Patent Application
20250239781
This application relates to the field of antenna technologies, and in particular, to a base station antenna and a base station.
In an antenna system, radiating elements may be blocked by surrounding metal components. When electromagnetic waves are propagated to the metal components, scattering occurs on surfaces of the metal components, the electromagnetic waves cannot be completely propagated to back sides of the metal components. Consequently, an electromagnetic shadow is generated at the back sides of the metal components. For a signal receiving process of an antenna, the electromagnetic shadow causes deterioration of quality of received signals of radiating elements located at the back sides of the metal components. For a signal radiation process of the antenna, the electromagnetic shadow affects communication quality of terminals located at the back sides of the metal components.
This application provides a base station antenna and a base station, to mitigate a problem of an electromagnetic shadow caused by blocking of a metal component.
According to a first aspect, this application provides a base station antenna, including a first antenna array, a frequency selective surface, a second antenna array, and an antenna conductive component. The frequency selective surface is located between a first radiator of a radiating element of the first antenna array and the second antenna array. The frequency selective surface is configured to reflect a radiation signal of the first antenna array and transmit a radiation signal of the second antenna array. The antenna conductive component and the first antenna array are located on a same side of an array surface of the second antenna array. The antenna conductive component includes a conductive substrate, a first structural unit, and a second structural unit. Both the first structural unit and the second structural unit encircle the conductive substrate once, and the first structural unit and the second structural unit are spaced apart and adjacent to each other, to form a capacitor.
In the solution of this application, the frequency selective surface is located between the first radiator of the radiating element of the first antenna array and the second antenna array, so that the frequency selective surface can be used as a reference surface to implement stacked arrangement of the first antenna array and the second antenna array. In the stacked arrangement, antenna arrays with more frequency bands and channels can be deployed in a case of a limited dimension of an antenna aperture, to meet a communication requirement. Because the frequency selective surface can allow transmitting an electromagnetic wave of the second antenna array, the frequency selective surface does not block a signal of the second antenna array. The antenna conductive component physically blocks the second antenna array due to a position of the antenna conductive component. However, a slot is formed between structural units in the antenna conductive component, the slot and structural units on two sides may form a capacitor, and the capacitor restricts an electromagnetic wave to propagate in the slot, so that the electromagnetic wave can propagate around the antenna conductive component to a back side of the antenna conductive component, thereby reducing or eliminating an electromagnetic shadow.
In an implementation of the first aspect, the antenna conductive component is located between the first antenna array and the second antenna array. In this solution, the antenna conductive component is disposed between the first antenna array and the second antenna array. This still meets a design in which the antenna conductive component and the first antenna array are located on the same side of the array surface of the second antenna array. In this solution, the position of the antenna conductive component is limited, so that for a typical application scenario in which antennas are arranged in a stacked manner, the antenna arrays with more frequency bands and channels can be deployed in the case of the limited dimension of the antenna aperture, and the electromagnetic shadow can be mitigated.
In an implementation of the first aspect, the conductive substrate includes a feeding network, and the feeding network is connected to the radiating element of the first antenna array. In this solution, a structural unit and a capacitor are formed on an outer side of the feeding network, so that the feeding network can have electromagnetic stealth performance, and a problem of an electromagnetic shadow caused by physical blocking of the feeding network on the second antenna array is mitigated.
In an implementation of the first aspect, the frequency selective surface is not electrically connected to the first antenna array and the second antenna array, and/or the frequency selective surface is not electrically connected to the feeding network. In this solution, the frequency selective surface is not electrically connected to the antenna array, so that a feed signal of the antenna array is not transmitted through the frequency selective surface. Therefore, a feed path can be shortened, and a loss can be reduced. In addition, a structure of the frequency selective surface can be simple, and costs can be reduced. Because the frequency selective surface is not electrically connected to the feeding network used as the conductive substrate, there is basically no coupling between the frequency selective surface and the feeding network, so that electromagnetic stealth performance and frequency selection performance of the frequency selective surface can be ensured.
In an implementation of the first aspect, the first antenna array and the antenna conductive component are located on a same side of the frequency selective surface. In this solution, a position relationship between the first antenna array, the antenna conductive component, and the frequency selective surface is limited, so that for the typical application scenario in which the antennas are arranged in the stacked manner, the antenna arrays with more frequency bands and channels can be deployed in the case of the limited dimension of the antenna aperture, and the electromagnetic shadow can be mitigated.
In an implementation of the first aspect, the radiating element of the first antenna array includes a feeding structure, the feeding structure is connected to the first radiator and the feeding network, the feeding structure passes through the frequency selective surface, and the first radiator and the antenna conductive component are respectively located on two opposite sides of the frequency selective surface.
In this solution, the position relationship between the first antenna array, the antenna conductive component, and the frequency selective surface is limited, so that for the typical application scenario in which the antennas are arranged in the stacked manner, the antenna arrays with more frequency bands and channels can be deployed in the case of the limited dimension of the antenna aperture, and the electromagnetic shadow can be mitigated. In this solution, a position of the frequency selective surface may be determined based on an antenna design requirement. The antenna conductive component is disposed on a side of the frequency selective surface facing away from the first radiator, so that a distance between the antenna conductive component and the first radiator is large, to reduce impact of the antenna conductive component (including the feeding network) on near-field coupling of the first antenna array, and ensure performance of the first antenna array.
In an implementation of the first aspect, the frequency selective surface includes a first frequency selective surface and a second frequency selective surface that are stacked and spaced apart, where the first frequency selective surface is located between the first radiator and the second frequency selective surface. The radiating element of the first antenna array includes a feeding structure, where the feeding structure is connected to the first radiator and the feeding network, the feeding structure passes through the first frequency selective surface, and the first radiator and the antenna conductive component are respectively located on two opposite sides of the first frequency selective surface.
In this solution, a quantity of frequency selective surfaces is limited, and the position relationship between the first antenna array, the antenna conductive component, and the frequency selective surface is limited, so that for the typical application scenario in which the antennas are arranged in the stacked manner, the antenna arrays with more frequency bands and channels can be deployed in the case of the limited dimension of the antenna aperture, and the electromagnetic shadow can be mitigated. In this solution, positions of the first frequency selective surface and the second frequency selective surface may be determined based on an antenna design requirement. A thickness of the antenna conductive component (where the conductive substrate is the feeding network) can be small, so that the antenna conductive component can be located between the first frequency selective surface and the second frequency selective surface. In this way, a total thickness of a first antenna can be small. In addition, a plurality of layers of frequency selective surfaces may enhance filtering selectivity, facilitating expansion of a bandwidth of an antenna.
In an implementation of the first aspect, the frequency selective surface includes a first frequency selective surface and a second frequency selective surface that are stacked and spaced apart, where the first frequency selective surface is located between the first radiator and the second frequency selective surface. The antenna conductive component passes through the first frequency selective surface, and the radiating element of the first antenna array and the second antenna array are respectively located on two opposite sides of the first frequency selective surface.
In this solution, a quantity of frequency selective surfaces is limited, and the position relationship between the first antenna array, the antenna conductive component, and the frequency selective surface is limited, so that for the typical application scenario in which the antennas are arranged in the stacked manner, the antenna arrays with more frequency bands and channels can be deployed in the case of the limited dimension of the antenna aperture, and the electromagnetic shadow can be mitigated. In this solution, positions of the first frequency selective surface and the second frequency selective surface may be determined based on an antenna design requirement. The antenna conductive component (where the conductive substrate is the feeding network) passes through the first frequency selective surface, so that a distance between the feeding network and the first radiator is not excessively large, to reduce a loss. In addition, the distance between the feeding network and the first radiator is not excessively small, to mitigate impact of the feeding network on near-field coupling of the first antenna array. In addition, a plurality of layers of frequency selective surfaces may enhance filtering selectivity, facilitating expansion of a bandwidth of the second antenna array.
In an implementation of the first aspect, the first radiator includes a second radiator and a third radiator, where a frequency band of the second radiator is different from a frequency band of the third radiator. The feeding network includes a first feeding network and a second feeding network, where the first feeding network is electrically connected to the second radiator, and the second feeding network is electrically connected to the third radiator. In this solution, the first antenna array includes a plurality of frequency bands, so that a quantity of frequency bands and a quantity of channels of the base station antenna can be increased, to increase utilization of a dimension of an antenna aperture.
In an implementation of the first aspect, a radiating element of the second antenna array includes a fourth radiator and a fifth radiator, and a frequency band of the fourth radiator is different from a frequency band of the fifth radiator. In this solution, the second antenna array has a plurality of frequency bands, so that a quantity of frequency bands and a quantity of channels can be extended.
In an implementation of the first aspect, a minimum spacing between the frequency selective surface and the antenna conductive component is greater than or equal to 0.1 time a wavelength corresponding to a highest operating frequency of the second antenna array. In this solution, the minimum spacing between the frequency selective surface and the antenna conductive component is limited, so that strong coupling between the frequency selective surface and the antenna conductive component can be avoided, to ensure electromagnetic stealth performance and frequency selection performance of the frequency selective surface.
In an implementation of the first aspect, the frequency selective surface includes a plurality of frequency selective units, and the plurality of frequency selective units include a first frequency selective unit. A structure of the first frequency selective unit is different from a structure of another frequency selective unit, and the first frequency selective unit overlaps an orthographic projection of the antenna conductive component on the frequency selective surface.
In this solution, the structure of the first frequency selective unit in the frequency selective surface is unique, and such a frequency selective surface may be considered to be of a quasi-periodic array structure. The frequency selective surface is manufactured into the quasi-periodic array structure, so that the structure of the first frequency selective unit close to the antenna conductive component is different from the structure of the another frequency selective unit, and coupling between the frequency selective surface and the antenna conductive component can be reduced, to ensure electromagnetic stealth performance and frequency selection performance of the frequency selective surface. This solution is applicable to the following scenario: If a spacing between the frequency selective surface and the antenna conductive component cannot meet a requirement of the minimum spacing due to a product design limitation, coupling between the frequency selective surface and the antenna conductive component can be reduced by using this solution.
In an implementation of the first aspect, the frequency selective surface includes a first part and a second part connected to each other, the first part does not include a conductor material, the first part overlaps an orthographic projection of the antenna conductive component on the frequency selective surface, and the second part includes a conductor material.
In this solution, a conductor layer in the first part that is of the frequency selective surface and that is close to the antenna conductive component is removed, so that coupling between the frequency selective surface and the antenna conductive component can be greatly reduced, to ensure electromagnetic stealth performance and frequency selection performance of the frequency selective surface. This solution is applicable to the following scenario: If a spacing between the frequency selective surface and the antenna conductive component cannot meet a requirement of the minimum spacing due to a product design limitation, coupling between the frequency selective surface and the antenna conductive component can be reduced by using this solution.
In an implementation of the first aspect, the base station antenna includes a first radome and a second radome. The first antenna array, the frequency selective surface, and the antenna conductive component are all located in the first radome, and the second antenna array is located in the second radome. In this solution, the first antenna array and the second antenna array are respectively disposed in different radomes, so that the two antennas can be separately deployed, to implement a decoupling design and flexible deployment of antennas on different frequency bands.
In an implementation of the first aspect, capacitance values of different parts of the capacitor are different. In this solution, because capacitance values of different regions of the capacitor are different, electromagnetic wave signals of different frequency bands can all resonate in a slot based on respective electrical lengths of the electromagnetic wave signals, so that electromagnetic waves of the different frequency bands can all pass through the slot. Therefore, the capacitance values of the different regions of the capacitor are different, so that electromagnetic waves of a plurality of frequency bands can be allowed to pass through the slot, to expand a stealth bandwidth.
In an implementation of the first aspect, the antenna conductive component includes at least two structural units, and both the first structural unit and the second structural unit are structural units in the at least two structural units. At least one structural unit is provided with a coupling slot, and parts of the structural unit that are respectively located on two sides of the coupling slot are separated by the coupling slot, and are coupled via the coupling slot.
In this solution, a coupling slot is formed in a structural unit, so that different parts of the structural unit are sequentially assembled on the conductive substrate, and finally assembled into a complete structural unit. In this way, reliable assembly of the structural unit can be implemented in some scenarios. Especially when a size of the conductive substrate is large and a quantity of structural units is large, an assembly process can be simplified in a split assembly manner, and an assembly yield is improved. In addition, the coupling slot can allow electromagnetic waves of some frequency bands to pass through, so that the antenna conductive component has a function of expanding a stealth bandwidth to some extent.
In an implementation of the first aspect, the antenna conductive component includes the at least two structural units, and both the first structural unit and the second structural unit are the structural units in the at least two structural units. The at least two structural units are of a same structure, there is a slot between any two adjacent structural units, slots are of a same shape, and the capacitor is formed between any two adjacent structural units.
In this solution, structures of all structural units are consistent. There is a slot between any two structural units, and the slots are of a same shape. In this way, the capacitor is formed between any two adjacent structural units. In this solution, a plurality of capacitors are formed on the antenna conductive component, so that an electromagnetic wave can be diffracted in each region of the antenna conductive component, to enable the entire antenna conductive component to be hidden from the electromagnetic wave, thereby avoiding an electromagnetic shadow. In this solution, all structural units can form a periodic structure layer, and the periodic structure layer is easy to manufacture and has good mass production performance.
In an implementation of the first aspect, the antenna conductive component includes the at least two structural units, and both the first structural unit and the second structural unit are the structural units in the at least two structural units. Structures of the at least two structural units are not totally the same, and/or there is a slot between the at least two structural units, shapes of slots are not totally the same, and the capacitor is formed between any two adjacent structural units.
In this solution, “are not totally the same” means that any two are different; or at least two, but not all, are the same. In this solution, in comparison with the foregoing periodic structure layer, all structural units can form a quasi-periodic structure layer. The quasi-periodic structure layer can adapt to a shape and a structure of the conductive substrate.
According to a second aspect, this application provides a base station, including a pole and the base station antenna of any one of the foregoing implementations, where the base station antenna is fastened on the pole. In this solution, because the base station antenna includes antenna arrays arranged in a stacked manner, antenna arrays with more frequency bands and channels can be deployed in a case of a limited dimension of an antenna aperture, to meet a communication requirement. Due to the design of the antenna conductive component, an electromagnetic shadow conductivity problem of the stacked antenna can be mitigated.
The following describes the technical solutions in embodiments of this application with reference to the accompanying drawings in embodiments of this application. It is clear that the described embodiments are merely a part rather than all of embodiments of this application.
In embodiments of this application, the terms “first”, “second”, “third”, “fourth”, “fifth”, and the like are merely used to distinguish components, and cannot be understood as indication or implication of relative importance of components or implicitly indication of the quantity of indicated technical features. Therefore, a feature limited by “first”, “second”, or the like may explicitly or implicitly include one or more of the features. In the descriptions of embodiments of this application, unless otherwise specified, “a plurality of (layers)” means two (layers) or more (layers).
In embodiments of this application, the terms such as “up”, “down”, “front”, “front side”, “back”, and “back side” are defined with respect to a position of a schematic structural placement in the accompanying drawings. It should be understood that these directional terms are relative concepts, are relative descriptions and clarifications, and may change accordingly based on a change of a position of a structure.
In embodiments of this application, unless otherwise specified, “and/or” is merely an association relationship for describing an associated object, and represents that three relationships may exist. For example, A and/or B may represent the following three cases: Only A exists alone, both A and B exist, and only B exists.
Embodiments of this application relate to a base station and a base station antenna. The following first describes the base station, and then describes the base station antenna.
The base station is equipped with a base station antenna to implement signal transmission in space.
The pole 11 may be fastened to the ground. The pole support 12 is connected to the pole 11 and the radome 13, and the radome 13 is fastened to the pole 11 through the pole support 12. The antenna array 14 may be mounted in the radome 13. A feeding network may be further mounted in the radome 13. The radome 13 has a good electromagnetic wave penetration characteristic and weatherability, and can protect components mounted in the radome 13.
The antenna array 14 is configured to radiate and receive antenna signals. The antenna array 14 may include a plurality of radiating elements that are arranged in an array according to a specific rule, and each radiating element can radiate and receive electromagnetic waves. The radiating element may include an antenna element. In the antenna array 14, operating frequency bands of different radiating elements may be the same or different. The radiating element may include a radiator (for example, a radiation arm) and a feeding structure (for example, a balun) connected to each other. The radiator is configured to radiate and receive signals. The feeding structure is connected to the radiator and the feeding network, to transmit, to the radiator, an electrical signal transmitted by the feeding network, and transmit, to the feeding network, the signal received by the radiator.
The base station antenna may further include the reflection panel. The reflection panel may also be referred to as a bottom panel, an antenna panel, a reflection surface, or the like. For example, the reflection panel may be manufactured by using a metal material. The radiating element may be mounted on a surface on one side of the reflection panel. When the radiating element receives an antenna signal, the reflection panel may reflect and aggregate the antenna signal on a receiving point, to implement directional receiving. When the radiating element transmits an antenna signal, the reflection panel may implement directional transmission of the antenna signal. The reflection panel may enhance a capability of receiving or transmitting an antenna signal of the radiating element, and may further block and shield an interference effect of another signal from a back (where the back refers to a side of the reflection panel facing away from the radiating element) of the reflection panel on the antenna signal, to improve a gain of an antenna.
The radio frequency processing unit 15 (which may also be referred to as a remote radio unit (RRU)) may be connected to the feeding network via a jumper, and is electrically connected to the antenna array 14 via the feeding network. The feeding network (which is further described below) may be used as a signal transmission path between the radio frequency processing unit 15 and the antenna array 14. The radio frequency processing unit 15 may be electrically connected to the baseband processing unit 17 (which may also be referred to as a baseband unit (BBU)) via the cable 16 (for example, an optical cable). As shown in
The radio frequency processing unit 15 may perform frequency selection, amplification, and down-conversion on an antenna signal received by the antenna array 14, convert a processed antenna signal into an intermediate frequency signal or a baseband signal, and send the intermediate frequency signal or the baseband signal to the baseband processing unit 17. The radio frequency processing unit 15 may alternatively perform up-conversion and amplification on the baseband processing unit 17 or an intermediate frequency signal, and convert the baseband processing unit 17 or a processed intermediate frequency signal into an electromagnetic wave through the antenna array 14 and send the electromagnetic wave.
For example, the feeding network 18 may include a phase shifter 181, and the phase shifter 181 is configured to change a maximum direction of antenna signal radiation. The feeding network 18 may further include a module configured to extend performance, for example, a power splitter 182. The power splitter 182 is configured to combine multiple signals into one signal, and transmit the signal through the antenna array 14; or the power splitter 182 divides one signal into multiple signals, for example, divides, based on different frequencies, a signal received by the antenna array 14 into multiple signals, and transmits the multiple signals to the baseband processing unit 17 for processing. The feeding network 18 may further include a filter 183, configured to filter out an interference signal. The feeding network 18 may further include a combiner. The feeding network 18 may further include a transmission line in any form, such as a coaxial line, a strip line, or a microstrip.
A structure of the base station 1 shown in
In the base station, the antenna array may be blocked by surrounding conductor components (where the conductor component includes at least a conductive part, for example, all regions of the conductor component are conductors, or the conductor component includes a conductor part and an insulation part, and in the following, the conductor component is referred to as a conductive substrate). When electromagnetic waves are propagated to the conductor components, scattering occurs on surfaces of the conductor components, the electromagnetic waves cannot be completely propagated to back sides of the conductor components. Consequently, an electromagnetic shadow is generated at the back sides of the conductor components. For a signal receiving process, the electromagnetic shadow causes deterioration of quality of received signals of antenna arrays located at the back sides of the conductor components. For a signal radiation process, the electromagnetic shadow affects communication quality of terminals located at the back sides of the conductor components. In addition, with the development of the wireless communication industry, a base station is required to have more communication frequency bands and channels to meet a communication requirement. However, space resources of antenna installation platforms of operators' sites are limited, and dimensions of antenna apertures are strictly limited. As a result, a quantity of frequency bands and a quantity of channels cannot be increased.
To resolve the foregoing problem, for the base station antenna in embodiments of this application, an “electromagnetic stealth” design is used for a conductor component around an antenna array, so that an electromagnetic wave can bypass the conductor component and continue being propagated, thereby mitigating a problem of an electromagnetic shadow. According to a “stacking design” of the antenna array, antenna arrays with more frequency bands and channels can be disposed in a case of a limited dimension of an antenna aperture. The following first describes an overall framework structure of the base station antenna in detail, including the “stacking design”, and then describes the “electromagnetic stealth” design.
As shown in
The first antenna may include a first radome 21, a first antenna array 2A, an antenna conductive component 3, and a frequency selective surface (FSS) 24. The first antenna array 2A, the antenna conductive component 3, and the frequency selective surface 24 may all be located in the first radome 21.
The second antenna may include a second radome 26 and a second antenna array 2B, and the second antenna array 2B is located in the second radome 26.
In this embodiment, the first radome 21 and the second radome 26 are two independent radomes, and the two radomes may be fastened to a same pole or tower. The first antenna array 2A and the second antenna array 2B are respectively disposed in different radomes, so that the two antennas can be separately deployed, to implement a decoupling design and flexible deployment of antennas on different frequency bands. It may be understood that the solution in this embodiment is merely an example. In another embodiment, the first antenna array and the second antenna array may alternatively be located in a same radome.
As shown in
In this embodiment of this application, the antenna conductive component 3 and the first antenna array 2A may be located on a same side of an array surface of the second antenna array 2B. For example, as shown in
In another embodiment, the antenna conductive component 3 and the first antenna array 2A being located on the same side of the array surface of the second antenna array 2B may further include the following design: The antenna conductive component 3, the first antenna array 2A, and the second antenna array 2B are sequentially stacked, and the first antenna array 2A is located between the antenna conductive component 3 and the second antenna array 2B. Alternatively, the antenna conductive component 3 and the first antenna array 2A may be approximately side-by-side (not in an evident stacking relationship), and are located on the same side of the second antenna array 2B.
In this embodiment, the antenna conductive component 3 may be a feeding network that features the electromagnetic stealth design. Descriptions are provided below.
As shown in
In another embodiment, the antenna conductive component may alternatively be another component that features the electromagnetic stealth design. In other words, the conductive substrate in the antenna conductive component may be a conductive component other than the feeding network. The following lists several other antenna conductive components with reference to
Refer to
Similarly, the pole support 12 may be used as a conductive substrate, and the pole support 12 and a structure layer on the pole support 12 may form another antenna conductive component.
Alternatively, another metal member (such as a drive mechanism or a support structure) in the base station 1 may be used as a conductive substrate, and the metal member and a structure layer on the metal member may form another antenna conductive component.
In another embodiment, a specific position of the antenna conductive component may be different based on a specific product type of the antenna conductive component. However, the position of the antenna conductive component always meets the following design requirement: The antenna conductive component and the first antenna array are located on the same side of the array surface of the second antenna array.
As shown in
As shown in
Therefore, the frequency selective surface 24 is used as a stacking reference surface, and it may be referred to that the first antenna array and the second antenna array are arranged in a stacked manner, or that the first antenna and the second antenna are arranged in a stacked manner. In the stacked arrangement, antenna arrays with more frequency bands and channels can be deployed in a case of a limited dimension of an antenna aperture, to meet a communication requirement.
In this embodiment, a frequency band of the first antenna array 2A may be lower than a frequency band of the second antenna array 2B. In this way, transceiver performance of the first antenna and the second antenna can be ensured. In another embodiment, the frequency band of the first antenna array 2A and the frequency band of the second antenna array 2B may not be limited.
In this embodiment of this application, the frequency selective surface 24 may be generally of a two-dimensional planar structure. From a perspective of a cross-sectional structure, the frequency selective surface 24 may include an insulation substrate layer and a conductor layer. The conductor layer is attached to the insulation substrate layer. Alternatively, the frequency selective surface 24 may include a conductor layer, but does not include an insulation substrate layer. The insulation substrate layer is made of an insulation material, and the conductor layer is made of a conductor material. The frequency selective surface 24 has a good design characteristic and may be light.
In this embodiment of this application, the frequency selective surface 24 may be divided into a plurality of frequency selective units, and all the frequency selective units may be arranged in a specific manner.
For example, in an implementation, all the frequency selective units may be closely connected without gaps. For example,
In this embodiment of this application, the frequency selective unit may be approximately a two-dimensional planar structure or a three-dimensional structure. In an implementation, structures of all frequency selective units may be the same, and the frequency selective surface 24 may be considered to be of a periodic array structure. In another implementation, structures of all frequency selective units are not totally the same. For example, structures of any two frequency selective units are different (where each frequency selective unit may be referred to as a first frequency selective unit); or at least two frequency selective units are of a same structure (where each such frequency selective unit may be referred to as a first frequency selective unit), but a structure of the first frequency selective unit is different from a structure of another frequency selective unit. Such a frequency selective surface 24 may be considered to be of a quasi-periodic array structure.
As shown in
The frequency selective surface 24 has a specific frequency selection function, and may present transmittance for an incident wave of one frequency band, and reflectivity for an incident wave of another frequency band, so that transmission and reflection of incident electromagnetic waves can be effectively controlled. The frequency selective surface 24 may be, for example, a spatial filter, and interacts with an electromagnetic wave to exhibit an evident band-pass or band-stop filtering characteristic. The plurality of frequency selective surfaces 24 may be used as a multi-order spatial filter, to expand a bandwidth and increase frequency selectivity.
In this embodiment, the frequency selective surface 24 can reflect most electromagnetic waves radiated by the first antenna array 2A. Therefore, the frequency selective surface 24 may be used as a reflection panel of the first antenna array 2A. The frequency selective surface 24 can also transmit an electromagnetic wave radiated by the second antenna array 2B. Therefore, the frequency selective surface 24 does not block the second antenna array 2B, and the frequency selective surface 24 is equivalent to electromagnetic transparency for the electromagnetic wave radiated by the second antenna array 2B.
In this embodiment, refer to
In this embodiment, refer to
An objective of the foregoing “not electrical connection” design is as follows: Because the frequency selective surface 24 is not electrically connected to both the first antenna array 2A and the second antenna array 2B, a feed signal of the antenna array is not transmitted through the frequency selective surface 24. This can shorten a feed path, and a loss can be reduced. In addition, a structure of the frequency selective surface 24 can be simple, and costs can be reduced. Because the frequency selective surface 24 is not electrically connected to the feeding network used as the conductive substrate 31, there is basically no coupling between the frequency selective surface 24 and the feeding network, so that electromagnetic stealth performance and frequency selection performance of the frequency selective surface 24 can be ensured.
In another embodiment, based on a product requirement, the frequency selective surface 24 may alternatively be electrically connected to the feeding network used as the conductive substrate 31. This can reduce impact of an induced current generated by the feeding network on the first antenna array 2A and the second antenna array 2B, to improve performance of a multi-frequency band base station antenna.
In this embodiment shown in
In the embodiment shown in
As shown in
In the embodiment shown in
In another embodiment, different from that shown in
In the embodiment shown in
In another embodiment, different from that shown in
According to the stacked arrangement design and the electromagnetic stealth design in any one of the foregoing embodiments, in an embodiment shown in
For example, as shown in
In the embodiment shown in
In the foregoing embodiments, for example, a minimum spacing between a frequency selective surface and an antenna conductive component may be limited (where the minimum spacing may be not less than 0.1 time a wavelength corresponding to a highest operating frequency of a second antenna array), to avoid strong coupling between the frequency selective surface and a structure layer, and ensure electromagnetic stealth performance and frequency selection performance of the frequency selective surface 24. In some scenarios, the minimum spacing may not need to be limited, but the frequency selective surface is manufactured into a quasi-periodic array structure, to reduce coupling between the frequency selective surface and the structure layer. Descriptions are provided below.
As shown in
In this embodiment, if there are more than two layers of frequency selective surfaces 24, the design of the quasi-periodic array structure may be applied to all the frequency selective surfaces 24, or the design of the quasi-periodic array structure may be used only in a frequency selective surface 24 that is close to the antenna conductive component 3.
In this embodiment, the frequency selective surface 24 is manufactured into the quasi-periodic array structure, so that a structure of a frequency selective unit close to the antenna conductive component 3 is different from a structure of another frequency selective unit, and coupling between the frequency selective surface 24 and a structure layer 3 can be reduced, to ensure electromagnetic stealth performance and frequency selection performance of the frequency selective surface 24.
The solution in this embodiment is applicable to the following scenario: If a spacing between the frequency selective surface and the antenna conductive component cannot meet a requirement of the minimum spacing due to a product design limitation, coupling between the frequency selective surface and the structure layer can be reduced by using the solution in this embodiment. It may be understood that, in a scenario in which the spacing between the frequency selective surface and the antenna conductive component already meets the requirement of the minimum spacing, the solution in this embodiment may still be used, to further reduce coupling between the frequency selective surface and the structure layer.
Different from that shown in
As shown in
In the solution of this embodiment, the conductor layer of the region that is of the frequency selective surface and that is close to the antenna conductive component 3 is removed, so that coupling between the frequency selective surface and the structure layer can be greatly reduced.
The foregoing describes an overall framework structure of the base station antenna in embodiments of this application. The following describes the electromagnetic stealth design of the antenna conductive component in embodiments of this application in detail. It may be understood that all antenna conductive components described below may be used in the base station antenna in any embodiment of this application.
The foregoing describes an overall framework structure of the base station antenna in embodiments of this application. The following describes the electromagnetic stealth design of the antenna conductive component in embodiments of this application in detail. It may be understood that all antenna conductive components described below may be used in the base station antenna in any embodiment of this application.
For example, the conductive substrate 31 may be approximately cylindrical, and an axial length of the conductive substrate 31 is, for example, at least 1*λ (where λ is a wavelength corresponding to a lowest frequency band of the second antenna array 2B blocked by the conductive substrate 31). It may be understood that the approximately cylindrical conductive substrate 31 is merely an example, and an actual shape and structure of the conductive substrate are not limited in embodiments of this application. For example, a cross-sectional shape of the conductive substrate includes but is not limited to a quadrilateral, a circle, an ellipse, a hexagon, and the like.
As shown in
In an implementation, the structural unit 32 may be made of a conductor material, and the structural unit 32 may be, for example, a sheet metal-formed metal member, whose weight and structural strength are large. In another implementation, the structural unit 32 may include a conductor layer and an insulation layer. The conductor layer and the insulation layer are arranged in a stacked manner, the insulation layer is close to the conductive substrate 31, and the conductor layer faces away from the conductive substrate 31. The conductor layer is made of a conductor material, and the insulation layer is made of an insulation material. The conductor layer may be thin, and structural strength is weak. The conductor layer is attached to the insulation layer, and the insulation layer can support and strengthen the conductor layer.
As shown in
As shown in
In an implementation, the insulation medium may be continuously distributed and cover the entire outer circumferential surface of the conductive substrate 31, in other words, the insulation medium is distributed in the spacing 3a, and is also distributed in a slot between adjacent structural units 32 (where the slot is further described below).
In another implementation, the insulation medium is distributed discretely on the entire outer circumferential surface of the conductive substrate 31. For example, the insulation medium is distributed only in the spacing 3a, but is not distributed in the slot between adjacent structural units 32. An insulation medium in each spacing 3a may be discretely distributed, insulation media at various positions form a structure similar to a plurality of connecting columns, a gap is formed between the insulation media at various positions, and air exists in the gap; or the insulation medium in each spacing 3a is continuously distributed.
In this embodiment, the insulation medium can connect the structural unit 32 to the conductive substrate 31, and can also electrically isolate the structural unit 32 from the conductive substrate 31.
In this embodiment, the insulation media at various positions on the outer circumferential surface of the conductive substrate 31 may be made of a same material, in other words, the insulation media at various positions on the outer circumferential surface of the conductive substrate 31 have a same dielectric constant. In another embodiment, the insulation media at various positions on the outer circumferential surface of the conductive substrate may be different materials with different dielectric constants, and this solution is further described below.
In this embodiment, for the structural unit 32 including the conductor layer and the insulation layer, the insulation layer in the structural unit 32 may replace the insulation medium in the spacing 3a. In other words, the structural unit 32 including the conductor layer and the insulation layer may be connected to the conductive substrate 31, and there may be no spacing between the structural unit 32 and the conductive substrate 31. It may be understood that, based on a product requirement, there may also be a spacing between the structural unit 32 including the conductor layer and the insulation layer and the conductive substrate 31, and an insulation medium may be additionally filled in the spacing.
In this embodiment, the insulation medium (for example, the insulation medium that is distributed discretely) may also be referred to as an insulation support, and the insulation support is configured to connect the structural unit 32 and the conductive substrate 31 and isolate the structural unit 32 from the conductive substrate 31. When there is no insulation medium and the structural unit 32 includes the insulation layer and the conductive layer, the insulation layer in the structural unit 32 may also be referred to as an insulation support, and the structural unit 32 is connected to the conductive substrate 31 through the insulation support, and is isolated from the conductive substrate 31.
As shown in
As shown in
In this embodiment, a capacitance value C of the first capacitor 32a satisfies a capacitance formula: C=εS/d, where ε is a dielectric constant of a medium between plates, S is a plate area, and d is a distance between the plates. The plates are the structural units 32 on two sides of the first capacitor 32a, the medium between the plates is the insulation medium (in a case in which the insulation medium is distributed in the slot between the structural units 32) or air (in a case in which the insulation medium does not exist in the slot between the structural units 32), S is a facing area of the adjacent structural units 32, and d is a slot width.
In this embodiment, because the first part 32b and the third part 32d are centrally symmetrically distributed, it can be learned from the foregoing capacitance formula that capacitance values of the first part 32b and the third part 32d are equal. Similarly, because the second part 32c and the fourth part 32e are centrally symmetrically distributed, capacitance values of the second part 32c and the fourth part 32e are equal. The following continues to describe features of the first capacitor 32a by using the first part 32b and the second part 32c as description objects.
As shown in
As shown in
In conclusion, in the first capacitor 32a, the slot width of the first part 32b=a slot width of the third part 32d<the slot width of the second part 32c=a slot width of the fourth part 32e, and the capacitance value of the first part 32b=the capacitance value of the third part 32d>the capacitance value of the second part 32c=the capacitance value of the fourth part 32e. In other words, slot widths of different regions of the first capacitor 32a are different, and therefore, capacitance values of the different regions of the first capacitor 32a are different.
In the implementation shown in
In another implementation, the shapes of all the structural units 32 may be not totally the same (this means that shapes of any two structural units 32 are different, or at least two structural units 32 are of a same shape, but not all the structural units 32 are of a same shape), and/or all the structural units 32 may not be evenly distributed at intervals (this means that for all slots between the structural units 32, any two slots are of different shapes; or at least two slots are of a same shape, but not all the slots are of a same shape). In this way, shapes of all the slots are not totally consistent and/or the slots are not evenly distributed at intervals, and a structure layer formed in this way may be considered to be of a quasi-periodic structure. For example, the quasi-periodic structure may be a structure obtained by deleting a plurality of structural units from the periodic structure. The structure layer of the quasi-periodic structure can adapt to an appearance structure of the conductive substrate 31. For example, if there is a protrusion at a position on an outer surface of the conductive substrate 31, the structure layer may avoid the protrusion at the position, to form the quasi-periodic structure.
The following describes an electromagnetic stealth principle of the antenna conductive component 3.
With reference to
In this embodiment, as shown in
It can be learned that the first capacitor 32a is configured to change the propagation direction of the electromagnetic wave emitted from the wave source, and constrain the electromagnetic wave to be propagated in the first capacitor 32a, so that the electromagnetic wave can be propagated around the antenna conductive component 3, and a propagation direction of the electromagnetic wave when the electromagnetic wave is emitted out of the first capacitor 32a can remain unchanged. Therefore, even though the antenna conductive component 3 blocks the wave source, because of the existence of the first capacitor 32a, the electromagnetic wave can bypass the antenna conductive component 3 and be propagated to a back side of the antenna conductive component 3, so that an electromagnetic shadow is reduced or eliminated. In addition, because the propagation direction of the electromagnetic wave may not be changed, it can be ensured that a propagation characteristic of the electromagnetic wave remains unchanged.
Therefore, in the antenna conductive component 3 in this embodiment, the at least two structural units 32 are disposed on a periphery of the conductive substrate 31, and the first capacitor 32a is formed, so that the conductive substrate 31 has electromagnetic stealth performance relative to the electromagnetic wave, to avoid or reduce blocking of the conductive substrate 31 on the electromagnetic wave.
In this embodiment, because capacitance values of different regions of the first capacitor 32a are different, electromagnetic wave signals of different frequency bands can all resonate in a slot based on respective electrical lengths of the electromagnetic wave signals, so that the electromagnetic waves of the different frequency bands can all pass through the slot. In other words, the capacitance values of the different regions of the first capacitor 32a are different, so that electromagnetic waves of a plurality of frequency bands can be allowed to pass through the slot, to expand a stealth bandwidth.
According to the foregoing principle descriptions, it is easy to understand that, as long as one first capacitor 32a exists in the antenna conductive component 3, blocking of the conductive substrate 31 on the electromagnetic wave can be mitigated, and the stealth bandwidth can be expanded. Certainly, based on an actual requirement, there may be a plurality of first capacitors 32a.
In this embodiment, a design in which a capacitance value of the first part 32b close to the wave source is large can meet propagation requirements of electromagnetic waves of some frequency bands. However, this is not a limitation on embodiments of this application. In another embodiment, a correspondence between a capacitance value of each region of the first capacitor 32a and a distance from each region of the first capacitor 32a to the wave source may be designed based on a requirement, and is not limited to the foregoing descriptions. For example, for electromagnetic waves of some frequency bands, a region that is close to the wave source in the first capacitor 32a may have a small capacitance value.
In this embodiment, the slot of the first part 32b close to the wave source has a uniform width, and the slot of the second part 32c slightly far away from the wave source has a non-uniform width. This is merely an example, and is not a limitation on embodiments of this application. For example, the slot of the first part 32b close to the wave source may alternatively have a non-uniform width, the slot of the second part 32c slightly far away from the wave source has a uniform width, and the maximum slot width of the first part 32b is less than or equal to the minimum slot width (that is, a slot width at any position of the second part 32c) of the second part 32c, so that the capacitance value of the first part 32b is greater than the capacitance value of the second part 32c.
In this embodiment, the first capacitor 32a is divided into four parts based on a width change of the slot. This is merely an example, and is not a limitation on embodiments of this application. The width change of the slot may be further designed, to obtain another quantity of parts from the first capacitor 32a through division. Actually, based on a product requirement, provided that the slot in embodiments of this application is not a constant-width slot, in this way, the stealth bandwidth can be expanded.
In this embodiment, the first part 32b and the third part 32d are centrally symmetrical, and the second part 32c and the fourth part 32e are centrally symmetrical. This design can ensure that after the electromagnetic wave is emitted out of the first capacitor 32a, a previous propagation direction and propagation characteristic (such as a polarization characteristic and a frequency band) can be maintained. However, this design is merely an example, and is not intended to limit embodiments of this application. For example, the first part 32b and the third part 32d may be only of a same shape, but are not required to be centrally symmetrical in position. In this way, although the propagation direction and the propagation characteristic of the electromagnetic wave are changed, reciprocity of an antenna signal can be satisfied, and the electromagnetic wave emitted out of the first capacitor 32a may be refracted to another direction, to further expand a signal scanning range of the second antenna array 2B (for example, this solution may be applied to a multiple-input multiple-output MIMO antenna). Alternatively, the first part 32b and the third part 32d may be of different shapes, and are not required to be centrally symmetrical in position.
The foregoing describes a principle of the electromagnetic stealth design in detail. The following describes a specific application of the electromagnetic stealth design in the base station antenna 2 with reference to
As shown in
Different from the foregoing embodiment, as shown in
As shown in
In this embodiment, because the slot width of the first part 42b is less than the slot width of the second part 42c, according to the foregoing capacitance formula, a capacitance value of the first part 42b is greater than a capacitance value of the second part 42c. In other words, slot widths of different regions of the first capacitor are different, and therefore, capacitance values of the different regions of the first capacitor are different.
As shown in
The solution in this embodiment enables the conductive substrate 41 to have electromagnetic stealth performance relative to the electromagnetic wave, to avoid or reduce blocking of the conductive substrate 41 on the electromagnetic wave, and further expand a stealth bandwidth. In addition, a structure of a slot on the antenna conductive component 4 is simple, mass production performance is good, and a specific product requirement can be met.
Different from the embodiment shown in
As shown in
In this embodiment, a total slot length formed by connecting all sub-slots 52d in the first part 52b may be greater than a slot length of the second part 52c. For the foregoing capacitance formula C=εS/d (ε is a dielectric constant of a medium between plates, S is a plate area, and d is a distance between the plates), because the slot length of the first part 52b is large, a plate area S1 of the first part 52b is large (where a slot depth of the first part 52b is consistent with a slot depth of the second part 52c). Because the slot length of the second part 52c is small, a plate area S2 of the first part 52b is small.
In this embodiment, for the first part 52b and the second part 52c, (S1/d1)>(S2/d2), so that a capacitance value C1 of the first part 52b is greater than a capacitance value C2 of the second part 52c. In other words, in this embodiment, slot lengths and slot widths of the different regions of the first capacitor may be configured, so that the capacitance values of the different regions of the first capacitor are different.
The solution in this embodiment enables the conductive substrate 51 to have electromagnetic stealth performance relative to the electromagnetic wave, to avoid or reduce blocking of the conductive substrate 41 on the electromagnetic wave, and further expand a stealth bandwidth.
The solution of this embodiment may be applied to the following scenario: When a first part of a regular shape (for example, a rectangular shape) whose slot width is less than a threshold cannot be manufactured due to a limitation of a manufacturing process, it may be considered that the first part is designed as the first part 52b (the first part 52b may be considered as an irregular shape) shown in
In another embodiment, a solution different from the embodiment shown in
For example, in an implementation, the first part may be formed by bending and connecting at least two sub-slots sequentially. The slot length of the first part is greater than the slot length of the second part, each sub-slot has a uniform width, widths of all sub-slots are consistent, the slot of the second part has a uniform width, and the slot width of the second part is equal to the slot width of the first part.
Alternatively, in another implementation, the first part may be formed by bending and connecting at least two sub-slots sequentially. The slot length of the first part is greater than the slot length of the second part, but a width of the sub-slot is not limited (for example, the sub-slot may have a non-uniform slot, and widths of sub-slots are not totally the same). The slot width of the second part is not limited either (for example, the slot of the second part may have a non-uniform width, and a value relationship between the slot width of the second part and the width of the sub-slot is not limited).
Alternatively, in another implementation, the first part may be formed by bending and connecting at least two sub-slots sequentially, and the second part may also be formed by bending and connecting at least two sub-slots sequentially. This is not limited herein.
Different from the embodiment shown in
The solution in this embodiment enables the conductive substrate 61 to have electromagnetic stealth performance relative to the electromagnetic wave, to avoid or reduce blocking of the conductive substrate 61 on the electromagnetic wave, and further expand a stealth bandwidth. In addition, a structure of a slot on the antenna conductive component 6 is simple, mass production performance is good, and a specific product requirement can be met. The following describes a specific application of the solution shown in
As shown in
As shown in
As shown in
As shown in
Same as the embodiment shown in
Different from the embodiment shown in
As shown in
In this embodiment, the coupling slot is formed in the structural unit 72, so that different parts of the structural unit 72 are sequentially assembled on the conductive substrate 71, and finally assembled into a complete structural unit 72. In this way, reliable assembly of the structural unit 72 can be implemented in some scenarios. Especially when a size of the conductive substrate 71 is large and a quantity of structural units 72 is large, an assembly process can be simplified in a split assembly manner, and an assembly yield is improved. In addition, the coupling slot can allow electromagnetic waves of some frequency bands to pass through, so that the antenna conductive component 7 has a function of expanding a stealth bandwidth to some extent.
It may be understood that a coupling slot design in this embodiment may be applied to any other embodiment of this application as needed.
Same as the embodiment shown in
Different from the embodiment shown in
In this embodiment, the coupling slot is formed in the structural unit 82, so that different parts of the structural unit 82 are sequentially assembled on the conductive substrate 81, and finally assembled into a complete structural unit 82. In this way, reliable assembly of the structural unit 82 can be implemented in some scenarios. Especially when a size of the conductive substrate 81 is large and a quantity of structural units 82 is large, an assembly process can be simplified in a split assembly manner, and an assembly yield is improved. Because a quantity of components of the structural unit 82 is small, an assembly process may be simplified to some extent. In addition, the coupling slot can allow electromagnetic waves of some frequency bands to pass through, so that the antenna conductive component 8 has a function of expanding a stealth bandwidth to some extent.
It may be understood that a coupling slot design in this embodiment may be applied to any other embodiment of this application as needed, including embodiments to be described below.
Same as the embodiment shown in
Different from the embodiment shown in
In this embodiment, the hollow region is formed on the structural unit 92. This can reduce a weight and help reduce a weight of the antenna conductive component 9. Especially when the structural unit 92 is a heavy metal member, providing the hollow region can greatly reduce the weight. In addition, when an electromagnetic wave is propagated to a place near the antenna conductive component 9, an electromagnetic field is mainly distributed at the first capacitor, and an electromagnetic field in a remaining region is very weak. Therefore, providing the hollow region basically does not affect a propagation characteristic of the electromagnetic wave.
It may be understood that a hollow-out design in this embodiment may be applied to any other embodiment of this application, including embodiments to be described below.
Same as the foregoing embodiments, in an embodiment shown in
Different from the foregoing embodiments, the first capacitor 102a in
As shown in
According to the foregoing capacitance formula C=εS/d (ε is a dielectric constant of a medium between plates, S is a plate area, and d is a distance between the plates), for each region of the first capacitor 102a, when S and d are consistent, because a dielectric constant of the first insulation medium 103a in the first part is large, a capacitance value of the first part is large. Because a dielectric constant of the second insulation medium 103b in the second part is small, a capacitance value of the first part is small. A capacitance value of the third part may be equal to the capacitance value of the first part, and a capacitance value of the fourth part may be equal to the capacitance value of the second part. Therefore, in this embodiment, the first capacitor 102a may have a uniform slot width, and insulation media with different dielectric constants are filled in different regions of the first capacitor 102a, so that capacitance values of the different regions of the first capacitor 102a are different.
The solution in this embodiment enables the conductive substrate 101 to have electromagnetic stealth performance relative to an electromagnetic wave, to avoid or reduce blocking of the conductive substrate 101 on the electromagnetic wave, and further expand a stealth bandwidth. In addition, as shown in
It may be understood that, in this embodiment, a design in which capacitance values of different regions are different is implemented by filling insulation media with different dielectric constants, and may be applied to any other embodiment of this application as needed. For example, a slot size (including a width size, a length size, and the like), a slot pattern (which means that the slot is an entire slot, or is formed by bending and connecting a plurality of sub-slots sequentially shown in
Same as the embodiment shown in
Different from the embodiment shown in
The first capacitor component 204 and the second capacitor component 203 may be fastened in a slot, for example, through welding. A quantity of first capacitor components 204 and a quantity of second capacitor components 203 may be determined based on a requirement. This is not limited in embodiments.
A capacitance value of each region of the first capacitor 202a may be equal to a capacitance value calculated according to the foregoing capacitance formula C=εS/d (ε is a dielectric constant of a medium between plates, S is a plate area, and d is a distance between the plates) plus a capacitance value of the capacitor component in the region. For each region of the first capacitor 202a, when ε, S, and d are consistent, capacitance values calculated according to the capacitance formula C=εS/d are equal. Because the first capacitor component 204 with a large capacitance value is disposed in the first part, the capacitance value of the first part is large; and because the second capacitor component 203 with a small capacitance value is disposed in the second part, the capacitance value of the second part is small. A capacitance value of the third part may be equal to the capacitance value of the first part, and a capacitance value of the fourth part may be equal to the capacitance value of the second part.
Therefore, in this embodiment, the first capacitor 202a has a uniform slot width, and capacitor components with different capacitance values are mounted in different regions of the first capacitor 202a, so that capacitance values of the different regions of the first capacitor 202a are different.
The solution in this embodiment enables the conductive substrate 201 to have electromagnetic stealth performance relative to an electromagnetic wave, to avoid or reduce blocking of the conductive substrate 201 on the electromagnetic wave, and further expand a stealth bandwidth. For example, when the capacitor component is a capacitor component with a variable capacitance, a capacitance of the capacitor component in a corresponding region may be adaptively adjusted based on a change of a scanning angle of a wave source, to adjust a capacitance value of the region, and ensure an electromagnetic stealth effect of the antenna conductive component 20 on the wave source.
Another variant solution can be easily obtained according to the principle of this embodiment. For example, a capacitor component (for example, the first part) may be disposed only in a part of the first capacitor 202a, and no capacitor component is disposed in another region, so that the capacitance values of the different regions of the first capacitor 202a may be different. In addition, a design in which a capacitor component is disposed in a region to affect a capacitance value of the region may be applied to any embodiment of this application based on a requirement. For example, a slot size, a slot pattern, slot distribution, an insulation medium filling status, and the like of the first capacitor may not be limited, and a capacitor component is mounted in the first capacitor. A shape size, a position size, a dielectric constant of an insulation medium, and a capacitance value of the capacitor component are comprehensively configured, so that the capacitance value of the first part is finally greater than the capacitance value of the second part.
In any one of the foregoing embodiments, a capacitor (for example, referred to as a plate capacitor) may be formed between the structural unit and the conductive substrate, and the plate capacitor may affect a frequency band of an electromagnetic wave that bypasses the antenna conductive component. For a product need (for example, a need to reduce a volume), it may be desirable to reduce a spacing between the structural unit and the conductive substrate. However, a decrease in the spacing may cause an increase in the frequency band of the electromagnetic wave that bypasses the antenna conductive component, and change a propagation characteristic of the electromagnetic wave.
In view of this, based on any one of the foregoing embodiments, the antenna conductive component may further include an inductive element. The inductive element may be disposed in the spacing between the structural unit and the conductive substrate, and connected to the structural unit and the conductive substrate, so that the structural unit is electrically connected to the conductive substrate. The inductive element and the foregoing plate capacitor may form a parallel resonant circuit, and the parallel resonant circuit can reduce the frequency band of the electromagnetic wave that bypasses the antenna conductive component. Therefore, disposing the inductive element and reducing the spacing between the structural unit and the conductive substrate may counteract each other's impact on the frequency band, so that the frequency band of the electromagnetic wave that bypasses the antenna conductive component remains unchanged, to maintain the propagation characteristic of the electromagnetic wave.
In this embodiment, the inductive element may be a conductor mechanical part, for example, a metal column. The inductive element may be equivalent to an inductor, and the inductive element facilitates mechanical processing of the antenna conductive component. Alternatively, the inductive element may be directly an inductor.
In this embodiment, a position of the inductive element may be designed based on a requirement, for example, to be at a specific distance from the first capacitor, to avoid being too close. A quantity of inductive elements may be designed based on a requirement. For example, each structural unit may be connected to the conductive substrate through at least one inductive element, or only some structural units are connected to the conductive substrate through the inductive element.
In the foregoing embodiment, the capacitance values of the different regions of the first capacitor in the antenna conductive component are different. In the following embodiment, different from the foregoing embodiment, the capacitance values of the different regions of the first capacitor may be the same. It may be understood that the electromagnetic stealth design can also be implemented when the capacitance values of the different regions of the first capacitor are the same. The following lists several solutions in which the capacitance values of the different regions of the first capacitor are the same.
For example, in embodiments shown in
The first capacitor 402a in this embodiment can also change a propagation direction of an electromagnetic wave emitted from a wave source, and constrain the electromagnetic wave to be propagated in the first capacitor 402a, so that the electromagnetic wave can be propagated around the antenna conductive component 40. Therefore, even though the antenna conductive component 40 blocks the wave source, because of the existence of the first capacitor 402a, the electromagnetic wave can bypass the antenna conductive component 40 and be propagated to a back side of the antenna conductive component 40, so that an electromagnetic shadow is reduced or eliminated.
For example, in an embodiment shown in
In the embodiment shown in
According to the embodiment shown in
For example, in an embodiment shown in
In the embodiment shown in
According to the embodiment shown in
Alternatively, an embodiment in which capacitance values of different regions of the first capacitor are the same may be obtained based on embodiments shown in
For example, in an embodiment, the same as the embodiment shown in
For example, in another embodiment, the first part 62b shown in
For example, in another embodiment, different from the embodiment shown in
For example, in another embodiment, different from the embodiment shown in
For example, in another embodiment, different from the embodiment shown in
The foregoing uses the base station antenna 2 shown in
The foregoing describes embodiments of this application in detail. Specific examples are used in this specification to describe the principle and embodiments of this application. The descriptions of the foregoing embodiments are merely intended to help understand the method and the core idea of this application. In addition, a person of ordinary skill in the art may make modifications to the specific embodiments and an application range according to the idea of this application. Therefore, the content of this specification shall not be construed as a limitation to this application.
| Number | Date | Country | Kind |
|---|---|---|---|
| 202211097482.8 | Sep 2022 | CN | national |
This application is a continuation of International Application No. PCT/CN2023/117447, filed on Sep. 7, 2023, which claims priority to Chinese Patent Application No. 202211097482.8, filed on Sep. 8, 2022. The disclosures of the aforementioned applications are hereby incorporated by reference in their entireties.
| Number | Date | Country | |
|---|---|---|---|
| Parent | PCT/CN2023/117447 | Sep 2023 | WO |
| Child | 19073318 | US |
