The present invention relates to crosslinked polymers with tunable coefficients of thermal expansion and, in particular, to use of benzocyclobutene curatives for low thermal expansion thermosets.
Dibenzocyclooctene (DBCO, also referred to as dibenzocyclooctane) and derivatives thereof have been shown to be useful organic compounds to manipulate the thermal expansion behavior of polymer networks (e.g., cured epoxies). As illustrated in
Recently, the DBCO moiety has been used to prepare di-aniline crosslinkers for use in epoxy/amine thermosets. See Pub. No. US 2021/0387987 A1, which is incorporated herein by reference. Depending on the regioisomer (or positional isomer) of cis-diamino-DBCO utilized as a crosslinker, epoxy thermosets were prepared with near-zero, or in some cases negative, CTE values that feature highly reversible thermal expansion and contraction behavior. However, these DBCO compounds are difficult to access from a synthetic perspective.
The present invention is directed to a method to synthesize a low thermal expansion thermoset, comprising mixing a thermosetting resin and a benzocyclobutene curative having a reactive secondary functionalization; heating the mixture to a first temperature to from a pre-polymer comprising benzocyclobutene end groups and a thermoset linking group; and heating the pre-polymer to a second temperature sufficient for ring-opening of benzocyclobutene to occur, thereby forming a thermoset polymer network crosslinked with dibenzocyclooctene moieties. For example, the thermosetting resin can comprise an epoxy, acrylate, methacrylate, polyester, vinyl ester, polyamide, polyimide, or urethane. For example, the reactive secondary functionalization can comprise aniline, amine, carboxylic acid, alcohol, isocyanate, anhydride, epoxide, acyl chloride, or carbonyl.
The detailed description will refer to the following drawings, wherein like elements are referred to by like numbers.
According to the present invention, benzocyclobutene (BCB) monomers and prepolymers can be used as a curative to prepare low CTE thermosets. BCBs undergo thermal dimerization to form benzocyclooctene (BCO) units and can be synthesized in a few steps from commercially-available precursors. As a result, BCB chemistry can be used as a handle to tune curing temperature and material properties (e.g., CTE, thermal stability, thermal transitions, etc.).
As shown in
BCBs are often employed as crosslinking moieties, installed pendant to the polymer backbone or at the polymer chain ends. Upon heating such BCB-functionalized precursors, polymer networks are formed that are typically characterized by low dielectric constants and excellent thermal stability. See R. A. Kirchhoff et al., J. Macromol. Sci. A Chem. 28(11-12), 1079 (1991); and R. A. Kirchhoff and K. J. Bruza, Prog. Polym. Sci. 18(1), 85 (1993). BCB-based polymer networks have been noted to possess low CTE values (ca. <40 ppm/K), but have not been used explicitly for the purpose of creating low CTE materials. See Y. Cheng et al., ACS Appl. Polym. Mater. 1(10), 2622 (2019); Q. Xianfeng et al., High Perf. Polym. 31, 1062 (2019); and R. A. Kirchhoff et al., J. Macromol. Sci. A Chem. 28(11-12), 1079 (1991).
As shown in
The present invention is directed to the use of BCB and derivatives thereof as curatives to prepare low CTE polymer networks. As shown in
Step 1, carried out at a first temperature, T1 (T1<T2), involves formation of a pre-polymer comprising BCB end groups and an epoxy linking group via reaction of a secondary functionality on the BCB, such as the 2-aniline-functionalized BCB curative described above, with an epoxy resin, such as EPON 828. For example, T1 can be about 60° C.
Step 2, carried out at a second temperature, T2, involves heating of the pre-polymer to a sufficient temperature for BCB ring-opening to occur, thereby forming an epoxy network crosslinked with DCBO moieties with cis aniline substitutions. For example, T2 can be about 180° C.
Other pre-polymer chemistries are possible. In general, the resin can comprise any thermosetting resin, including but not limited to epoxy resins, acrylates, methacrylates, polyesters, vinyl esters, polyam ides, polyim ides, and urethanes, and other crosslinked polymer systems to provide a tunable coefficient of thermal expansion. As shown in
In a generalized two-step process, a thermosetting resin can be reacted with a BCB curative at a temperature T1 to form a pre-polymer with a thermoset linking group X and BCB end groups, as shown in
The present invention has been described as the use of benzocyclobutene and derivatives thereof as a curative for low thermal expansion thermosets. It will be understood that the above description is merely illustrative of the applications of the principles of the present invention, the scope of which is to be determined by the claims viewed in light of the specification. Other variants and modifications of the invention will be apparent to those of skill in the art.
This application claims the benefit of U.S. Provisional Application No. 63/300,769, filed Jan. 19, 2022, which is incorporated herein by reference.
This invention was made with Government support under Contract No. DE-NA0003525 awarded by the United States Department of Energy/National Nuclear Security Administration. The Government has certain rights in the invention.
Number | Date | Country | |
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63300769 | Jan 2022 | US |