference circuit includes: a bandgap voltage reference (VBG) core having a power input and first and second terminals; a bandgap operational amplifier (BGOA) having an operational amplifier output and first and second terminals, the first terminal of the BGOA coupled to the first terminal of the VBG core, and the second terminal of the BGOA coupled to the second terminal of the VBG core; and a feedback circuit having a feedback input and a feedback output, the feedback input coupled to the operational amplifier output, and the feedback output coupled to the power input. The feedback circuit includes a scaling amplifier having an inverting input, a non-inverting input, and a scaling amplifier output.
In another example, an integrated circuit includes a bandgap voltage reference circuit having a power input and a bandgap voltage reference output. The bandgap voltage reference circuit includes a feedback circuit coupled between the power input and the bandgap voltage reference output. The feedback circuit includes a scaling amplifier. The bandgap voltage reference circuit is configured to provide a bandgap voltage reference value at the bandgap voltage reference output responsive to operations of the scaling amplifier.
In yet another example, a bandgap voltage reference circuit includes: a bandgap voltage reference (VBG) core having an input and first and second outputs; a first operational amplifier having an output and first and second inputs, the first input of the first operational amplifier coupled to the first output of the VBG core, and the second input of the first operational amplifier coupled to the second output of the VBG core; and a voltage divider having a first terminal, a second terminal, and an output terminal, the first terminal coupled to the output of the first operational amplifier, and the second terminal coupled to a ground terminal. The bandgap voltage reference circuit also includes: a second operational amplifier having an output and first and second inputs, the first input of the second operational amplifier coupled to the output terminal of the voltage divider; the second input of the second operational amplifier coupled to the input of the VBG core; and a transistor having a first terminal, a second terminal, and a control terminal, the first terminal of the transistor coupled to the output of the first operational amplifier, the second terminal of the transistor coupled to the input of the VBG core, and the control terminal of the transistor coupled to the output of the second operational amplifier.
The same reference numbers or other reference designators are used in the drawings to designate the same or similar features. Such features may be the same or similar either by function and/or structure.
A first bandgap voltage reference (VBG) circuit topology includes a VBG core coupled to a trim circuit and an operational amplifier, where the output of the operational amplifier is the output of the VBG circuit and is a feedback input to the trim circuit and the VBG core. With this first VBG circuit topology, the voltage reference (VREF) output is the same as the input voltage (VIN).
A second VBG circuit topology includes similar components and arrangement, except the operational amplifier includes a gain stage and a resistor between its inverting input and its amplifier output. With this second VBG circuit topology, the VREF output is higher than VIN. Efforts to reduce the cost and increase the flexibility of VBG circuits are ongoing. The present figures and detailed description illustrate and describe example VBG circuits and a method of operating a VBG circuit that enable one or more benefits and/or address one or more shortcomings over the above first and second VBG circuits and other VBG circuits and/or methods of operating a VBG circuit.
In some examples, the power supply 102 has a power output 104. The IC 106 has a power input 108, an optional control input 110, a data input 112, a data output 114, a power output 116, and a ground terminal 118. The bandgap voltage reference circuit 120 has a power input 122, an optional control input 124, a power output 126, and a ground terminal 128. The feedback circuit 130 has an optional control input 132, a feedback input 134, and a feedback output 136. The trim circuitry 142 has a control input 144 and a trim output 146. The VBG core 148 has a control input 150, a power input 152, a first terminal 154, and a second terminal 156. The BGOA 158 includes a first terminal 160, a second terminal 162, and an amplifier output 164. The ADC 166 includes a power input 168, a data input 170, and a data output 172.
In the example of
In some examples, the power supply 102 operates to provide a power supply voltage (VPS) at the power output 104, and the ground terminal 118 is at an electrical ground, for example by being coupled to a ground plane of the IC 106. The IC 106 operates to: receive VPS at the power input 122; receive an optional bypass control signal (BYPASS_CS) at the optional control input 110; receive data at the data input 112; generate a bandgap voltage reference value (VREF) responsive to VPS, BYPASS_CS (if used), and the operations of the bandgap voltage reference circuit 120; provide VREF to the power output 116; and provide data to the data output 114 responsive to VREF, the data received at the data input 112, and the operations of the ADC 166. In some examples, VREF varies depending on whether or not the scaling circuit 138 is bypassed by the optional bypass scaling circuitry 140.
In some examples, the bandgap voltage reference circuit 120 operates to: receive VPS at the power input 122; regulate VPS to generate an input voltage (VIN) for components of the bandgap voltage reference circuit 120; receive BYPASS_CS (if used) at the optional control input 110; and provide VREF at the power output 126 responsive to VIN,BYPASS_CS (if used), and the operations of the VBG core 148, the trim circuitry 142, the BGOA 158, and the feedback circuit 130. In some examples, VIN (rather than VPS) is provided as an input to the bandgap voltage reference circuit 120. In such case, circuitry external to the bandgap voltage reference circuit 120 regulates VPS to generate VIN for the bandgap voltage reference circuit 120.
In some examples, the feedback circuit 130 operates to: receive VREF at the feedback input 134; receive BYPASS_CS (if used) at the optional control input 110; adjust VREF responsive to the operations of the scaling circuit 138 when not bypassed; and provide a feedback signal 137 to the feedback output 136 responsive to VREF and BYPASS_CS (if used). The feedback signal 137 is used to adjust VIN as needed. In the example of
In some examples, the trim circuitry 142 operates to: receive VIN at the control input 144; and provide a trim signal 147 at the trim output 146 responsive to VIN. In some examples, the trim circuitry 142 provides first-order correction for the VBG core 148 to compensate for drift. In some examples, the trim circuitry 142 provides an anti-parabolic correction current to cancel a bandgap parabolic curve. In either case, the trim circuitry 142 provides a temperature drift trim by injecting current to the control input 150 of the VBG core 148.
In some examples, the VBG core 148 operates to: receive VIN at the power input 152; receive the trim signal 147 at the control input 150; provide a first signal 155 at the first terminal 154 responsive to VIN and the trim signal 147; and provide a second signal 157 at the second terminal 156 responsive to VIN and the trim signal 147. In some examples, the BG core 148 uses the voltage difference between two p-n junctions, operated at different current densities, to generate a current that is proportional to absolute temperature (PTAT) in a first resistor (e.g., R6 in
In some examples, the BGOA 158 operates to: receive the first signal 155 at the first terminal 160; receive the second signal 157 at the second terminal 162; equalize the voltages at the first terminal 160 and the second terminal 162; and provide VREF at the amplifier output 164 responsive to the first signal 155 and the second signal 157.
In some examples, if the scaling circuit 138 of the feedback circuit 130 is not bypassed, VIN is less than VREF. If the scaling circuit 138 is bypassed, VIN is about the same as VREF. Relative to other bandgap voltage reference circuit topologies, the bandgap reference voltage circuit 120 of
In the example of
In examples, the non-inverting (“+”) input 302 of the scaling amplifier 138A is coupled to the feedback output 136 of the feedback circuit 130A. The first terminal of the transistor MP1 is coupled to the feedback input 134. The second terminal of the transistor MP1 is coupled to the feedback output 136. The control terminal of the transistor MP1 is coupled to the scaling amplifier output 306 of the scaling amplifier 138A.
In the example of
In the example of
In the example of
In some examples, the bypass scaling circuitry 140A includes a first switch S1, a second switch S2, a transistor MP2, and a transistor MN2. As shown, MP2 is a PFET having a first terminal, a second terminal, and a control terminal. MN2 is a NFET having a first terminal, a second terminal, and a control terminal. Together, MP2 and MN2 form a transmission gate such as a transmission gate such as the transmission gate 616 in
In some examples, each of the first switch and the second switch includes three FETs. In some examples, each of the first switch and the second switch includes a transmission gate (similar to the transmission gate 616 in
The control terminal 510 of switch S1 is coupled to the control input 508 of the bypass scaling circuitry 140A. The first terminal 512 of switch S1 is coupled to the control terminal of MP2. The second terminal 514 of switch S1 is coupled to a ground terminal. The third terminal 516 of switch S1 is coupled to a power supply (VDD) source or terminal. The control terminal 518 of switch S2 is coupled to the control input 508 of the bypass scaling circuitry 140A. The first terminal 520 of switch S2 is coupled to the control terminal of MN2. The second terminal 522 of switch S2 is coupled to the scaling amplifier output 306 of the scaling amplifier 138A. The third terminal 524 of switch S2 is coupled to a VDD source or terminal. The first terminals of MP2 and MN2 are coupled to the first bypass scaling circuitry input 502. The second terminals of MP2 and MN2 are coupled to the bypass scaling circuitry output 506.
In the example of
The bypass scaling circuitry 140A operates to: receive BYPASS_CS at the control input 508; and bypass the scaling amplifier 138A responsive to BYPASS_CS and the operations of switch S1, switch S2, transistor MP2, and transistor MN2. In some examples, switch S1 allows current flow between the first terminal 512 and the second terminal 514 responsive to BYPASS_CS having a first state indicating the scaling amplifier 138A is to be bypassed. In the example of
In some examples, switch S2 allows current flow between the first terminal 520 and the third terminal 524 responsive to BYPASS_CS having the first state indicating the scaling amplifier 138A is to be bypassed. In the example of
When the scaling amplifier 138A is bypassed, VIN and VREF are about the same. In some examples, VIN and VREF are approximately 2.5V when the scaling amplifier 138A is bypassed by the bypass scaling circuitry 140A. In some examples, when VREF=2.5V, VDD may be approximately 2.85V to 5.5V. In some examples, when VREF=4.096V, VDD may be approximately 4.5V to 5.5V. Together MP2 and MN2 function as a single switch with improved bi-directional current flow relative to using one PFET or one NFET.
The bandgap voltage reference circuit 500 operates to: receive VIN at the control input 144 of the trim circuitry 142; receive VIN at the power input 152 of the VBG core 148; provide VREF responsive to VIN and the operations of the trim circuitry 142, the VBG core 148, and the BGOA 158; and adjust VIN responsive to VREF and the operations of the feedback circuit 130C.
In some examples, switch S2 allows current flow between the first terminal 520 and the second terminal 522 responsive to BYPASS_CS having the second state indicating the scaling amplifier 138A will be used. In the example of
Again, the second bypass scaling circuitry input 504 is coupled to the scaling amplifier output 306. When the scaling amplifier 138A is used, VIN is less than VREF. In some examples, VIN=2.5V and VREF=4.096V when the scaling amplifier 138A is not bypassed by the bypass scaling circuitry 140A. In some examples, when VREF=2.5V, VDD may be approximately 2.85V to 5.5V. In some examples, when VREF=4.096V, VDD may be approximately 4.5V to 5.5V. Together MP2 and MN2 function as a single switch with improved bi-directional current flow relative to using one PFET or one NFET.
The transmission gate 616 has a first terminal 618, a second terminal 620, a first control terminal 622, and a second control terminal 624. The first terminal 618 of the transmission gate 616 is coupled to the first bypass scaling circuitry input 502. The second terminal 620 of the transmission gate 616 is coupled to the bypass scaling circuitry output 506. The first control terminal 622 of the transmission gate 616 is coupled to the first terminal 520 of the switch S2. The second control terminal 624 of the transmission gate 616 is coupled to the first terminal 512 of the switch S1.
In the example of
In the VBG core 148A, each of the resistors R3, R4, R5, and R5 has a respective first terminal and a respective second terminal. Also, each of the transistors T1, T2, T3, and T4 has a respective first terminal, a respective second terminal, and a respective control terminal. As shown, the VBG core 148A includes R3, T1, T2, and R4 in series between the power input 152 and a ground terminal. In other words, the first terminal of R3 is coupled to the power input 152. The second terminal of R2 is coupled to the first terminal of T1. The second terminal of T1 is coupled to the first terminal of T2. The second terminal of T2 is coupled to the first terminal of R4. The second terminal of R4 is coupled to the ground terminal. The control terminal of T1 is coupled the first terminal of T1. The control terminal of T2 is coupled the first terminal of T2. In some examples, the second terminal 156 of the VBG core 148A is coupled to a node between the second terminal of R3 and the first terminal of T1.
The VBG core 148A also includes R5, R6, T3, T4, and R4 in series between the power input 152 and the ground terminal. In other words, the first terminal of R5 is coupled to the power input 152. The second terminal of R5 is coupled to the first terminal of R6. The second terminal of R6 is coupled to the first terminal of T3. The second terminal of T3 is coupled to the first terminal of T4. The second terminal of T4 is coupled to the first terminal of R4. Again, the second terminal of R4 is coupled to the ground terminal. The control terminal of T3 is coupled the first terminal of T3. The control terminal of T4 is coupled the first terminal of T4. In some examples, the first terminal 154 of the VBG core 148A is coupled to a node between the second terminal of R5 and the first terminal of R6.
In the BGOA 158A, the error amplifier 602 is an operational amplifier that includes a non-inverting (“+”) input 604, an inverting (“−”) input 606, and an error amplifier output 608. The capacitor C1 has a first terminal and a second terminal. The amplifier buffer 610 has a buffer input 612 and a buffer output 614. As shown, the non-inverting (“+”) input 604 of the error amplifier 602 is coupled to the first terminal 160 of the BGOA 158A. The inverting (“−”) input 606 of the error amplifier 602 is coupled to the second terminal 162 of the BGOA 158A. The first terminal of C1 is coupled to the error amplifier output 608 and the buffer input 612. The second terminal of C1 is coupled to a ground terminal. The buffer output 614 is coupled to the amplifier output 164 of the BGOA 158A.
In the example of
The bypass scaling circuitry 140B operates to: receive BYPASS_CS at the control input 508; selectively bypass the scaling amplifier 138A responsive to BYPASS_CS and the operations of switch S1, switch S2, and the transmission gate 616. In some examples, switch S1 allows current flow between the first terminal 512 and the second terminal 514 responsive to BYPASS_CS having the first state indicating the scaling amplifier 138A is to be bypassed. When BYPASS_CS has a second state indicating the scaling amplifier 138A is to be used, switch S1 allows current flow between the first terminal 512 and the third terminal 516. In the example of
In some examples, switch S2 allows current flow between the first terminal 520 and the third terminal 524 responsive to BYPASS_CS having the first state indicating the scaling amplifier 138A is to be bypassed. When BYPASS_CS has the second state indicating the scaling amplifier 138A is to be used, switch S2 allows current flow between the first terminal 520 and the second terminal 522. In the example of
When the scaling amplifier 138A is bypassed by the bypass scaling circuitry 140B, VIN and VREF are about the same. In some examples, VIN and VREF are approximately 2.5V when the scaling amplifier 138A is bypassed. When the scaling amplifier 138A is not bypassed, VIN is less than VREF. In some examples, VIN=2.5V and VREF=4.096V when the scaling amplifier 138A is not bypassed by the bypass scaling circuitry 140B.
In some examples, the bandgap voltage reference circuit 600 operates to: receive VIN at the control input 144 of the trim circuitry 142; receive VIN at the power input 152 of the VBG core 148A; provide VREF responsive to VIN and the operations of the trim circuitry 142, the VBG core 148A, and the BGOA 158A; and adjust VIN responsive to VREF and the operations of the feedback circuit 130D. In some examples, the error amplifier 602 forces the first terminal 154 and the second terminal 156 of the VBG core 148A to be equal in voltage potential. The current through R6 of the VBG core 148A is VBE/R6, which is
CTAT. Meanwhile, the bipolar transistor collector current of the VBG core 148A is PTAT in nature. By adding CTAT with PTAT, the VBG core 148A provides a fairly constant over-temperature voltage (bandgap voltage). In the described examples, a VIN of 2.5V is targeted as a basic bandgap core design. If 2.5V VREF is desired, BYPASS_CS is set high to turn on both MN2 and MP2. If a VREF higher than 2.5V (e.g., 4.096V) is desired, BYPASS_CS is set low and the scaling amplifier 138A is activated to drive the gate of MN2 to accomplish the scaling operation. As desired, VREF can be varied by adjusting the division ratio of the voltage divider RT.
In some examples, the method 700 may include additional or alternative steps. In some examples, providing the feedback signal at block 706 includes controlling a switch responsive to the scaling amplifier operation. In some examples, the method 700 includes bypassing, by the feedback circuit, the scaling amplifier operations responsive to a bypass scaling control signal.
In some examples, the feedback circuit related to method 700 includes a scaling amplifier and a transmission gate having first and second control terminals. In such examples, the method 700 includes: connecting a power supply terminal to the first control terminal responsive to the bypass scaling control signal having a first state; connecting a ground terminal to the first control terminal responsive to the bypass scaling control signal having a second state different than the first state; connecting an output of the scaling amplifier to the second control terminal responsive to the bypass scaling control signal having the first state; and connecting the ground terminal to the second control terminal responsive to the bypass scaling control signal having the second state.
In some examples, the method 700 includes: providing a first bandgap voltage reference value responsive to the feedback circuit bypassing the scaling amplifier operations; and providing a second bandgap voltage reference value responsive to the feedback circuit not bypassing the scaling amplifier operations, the second bandgap voltage reference value greater than the first bandgap voltage reference value. In such examples, the first bandgap voltage reference value may be when VREF=VREF1 and the second bandgap voltage reference value may be when VREF=VREF2. Without limitation, VREF1 is 2.5V and VREF2 is 4.096V in some examples.
In this description, the term “couple” may cover connections, communications, or signal paths that enable a functional relationship consistent with this description. For example, if device A generates a signal to control device B to perform an action: (a) in a first example, device A is coupled to device B by direct connection; or (b) in a second example, device A is coupled to device B through intervening component C if intervening component C does not alter the functional relationship between device A and device B, such that device B is controlled by device A via the control signal generated by device A.
Also, in this description, the recitation “based on” means “based at least in part on.” Therefore, if X is based on Y, then X may be a function of Y and any number of other factors.
A device that is “configured to” perform a task or function may be configured (e.g., programmed and/or hardwired) at a time of manufacturing by a manufacturer to perform the function and/or may be configurable (or reconfigurable) by a user after manufacturing to perform the function and/or other additional or alternative functions. The configuring may be through firmware and/or software programming of the device, through a construction and/or layout of hardware components and interconnections of the device, or a combination thereof.
As used herein, the terms “terminal”, “node”, “interconnection”, “pin” and “lead” are used interchangeably. Unless specifically stated to the contrary, these terms are generally used to mean an interconnection between or a terminus of a device element, a circuit element, an integrated circuit, a device or other electronics or semiconductor component.
A circuit or device that is described herein as including certain components may instead be adapted to be coupled to those components to form the described circuitry or device. For example, a structure described as including one or more semiconductor elements (such as transistors), one or more passive elements (such as resistors, capacitors, and/or inductors), and/or one or more sources (such as voltage and/or current sources) may instead include only the semiconductor elements within a single physical device (e.g., a semiconductor die and/or integrated circuit (IC) package) and may be adapted to be coupled to at least some of the passive elements and/or the sources to form the described structure either at a time of manufacture or after a time of manufacture, for example, by an end-user and/or a third-party.
While the use of particular transistors is described herein, other transistors (or equivalent devices) may be used instead with little or no change to the remaining circuitry. For example, a field effect transistor (“FET”) such as an NFET or a PFET, a bipolar junction transistor (BJT—e.g., NPN transistor or PNP transistor), an insulated gate bipolar transistor (IGBT), and/or a junction field effect transistor (JFET) may be used in place of or in conjunction with the devices described herein. The transistors may be depletion mode devices, drain-extended devices, enhancement mode devices, natural transistors or other types of device structure transistors. Furthermore, the devices may be implemented in/over a silicon substrate (Si), a silicon carbide substrate (SiC), a gallium nitride substrate (GaN) or a gallium arsenide substrate (GaAs).
References may be made in the claims to a transistor's control terminal and its first and second terminals. In the context of a FET, the control terminal is the gate, and the first and second terminals are the drain and source. In the context of a BJT, the control terminal is the base, and the first and second terminals are the collector and emitter.
References herein to a FET being “ON” means that the conduction channel of the FET is present and drain current may flow through the FET. References herein to a FET being “OFF” means that the conduction channel is not present so drain current does not flow through the FET. An “OFF” FET, however, may have current flowing through the transistor's body-diode.
Circuits described herein are reconfigurable to include additional or different components to provide functionality at least partially similar to functionality available prior to the component replacement. Components shown as resistors, unless otherwise stated, are generally representative of any one or more elements coupled in series and/or parallel to provide an amount of impedance represented by the resistor shown. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in parallel between the same nodes. For example, a resistor or capacitor shown and described herein as a single component may instead be multiple resistors or capacitors, respectively, coupled in series between the same two nodes as the single resistor or capacitor.
While certain elements of the described examples are included in an integrated circuit and other elements are external to the integrated circuit, in other examples, additional or fewer features may be incorporated into the integrated circuit. In addition, some or all of the features illustrated as being external to the integrated circuit may be included in the integrated circuit and/or some features illustrated as being internal to the integrated circuit may be incorporated outside of the integrated circuit. As used herein, the term “integrated circuit” means one or more circuits that are: (i) incorporated in/over a semiconductor substrate; (ii) incorporated in a single semiconductor package; (iii) incorporated into the same module; and/or (iv) incorporated in/on the same printed circuit board.
Uses of the phrase “ground” in the foregoing description include a chassis ground, an Earth ground, a floating ground, a virtual ground, a digital ground, a common ground, and/or any other form of ground connection applicable to, or suitable for, the teachings of this description. In this description, unless otherwise stated, “about,” “approximately” or “substantially” preceding a parameter means being within +/−10 percent of that parameter or, if the parameter is zero, a reasonable range of values around zero.
Modifications are possible in the described examples, and other examples are possible, within the scope of the claims.
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