Fluid-based switches such as liquid metal micro switches (LIMMS) have proved to be valuable in environments where fast, clean switching is desired.
One aspect of the invention is embodied in a switch comprising first and second mated substrates defining therebetween first and second intersecting channels of a bent switching fluid cavity. A switching fluid is held within the bent switching fluid cavity and is movable between first and second switch states in response to forces that are applied to the switching fluid. More of the switching fluid is forced into the first of the intersecting channels in the first switch state, and more of the switching fluid is forced into the second of the intersecting channels in the second switch state.
Other embodiments of the invention are also disclosed.
Illustrative embodiments of the invention are illustrated in the drawings, in which:
In each of the switches 100, 800, first and second mated substrates 100/102, 800/802 define therebetween first and second intersecting channels 134/136, 812/814 of a bent switching fluid cavity 304, 816 (see
The bent switching fluid cavities 304, 816 provide a variety of advantages over straight switching fluid cavities, such as the one disclosed in U.S. patent application Ser. No. 10/137,691 of Marvin Glenn Wong filed May 2, 2002 and entitled “A Piezoelectrically Actuated Liquid Metal Switch” (which is hereby incorporated by reference). For example, a bent switching fluid cavity can provide better mechanical shock resistance for a fluid-based switch. This advantage can best be understood by referring to
Another potential advantage of a bent switching fluid cavity 304 is that it may be electrically advantageous to use such a bent-shaped cavity 304. For example, a bent switching fluid cavity 304 may allow sharp turns in a switch's electrical paths to be eased by enabling “flattening” of the transitions where planar signal conductors 112, 114, 116 contact a switching fluid 312.
The embodiment of a fluid-based switch 100 shown in
The channel plate 102 and substrate 104 may be sealed to one another by means of an adhesive, gasket, screws (providing a compressive force), and/or other means. One suitable adhesive is Cytop™ (manufactured by Asahi Glass Co., Ltd. of Tokyo, Japan). Cytop™ comes with two different adhesion promoter packages, depending on the application. When a channel plate 102 has an inorganic composition, Cytop™'s inorganic adhesion promoters should be used. Similarly, when a channel plate 102 has an organic composition, Cytop™'s organic adhesion promoters should be used.
As shown in
As shown in
Use of the planar signal conductors 112-116 for signal propagation eliminates the routing of signals through vias, and thus eliminates up to four right angles that a signal would formerly have had to traverse (i.e., a first right angle where a switch input via 120 is coupled to a substrate, perhaps at a solder ball or other surface contact; a second right angle where the switch input via 120 is coupled to internal switch circuitry 114; a third right angle where the internal switch circuitry 116 is coupled to a switch output via 122; and a fourth right angle where the switch output via 122 is coupled to the substrate). Elimination of these right angles eliminates a cause of unwanted signal reflection, and reductions in unwanted signal reflection tend to result in signals propagating more quickly through the affected signal paths.
Realizing that not all environments may be conducive to edge coupling of the switch 100, the switch 100 may also be provided with a plurality of conductive vias 118, 120, 122 for electrically coupling the planar signal conductors 112-116 to a plurality of surface contacts such as solder balls (see solder balls 208, 210, 212, 214 in
To further increase the speed at which signals may propagate through the switch 100, a number of planar ground conductors 124, 126, 128 may be formed adjacent either side of each planar signal conductor 112-116 (FIGS. 1 & 6). The planar signal and ground conductors 112-116, 124-128 form a planar coaxial structure for signal routing, and 1) provide better impedance matching, and 2) reduce signal induction at higher frequencies.
As shown in
Similarly to the planar signal conductors 112-116, the planar ground conductors 124-128 may extend to the edges of the switch 100 (but need not) so that they may be coupled to a printed circuit board or other substrate via wirebonds. However, again realizing that not all environments may be conducive to edge coupling of the switch 100, the ground conductors 124-128 may also be coupled to a number of conductive vias 608 that couple the ground conductors 124-128 to a number of surface contacts of the switch 100.
In the above description, it was disclosed that switching fluid 312 could be moved from one state to another by forces applied to it by an actuating fluid 314, 316 held in cavities 300, 308. However, it has yet to be disclosed how the actuating fluid 314, 316 is caused to exert a force (or forces) on switching fluid 312. One way to cause an actuating fluid (e.g., actuating fluid 314) to exert a force is to heat the actuating fluid 314 by means of a heater resistor 500 that is exposed within the cavity 300 that holds the actuating fluid 314. As the actuating fluid 314 is heated, it tends to expand, thereby exerting a force against switching fluid 312. In a similar fashion, actuating fluid 316 can be heated by means of a heater resistor 502. Thus, by alternately heating actuating fluid 314 or actuating fluid 316, alternate forces can be applied to the switching fluid 312, causing it to assume one of two different switching states. Additional details on how to actuate a fluid-based switch by means of heater resistors are described in U.S. Pat. No. 6,323,447 of Kondoh et al. entitled “Electrical Contact Breaker Switch, Integrated Electrical Contact Breaker Switch, and Electrical Contact Switching Method”, which is hereby incorporated by reference.
Another way to cause an actuating fluid 314 to exert a force is to decrease the size of the cavities 300, 302 that hold the actuating fluid 314.
Although the above referenced patent and patent application disclose the movement of a switching fluid by means of dual push/pull actuating fluid cavities, a single push/pull actuating fluid cavity might suffice if significant enough push/pull pressure changes could be imparted to a switching fluid from such a cavity.
To enable faster cycling of the afore-mentioned heater resistors 500, 502 or piezoelectric elements 700-706, each may be coupled between a pair of planar conductors 130/126, 132/128 that extend to a switch's edges. As shown in
An advantage provided by the bent switching fluid cavity 304 is that signals propagating into and out of the switching fluid 312 held therein need not take right angle turns, and thus unwanted signal reflections can be reduced. That is, the tightest angle at which any of the planar signal conductors 112-116 intersects the bent switching fluid cavity 304 may be confined to an angle of greater than 90° (and preferably an angle that is equal to or greater than 135°, or an angle that is about 135°). Thus, in an ideal connection environment, the switch 100 illustrated in
To make it easier to couple signal routes to the switch 100, it may be desirable to group signal inputs on one side of the switch, and group signal outputs on another side of the switch. If this is done, it is preferable to limit the tightest corner taken by a path of any of the planar signal conductors to greater than 90°, or more preferably to about 135°, and even more preferably to equal to or greater than 135° (i.e., to reduce the number of signal reflections at conductor corners).
It should be noted that the conductive vias 118-122, 608-612 shown in
If the switch 100 is electrically coupled to a substrate via surface contacts (e.g., solder balls 208-214), the planar conductors 112-116, 124-132 need not extend to the edges of the switch 100. However, the switch 100 can still benefit from signal paths with acute angle corners and/or a bent switching fluid cavity 304, even though signals will need to propagate into the switch 100 via right angle turns at solder balls 208-214 and conductive vias 118-122, 608-612.
Although the above description has been presented in the context of the switches 100, 800 shown and described herein, application of the inventive concepts is not limited to the fluid-based switches shown herein.
While illustrative and presently preferred embodiments of the invention have been described in detail herein, it is to be understood that the inventive concepts may be otherwise variously embodied and employed, and that the appended claims are intended to be construed to include such variations, except as limited by the prior art.
This application is related to U.S. patent application Ser. No. 10/413,855, of Marvin Glenn Wong, et al., filed on the same date as this application and entitled “Formation of Signal Paths to Increase Maximum Signal-Carrying Frequency of a Fluid-Based Switch” (which is hereby incorporated by reference).
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