The present disclosure generally relates to a technical field of communication industry, more particular to a base station used therein.
Typically, antenna elements and a radome used in a base station are separate from each other. The radome is only used to protect the antenna elements, for example covering or enclosing the antenna elements. Since it is desirable that the radome would not introduce any interference to radiation of the antenna elements, the radome is required to be relatively high, i.e., there is a large space between the radome and the antenna elements. These two separate components, i.e., the antenna elements and the radome cause the base station to be high or thick.
Further, in a lot of base stations (for example radio base stations), radio components and antenna elements are installed together. Especially, it can be seen from 5G network rollout that most of massive MIMO product (AAS, advanced antenna system) has the antenna elements and the radio components mounted together.
In typical designs, one side of a radio PCB board has to be used for antenna radiation. There are a lot of gaps between the radio PCB board and a radio cover, between the antenna elements, between an antenna radome and an antenna PCB board, which are filled with air. The presence of the air is not beneficial to heat dissipation. Even the radio PCB board is of very high heat conductivity; it is still very difficult to efficiently dissipate heat from the side where the antenna elements are located.
That is, in the case that the radio PCB board and the antenna elements are not installed together, the radio components can be cooled at double sides, but when the radio components are mounted with the antenna elements, they only can be cooled from one side. It is impossible to cool them from the other side due to the limitation from the antenna elements and the radome.
In view of the foregoing, an object of the present disclosure is to overcome or at least mitigate at least one of above shortcomings in the prior art solution. Herein, the present disclosure provides a new type of the base station.
In accordance with one aspect of the present application, it provides a base station, comprising:
In some embodiments, at least one of the at least one antenna element is a dual functional radiator which is not only an electromagnetic radiator but also a heat radiator.
In some embodiments, each of the at least one antenna element comprises a primary radiator, a secondary radiator and a dielectric material provided between them.
In some embodiments, a conducting pole is provided to connect the primary radiator and the secondary radiator.
In some embodiments, the secondary radiator is located close to a top surface of the multi-function block which is not protruded outside the multi-function block; or the secondary radiator is located onto a top surface of the multi-function block and partially protruded outside the multi-function block.
In some embodiments, the primary radiator is provided onto and in contact with a surface of the PCB board adjacent to the multi-function block.
In some embodiments, the at least one antenna element comprises a plurality of antenna elements separated from each other, and shielding walls are provided between adjacent antenna elements of the plurality of antenna elements.
In some embodiments, at least a part of the shielding walls are lateral walls or longitudinal walls.
In some embodiments, the shielding walls are connected with each other and constitute a shielding net which is configured to divide a body of the multi-function block into a plurality of regions, and each of the regions is provided with one antenna element.
In some embodiments, a heat conducting sheet is provided at a crossing point of the shielding net.
In some embodiments, a top side of the shielding net is provided close to or onto a top surface of the multi-function block and a bottom side of the shielding net is in contact with the PCB board.
In some embodiments, the PCB board is further provided with radio components on a surface of the PCB board far away from the multi-function block.
In some embodiments, the PCB board comprises an antenna layer and a radio layer stacked together, and the at least one antenna element and the radio components are respectively disposed on the antenna layer and the radio layer.
In some embodiments, a grounding plane for heat transferring and shielding is provided between the antenna layer and the radio layer.
In some embodiments, the base station further comprises a heatsink configured to support the PCB board and fix with the multi-function block by a buckle joint, an adhesive agent or a screw.
In some embodiments, the multi-function block is provided with at least one protrusion, and the heatsink is provided with at least one recess, wherein the at least one protrusion is matched with the at least one recess.
In some embodiments, the multi-function block is made of a material having a thermal conductivity which is larger than or equal to 1 W/m·K, and the at least one antenna element is made of metal.
In some embodiments, the shielding walls are made of metal.
In some embodiments, the multi-function block comprises a plurality of multi-function sub-blocks located between the shielding walls.
In some embodiments, the multi-function sub-blocks are inserted into the shielding walls.
These aspects and/or other aspects as well as advantages of the present application will become obvious and readily understood from the description of the preferred embodiments of the present application in conjunction with the accompanying drawings below, in which
In the discussion that follows, specific details of particular embodiments of the present techniques are set forth for purposes of explanation and not limitation. It will be appreciated by those skilled in the art that other embodiments may be employed apart from these specific details.
Furthermore, in some instances detailed descriptions of well-known methods, structures, and devices are omitted so as not to obscure the description with unnecessary detail.
Embodiments of the present disclosure provide base stations used in the communication industry. Structures and locations of antenna elements, a PCB board and a multi-function block used by the base station and the like are discussed herein and they are improved to transfer heat to the outside efficiently.
As shown in
The multi-function block 20 is located onto the PCB board 10 and used to cover the PCB board 10. In one embodiment, the multi-function block 20 is attached onto the PCB board 10 at its bottom surface. Alternatively, some portions of the multi-function block 20 might not be contacted with the PCB board 10, that is, they are not attached entirely.
It should be understood that the multi-function block 20 acts a role as a traditional radome for waterproof and other environment protection (for example providing features for adapting to a windward side design). Further, it can at least help to transfer heat to the outside environment, since the multi-function block 20 is in contact with the PCB board 10 without too much gap or any gap therebetween, and thus this arrangement can facilitate heat transfer by using the multi-function block 20. It can also be used to support the at least one antenna element 30 and help to reduce the thickness of the base station 100. In addition, the multi-function block 20 can be made of materials having a high thermal conductivity and transparent to electromagnetic wave.
In one embodiment, the multi-function block 20 is made of a high thermally conductive plastic materials such as ER008202(DTK22+FR), which is normal plastics with addition materials like ceramic fibers, graphite, boron and so on. It is preferable to use the material having a thermal conductivity larger than or equal to 1 W/m·K. Alternatively, it is easy for the person skilled in the art to use other materials having the similar property to make the multi-function block 20. The present disclosure does not make any limitation on the material of the multi-function block 20.
It should be noted that the multi-function block 20 is used to cover the PCB board 10, but the present invention is not intended to limit a size of the multi-function block 20 with respect to the PCB board 10. The person skilled in the art can select the size of the multi-function block 20 to be larger than, equal to or smaller than that of the PCB board 10. For example, when the base station 100 is designed to be used indoor, the multi-function block 20 might be smaller than the PCB board 10, that is, only some part of the PCB board 10 having important components is needed to be protected by the multi-function block 20.
The at least one antenna element 30 is at least partially embedded inside the multi-function block 20 and attached onto the PCB board 10. It means that the at least one antenna element 30 can be entirely embedded inside the multi-function block 20 without any part protruding outside it, so as to be protected better by the multi-function block 20. Alternatively, the at least one antenna element 30 can also be partially embedded inside the multi-function block 20, that is, a part of the at least one antenna element 30 protrudes outside it, when the protruding part of the antenna element 30 is made of some materials which enables it to be protected by itself without needing the radome or the multi-function block 20. To some degree, this might be beneficial for transferring the heat from the PCB board 10 to the outside environment via the at least one antenna element 30 and/or the multi-function block 20.
Normally, the at least one antenna element 30 includes a plurality of antenna elements separated from each other, for example 4, 8, 16 or more antenna elements. The number of the antenna elements can be chosen according to actual requirements. For sake of convenience, only 4 antenna elements or the similar are shown, but other number of the antenna elements is possible.
As shown in
It shows that all the antenna elements 30 are entirely embedded within the multi-function block 20. Each antenna element 30 includes a primary radiator 31, a secondary radiator 32 and a dielectric material 33 provided between them. It should be known that the primary radiator 31 and the secondary radiator 32 can be produced with the known methods and structures, so they are not repeatedly discussed herein. However, since the materials of the multi-function block 20 can be plastic, so the material of the dielectric material 33 can be identical with it. Of course, the material of the dielectric material 33 can be different from that of the multi-function block 20.
In an embodiment, a conducting pole 34 is located between the primary radiator 31 and the secondary radiator 32. The conducting pole 34 is used to connect the primary radiator 31 and the secondary radiator 32 within the same antenna element 30. The conducting pole 34 is made of any suitable metal material like copper, gold or the like, and alternatively is made of other materials with a high thermal conductivity. The primary radiator 31 is the main radiator of the antenna element 30, which is fed by the PCB board 10. In other words, the conducting pole 34 can also facilitate the heat transfer from the PCB board 10 to the outside environment.
With the provision of the conducting pole 34, the secondary radiator 32 and the primary radiator 31 can be considered to be one radiator when only a DC current is passing through. When AC current is passing through, they can function as the main radiator and the parasitic radiator respectively.
Furthermore, the conducting pole 34 can also help dissipate heat to the outside through the antenna elements, since the primary radiator 31, the secondary radiator 32 and the conducting pole 34 are all made of materials having a high thermal conductivity.
It can be seen from
Alternatively, the secondary radiator 32 can be located onto the top surface 21 of the multi-function block 20. A part of the secondary radiator is protruded outside the multi-function block 20 and the remaining of the secondary radiator 32 is kept within the multi-function block 20. In other words, when the secondary radiator 32 is made of the materials having the waterproof protection or other environment protections, they can be disposed to protrude outside the multi-function block 20. In this way, the heat can be dissipated very efficiently and the size or height of the base station 100 can be optimized.
Further, shielding walls 40 are provided and located between adjacent antenna elements 30. The shielding walls 40 are used to improve isolation between different antenna elements 30. The present disclosure does not have any specific limitation on the location, the size, the shape and the materials of the shielding walls 40.
A top side of the shielding net 41 is provided close to or onto the top surface 21 of the multi-function block 20 and a bottom side of the shielding net 41 is in contact with the PCB board 10 at the bottom surface 22. The shielding net 41 is also helpful to dissipate heat.
As shown in
In the present invention, the multi-function block 20 and the secondary radiators 32 and the primary radiators 31 are integrated into the volume which should be occupied by the antenna radiators. In this way, the multi-function block 10 would not occupy additional space and reduce the height of the base station 100.
As shown in
As shown in
With reference to
In combination with
Both of them can be in a round, square, a pentagon shape or any suitable shape. The secondary radiators 32 can be made of any metal or PCB based or printed conducting ink or other conductive materials. The primary radiators 31 can be made of the same materials as that of the secondary radiators 32 or a different material from that of the secondary radiators 32. Alternatively, it is optimal to select some materials having a high thermal conductivity and transparent to the electromagnetic wave for making the primary radiators 31 and the secondary radiators 32. The size and shape of them are typically determined by the RF performance, such as S-parameter and radiation patterns.
As shown in
It also shows that the PCB board 10 is provided with radio components 60 on a bottom surface 12 of the PCB board 10 far away from the multi-function block 20.
In order to be assembled together, the multi-function block 20 is provided with at least one protrusion 25 and the heatsink 50 is provided with at least one recess 52. As shown, two protrusions 25 are respectively provided at two ends of the multi-function block 20. Accordingly, two recesses 52 are respectively provided at two ends of the heatsink 50. The two protrusions 25 are matched with the two recesses 52.
In an example, a glue 51 is placed in the recess 52 first and then the protrusion 25 is inserted into the corresponding recess 52, so that they are fixed by the glue 51. Other fixing methods are similar in principle so that they are not discussed again.
As can be seen from
Further, in
The present disclosure is described above with reference to the embodiments thereof. However, those embodiments are provided just for illustrative purpose, rather than limiting the present disclosure. The scope of the disclosure is defined by the attached claims as well as equivalents thereof. Those skilled in the art can make various alternations and modifications without departing from the scope of the disclosure, which all fall into the scope of the disclosure.
Filing Document | Filing Date | Country | Kind |
---|---|---|---|
PCT/CN2020/115234 | 9/15/2020 | WO |