Claims
- 1. A method of forming coloration on a glass surface comprising the steps of:
- (a) providing a glass having a reducible phase;
- (b) depositing a protective layer of material on at least one surface of said glass, whereby said protective layer is capable of retarding penetration of a reducing gas, and said protective layer is characterized by having a thickness gradient; and
- (c) subjecting said glass to reducing gas treatment at a temperature in a range of 300-600.degree. C., to produce a resultant glass that exhibits gradient coloration.
- 2. The method of claim 1, wherein said glass has said reducible phase selected from the group consisting of Ag, Cu, Pb, As, and Sb.
- 3. The method of claim 1, wherein said reducing gas is selected from the group consisting of H.sub.2 cracked ammonia, forming gas, and D.sub.2.
- 4. The method of claim 1, wherein said protective layer is formed by a method selected from the group consisting of sputtering, thermal evaporation, and chemical vapor deposition.
- 5. The method of claim 1, wherein said material is selected from the group consisting of metal, metal oxide, and semiconductor.
- 6. The method of claim 5, wherein said material is further selected from the group consisting of Al, Cr, Mo, Ta, W, and ZnO.
- 7. The method of claim 6, wherein said protective layer of material has a thickness in the range of 0.1 to 5 .mu.m.
- 8. The method of claim 1, wherein said protective layer of material is deposited onto said glass through holes in a shadow mask.
- 9. The method of claim 1, further comprising the steps of:
- (a) depositing a film of photoresist on the surface of said protective layer;
- (b) exposing said photoresist to light radiation through a photomask;
- (c) developing and removing said photoresist after exposing to thereby reveal underlying said protective layer; and
- (d) removing said protective layer to thereby reveal underlying said glass.
- 10. The method of claim 9, wherein said photomask is patterned.
- 11. The method of claim 1, wherein said protective layer has a pre-determined pattern.
- 12. The method of claim 1, wherein said protective layer is removed by a method selected from the group consisting of dry and wet chemical etching, laser ablation, sand blasting, and electron beam technique.
Parent Case Info
This Appln is a International 371 of PCT/US97/04973 filed Mar. 25, 1997 and also claims the benefit of U.S. Provisional No. 60/014853 filed Apr. 4, 1996.
PCT Information
Filing Document |
Filing Date |
Country |
Kind |
102e Date |
371c Date |
PCT/US97/04973 |
3/25/1997 |
|
|
9/22/1998 |
9/22/1998 |
Publishing Document |
Publishing Date |
Country |
Kind |
WO97/37946 |
10/16/1997 |
|
|
US Referenced Citations (10)
Foreign Referenced Citations (2)
Number |
Date |
Country |
1 459 722 |
Dec 1976 |
GBX |
WO 9735812 |
Oct 1997 |
WOX |