Claims
- 1. An improvement in yeast leavened, flour based dough providing bromate free dough having baking properties substantially equivalent to that provided by the use in conventional yeast leavened flour based dough of bromate improver compositions comprising the substitution for a conventional bromate improver composition, in an otherwise conventional yeast leavened, flour based dough, of a peroxy-oxidant improver composition consisting of a peroxy compound selected from the group consisting of benzoyl peroxide, hydrogen peroxide and mixtures thereof; and an oxidant selected from the group consisting of azodicarbonamide and mixtures of azodicarbonamide and ascorbic acid, wherein said azodicarbonamide may be unencapsulated or encapsulated with an encapsulant selected from the group consisting of wheat proteins, wheat flour, corn gluten, hydrocolloid gums, fats and fat derived materials having a melting point from about 40.degree. to about 68.degree. C. and mixtures thereof, and wherein said peroxy-oxidant improver composition is present at a concentration providing at least 20 ppm peroxy compound based on flour weight to said dough.
- 2. An improvement in yeast leavened, flour based dough as defined in claim 1 wherein the peroxy compound is benzoyl peroxide.
- 3. An improvement in yeast leavened, flour based dough as defined in claim 1 wherein the oxidant is azodicarbonamide encapsulated or unencapsulated.
- 4. An improvement in yeast leavened, flour based dough as defined in claim 2 wherein the oxidant is azodicarbonamide encapsulated or unencapsulated.
- 5. An improvement in yeast leavened, flour based dough as defined in claim 1 wherein the oxidant is a mixture of azodicarbonamide encapsulated or unencapsulated and ascorbic acid.
- 6. An improvement in yeast leavened, flour based dough as defined in claim 2 wherein the oxidant is a mixture of azodicarbonamide encapsulated or unencapsulated and scorbic acid.
- 7. A improvement in yeast leavened, flour based dough providing bromate free dough having baking properties substantially equivalent to that provided by the use in said dough of bromate improver compositions, comprising the substitution for a conventional bromate improver, in an otherwise conventional yeast leavened, flour based dough, of a peroxy-oxidant improver composition consisting of peroxy/compound selected from the group consisting of benzoyl peroxide, hydrogen peroxide admixtures thereof; and an oxidant selected from the group consisting of azodicarbonamide and mixture of azodicarbonamide and ascorbic acid, wherein said azodicarbonamide may be unencapsulated or encapsulated with an encapsulant selected from the group consisting of wheat proteins, wheat flour, corn gluten, hydrocolloid gums, fats and fat derived materials having a melting point from about 40.degree. to about 68.degree. C. and mixtures thereof and wherein said peroxy-oxidant improver composition is present at a concentration providing at least 20 ppm peroxy compound based on flour weight to said dough and a mixture of fungal enzymes.
- 8. An improvement in yeast leavened, flour based dough as defined in claim 7 wherein the fungal enzymes comprise fungal alpha amylase.
- 9. An improvement in yeast leavened, flour based dough as defined in claim 8 wherein the peroxy compound is benzoyl peroxide.
- 10. An improvement in yeast leavened, flour based dough as defined in claim 9 wherein the oxidant is encapsulated azodicarbonamide.
- 11. An improvement in yeast leavened, flour based dough as defined in claim 9 wherein the oxidant is a mixture of encapsulated azodicarbonamide and ascorbic acid.
- 12. A process for preparing a bromate free, yeast leavened, flour based dough having baking properties substantially similar to an otherwise comparable conventional yeast leavened, flour based dough improved with a bromate improver which comprises adding a peroxy-oxidant improver composition consisting of a peroxy compound selected from the group consisting of benzoyl peroxide, hydrogen peroxide and mixtures thereof; and an oxidant selected from the group consisting of azodicarbonamide and mixtures of azodicarbonamide and ascorbic acid, wherein said azodicarbonamide may be unencapsulated or encapsulated with an encapsulant selected from the group consisting of wheat proteins, wheat flour, corn gluten, hydrocolloid gums, fats and fat derived materials having a melting point from about 40.degree. to about 68.degree. C. and mixtures thereof, and wherein said peroxy-oxidant improver composition is present at a concentration providing at least 20 ppm peroxy compound based on flour weight to an unimproved otherwise conventional yeast leavened flour based dough.
- 13. A process as defined in claim 12 wherein food grade fungal enzymes are added to the dough in addition to the peroxy-oxidant improver composition.
CROSS REFERENCE TO PRIOR APPLICATIONS
This application is a continuation-in-part of application Ser. No. 07/798,373 filed Nov. 26, 1991 now abandoned.
US Referenced Citations (6)
Continuation in Parts (1)
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Number |
Date |
Country |
Parent |
798373 |
Nov 1991 |
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