Claims
- 1. A bend sensor comprising a flexible polyester substrate coated with an electrically conductive composition comprising
- a) a polymeric binder system comprising phenolic resin that dries and/or cures to a brittle coating which cracks when bent around a mandrel;
- b) an amount of discontinuous conductive carbon black ranging from about 3 to 20 wt. percent based on the weight of the binder effective to produce a desired electrical resistance in the composition;
- c) graphite particles in an amount effective to stabilize the resistance profile of the composition after cracking on a mandrel and less than the amount that produces a composition having a resistance ratio (bent/straight) equal to 1:1, and
- d) a thermoplastic additive to improve adhesion of the composition to said polyester substrate, said additive comprising thermoplastic resin, surfactant and organic solvent therefor;
- and provided with at least two means for attachment to an electrical circuit which means are conductively connected by a length of said composition.
- 2. A bend sensor according to claim 1 wherein the sensor generates real time changes in electrical resistance in response to flexing.
- 3. A bend sensor according to claim 1 wherein the total resistance of the sensor in the unflexed position is approximately 100K.OMEGA..
- 4. A bend sensor according to claim 1 wherein the resistance ratio is greater than about 2:1 and less than 10:1.
- 5. A bend sensor according to claim 1 wherein the thermoplastic additive (d) contains acrylic resin, vinyl resin and polyurethane.
Parent Case Info
This application is a division of application Ser. No. 07/518,343, filed May 3, 1990, now U.S. Pat. No. 5,250,227.
US Referenced Citations (10)
Foreign Referenced Citations (1)
Number |
Date |
Country |
0143660 |
Jun 1985 |
EPX |
Non-Patent Literature Citations (2)
Entry |
McGraw Hill Dictionary of Chemical Terms, Sybil P. Parker, Ed., McGraw Hill, p. 339. |
Encyclopedia of Chemistry, Considine ed. Van Nostrand Reinhold Co., 1984. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
518343 |
May 1990 |
|