The present disclosure relates to voltage regulation and in particular to voltage reference circuitry having enhanced characteristics to variations in a beta parameter of the circuitry.
Unless otherwise indicated herein, the disclosure set forth in this section should not be construed as prior art to the claims in this application nor as admitted to be prior art by inclusion in this section.
Voltage reference sources are commonly used in integrated circuits. A bandgap voltage reference is a commonly used circuit block in analog designs which can provide a temperature independent and supply independent voltage reference. The voltage reference VREF in a bandgap circuit arises from two voltage components: VBE and VPTAT. The voltage VPTAT is a voltage that is proportional to the absolute temperature (proportional to absolute temperature). Circuits for generating VPTAT are known. The VPTAT voltage has a positive temperature coefficient (VPTAT increases with temperature), while VBE has a negative temperature coefficient (VBE decreases with temperature). Consequently, the resulting bandgap voltage VREF can be made insensitive to variations in temperature when VBE and VPTAT are properly combined.
A typical configuration of a circuit that provides VBE is shown in
where η is a technology dependent parameter,
is commonly referred to as the thermal voltage, IC is collector current, and IS is saturation current.
The collector current IC is given by the relationship:
where I is an emitter current of the transistor Q, which in this circuit is provided by the current source 602. The parameter β is referred to as the common-emitter current gain, and is heavily process dependent. During semiconductor processing, the process conditions for fabricating a given lot of wafers typically are not identical to the process conditions for a subsequent lot of wafers. In fact, wafers in the same wafer boat will vary. Consequently, the β parameters for devices will vary from wafer to wafer. Variations up to ±30% in the value of β for devices on different wafers are not uncommon.
For process technologies where β>>1 and for a given constant emitter current I from the current source 602 in a specific design, the collector current IC will remain approximately equal to emitter current I despite variations in β because the
term is small for large β's. However, for submicron processes (especially “deep” submicron processes such as 65 nM CMOS technology), β is small and may be on the order of β=1 or so. Consequently, devices from different wafers or different wafer lots may exhibit widely varying collector current IC characteristics due to its sensitivity to variations in β. Since VBE is a function of IC, bandgap voltage reference circuits based on a submicron process may exhibit wide variations in their respective VREF's.
A common VBE circuit that addresses the small β problem is the series cascade design shown in
Since the β term in Eqn. 3 is squared, variations in β will have only a secondary effect on the collector current IC1 and so the sensitivity of IC1 to process variations is reduced; in other words, IC1≈I. This in turn results in bandgap voltage reference circuits whose voltage references VREF are less sensitive to process variation.
It will be appreciated that the circuit of
Disclosed embodiments of the present invention provide bandgap voltage reference circuits having enhanced β characteristics. In an embodiment, a beta enhancement circuit for a voltage reference comprises a current source connected in series with a transistor between first and second voltage supply terminals. A resistor device is connected between the control terminal of the transistor and the second voltage supply terminal. The first voltage supply terminal may be connected to a voltage source and the second voltage supply terminal connected to ground potential. A resistance value of the resistor device is determined based on one or more process dependent parameters of the transistor.
In an embodiment, a beta enhancement circuit comprises a two stage configuration of transistor circuits. In a first stage, a first current source and a first transistor are connected in series fashion between a voltage supply terminal and a ground potential terminal. A resistor device is connected between a control terminal of the first transistor and the ground potential terminal. A resistance value of the resistor device is determined based on one or more process dependent parameters of the first transistor. In a second stage, a second current source and a second transistor are connected in series fashion between the voltage supply terminal and the ground potential terminal. The second transistor is further connected in cascade fashion to the first transistor.
A third stage may be added, comprising a third current source and a third transistor device connected in series between the voltage supply terminal and the ground potential terminal. The third transistor is further connected in cascade fashion to the second transistor.
The following detailed description and accompanying drawings provide a more detailed understanding of the nature and advantages of the disclosed embodiments.
In the following description, for purposes of explanation, numerous examples and specific details are set forth in order to provide a thorough understanding of aspects and features of the present invention. It will be evident, however, to one skilled in the art that the present invention as defined by the claims may include some or all of the features in these examples alone or in combination with other features described below, and may further include modifications and equivalents of the features and concepts described herein.
The VBE circuit 200 includes a current source 202 connected to a first voltage supply terminal 212. The first voltage supply terminal 212 may be configured for connection to provide a first voltage potential. For example,
In an embodiment, the transistor Q is a vertical bipolar junction transistor (vertical BJT), and in particular is a PNP vertical BJT. An emitter terminal (E) of the transistor Q is connected to the current source 202, while a collector terminal (C) of the transistor is connected to the second voltage supply terminal 214. A resistor device 204 is connected between a base terminal (B) of the transistor Q (referred to herein more generally as the “control terminal”) and the second voltage supply terminal 214.
During operation, an emitter current I, equal to the current from the current source 202, flows to transistor Q. In embodiments, the VBE circuit 200 outputs a compound voltage VBE′ that is the sum of the following voltages which arise in transistor Q: base emitter voltage VBE and a voltage drop VR across resistor device 204. Thus,
VBE′=VBE+VR. Eqn. 4
The voltage drop VR is given by:
where a base current IB in transistor Q is related to the emitter current by
The base emitter voltage VBE, given by Eqn. 1, will now be examined in more detail as follows:
Using the Taylor expansion series, we obtain the following expansion of the natural logarithm in the second term of Eqn. 6c:
Substituting Eqns. 5b, 6c, and 7 into Eqn. 4 and re-arranging terms, we obtain:
The resistance value of resistor device 204 is designated by R. For a given operating current I of the current source 202, it can be seen from Eqn. 8 that by properly choosing a resistance value R for the resistor device 204, it is possible to cancel out the first order term
in the equation to a large degree. The compound voltage VBE′ therefore becomes a function largely of only of the high order terms of β, which are generally much smaller than the first order term and so VBE′ becomes less sensitive to process variations in β. Accordingly, a bandgap voltage reference circuit that employs a VBE circuit in accordance with the present invention will likewise produce a reference voltage that is less sensitive to process variations in β.
In an embodiment, a PTAT current source is used in the beta enhancement circuit shown in
and so the second term in Eqn. 8 becomes
which can be expressed as
Thus, R1 and R2 can be selected to achieve a ratio close to 1 with the effect of substantially canceling out the second term in Eqn. 8 to reduce in large measure first order errors introduced by variations in β.
For example, a circuit simulation may be run to minimize variations in VREF for the range 0.5≦β≦1.5. The following circuit simulation may be set up for the circuit 200 in
For the circuit 200, define:
When x=x01, f1(x,IR) has its extremum defined as:
then the extremum of f1 is:
and the two ports of f1 are:
We deem that the variation of f1 is minimal when
Substituting Eqns. A and B into Eqn. C yields IR≈2.21ηVT. The resulting variation can be computed as the following:
The foregoing described embodiment provides an elegant solution to address the problem encountered with variations in β due to process variations. By the proper placement of a resistor and selection of a resistance value for the resistor, first order errors introduced by variations in β can be reduced in large measure.
The circuit shown in
A resistor device 304 is connected between a control terminal (B) of transistor Q1 and the second voltage supply terminal 314. The first voltage supply terminal 312 may be configured for connection to a power source (e.g., VDD) to provide a first voltage potential. The second voltage supply terminal 314 may be connected to ground potential GND.
A second stage 300b is connected in cascade fashion with the first stage 300a. The second stage 300b includes a second current source 302b connected in series with a second transistor Q2. This series-connected pair in turn is connected between the first and second voltage supply terminals 312, 314. In an embodiment, the series-connected second current source 302b and second transistor Q2 may be connected between different voltage supply terminals, so long as the second current source 302b can source the same amount of current through second transistor Q2 as sourced through first transistor Q1. Continuing with
During operation, the first and second current sources 302a, 302b each source an amount of current I through the emitters of the first and second transistors Q1, Q2 respectively. In embodiments, the same amount of current should be sourced through transistors Q1, Q2. Accordingly, an emitter current through each transistor Q1, Q2 is equal to I. A compound voltage VBE′ of the VBE circuit 300 arises from a base emitter voltage drop VBE developed in the first transistor Q1 and a voltage drop VR developed across the resistor device 304 during operation of the circuit. In embodiments, the first and second current sources 302a, 302b can be separate circuits that each provide a current I. In other embodiments, the first and second current sources 302a, 302b may be outputs from a single circuit that each provide current I.
For the circuit shown in
Using the Taylor expansion series, we obtain the following expansion of the natural logarithm in the second term of Eqn. 9b:
The voltage drop VR across resistor device 304 is given by Eqn. 5a, where the base current IB of the first transistor Q1 in the circuit of
where the emitter current is I. The voltage drop VR is therefore:
Recalling that Eqn. 4 above describes compound voltage VBE′ as:
VBE′=VBE+VR,
we can substitute Eqns. 9b and 10 for VBE and Eqn. 12 for VR to obtain:
As can be seen from Eqn. 13, the resistor value R for resistor device 304 can be selected so that the factor (ηVT−IR) becomes close to zero. The term ηVT can be determined during the circuit design and circuit simulation stage. Parameters for modeling the circuit for circuit simulation may be obtained from process data. Accordingly, if the resistor value R is selected to match ηVT, the second term in essentially drop out of the equation. Though the third term is first order in β, the fourth term is a subtractive term. So for a range of β's, the third and fourth terms may cancel each other out to a certain degree. Thus, the VBE circuit 300 can still provide good compensation for variations in β since the majority of the error can be cancelled out, and so a reduction in variations in the compound voltage VBE′, and ultimately VREF, can be realized.
The first transistor Q1 may be a vertical PNP BJT. In embodiments, the first voltage supply terminal 412 can be configured for connection to a power supply (e.g., VDD) and the second voltage supply terminal 414 can be configured for connection to ground potential GND.
A second stage 400b includes a second current source 402b connected to the first voltage supply terminal 412 and connected to an emitter terminal (E) of a second transistor Q2. The first current source 402a sources a current I1. A collector terminal (C) of the second transistor Q2 is connected to the second voltage supply terminal 414. The second stage 400b is cascaded with the first stage 400a by the connection of a control terminal (B) of the second transistor Q2 to the control terminal (B) of the first transistor Q1. In an embodiment, the second transistor Q2 may be a vertical PNP BJT.
A third stage 400c includes a third current source 402c connected to the first voltage supply terminal 412 and connected to an emitter terminal (E) of a third transistor Q3. In an embodiment, the second and third current sources 402b, 402c source the same current I2. A collector terminal (C) of the third transistor Q3 is connected to the second voltage supply terminal 414. The third stage 400c is cascaded with the second stage 400b by the connection of a control terminal (B) of the third transistor Q3 to the emitter terminal (E) of the second transistor Q2. In an embodiment, the third transistor Q3 may be a vertical PNP BJT.
A compound voltage VBE of the VBE circuit 400 arises from a base emitter voltage drop VBE developed in the first transistor Q1 and a voltage drop VR developed across the resistor device 404 during operation of the circuit.
For the circuit 400 shown in
Using the Taylor expansion series, we obtain the following expansion of the natural logarithm in the second term of Eqn. 14b:
The voltage drop VR is given by:
Using Eqns. 4, 14b, 15, and 16b, the compound voltage VBE′ is given as:
For the three-stage embodiment shown in
ηVT=I1R+I2R Condition 1
½ηVT=I2R Condition 2
I1=I2 Condition 3
The above description illustrates various embodiments of the present invention along with examples of how aspects of the present invention may be implemented. The above examples and embodiments should not be deemed to be the only embodiments, and are presented to illustrate the flexibility and advantages of the present invention as defined by the following claims. Based on the above disclosure and the following claims, other arrangements, embodiments, implementations and equivalents will be evident to those skilled in the art and may be employed without departing from the spirit and scope of the invention as defined by the claims.
The present disclosure is a continuation of U.S. patent application Ser. No. 13/047,313 (U.S. Pat. No. 8,471,625), filed on Mar. 14, 2011, which claims the benefit of priority from U.S. Provisional Application No. 61/345,434, filed May 17, 2010, the disclosure of which is incorporated herein by reference in its entirety for all purposes.
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Number | Date | Country | |
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61345434 | May 2010 | US |
Number | Date | Country | |
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Parent | 13047313 | Mar 2011 | US |
Child | 13910718 | US |