The present invention relates to a bias current generator. The invention more particularly relates to a bias current generator which provides bias current without requiring a resistor.
Bias current generator circuits are well known in the art. Such circuits supply current for different sub-circuits of an integrated circuit.
An example of a prior art proportional to absolute temperature (PTAT) bias current generator 100 implemented using bandgap techniques is illustrated in
Where:
This base emitter voltage difference (ΔVbe) is inherently PTAT. Assuming that the amplifier A is an ideal amplifier, the emitter currents of Q1 and Q2 are given by equation 2.
The bias current generated may then be used to bias the sub-circuits of an integrated circuit by typically mirroring the current which flows through r1.
Referring now to
The temperature coefficients (TC) of the PTAT and CTAT bias currents according to
Another drawback of resistor based PTAT or CTAT current generators is related to the trimming methods. In order to reduce output current variation due to process variation different methods are used such that the resistor value of r1 is trimmed for the desired output current. Laser trimming methods are used such that a small part of a resistor r1 is “polished” until the desired output current is achieved. Laser trimming is also used to blow a short metal link across a resistor, part of r1, such that the total resistance increases and the bias current decreases. The trimming part of the circuits adopted for laser trimming usually requires large die area. MOS transistors configured as switches are typically coupled in series or parallel with the resistor r1 such that the value of r1 can be digitally controlled. MOS transistors used as switches add errors and nonlinearity on the resulting bias current generated due to the finite value of their drain-source resistance and corresponding nonlinearity.
There is therefore a need to provide a bias current generator which provides a bias current without incorporating a resistor.
These and other problems are addressed by providing a bias current generator incorporating a MOS device operating the triode region with a corresponding drain-source resistance ron which behaves like a resistor.
These and other features will be better understood with reference to the followings Figures which are provided to assist in an understanding of the teaching of the invention.
The present application will now be described with reference to the accompanying drawings in which:
a is a schematic circuit diagram of prior art bias current generator.
b is a schematic circuit diagram of prior art bias current generator.
The invention will now be described with reference to some exemplary bias current generators which are provided to assist in an understanding of the teaching of the invention. It will be understood that these circuits are provided to assist in an understanding and are not to be construed as limiting in any fashion. Furthermore, circuit elements or components that are described with reference to any one Figure may be interchanged with those of other Figures or other equivalent circuit elements without departing from the spirit of the present invention.
Referring to the drawings and initially to
The first bipolar transistor Q1 has its emitter coupled to the inverting terminal of an operational amplifier (op-amp) A, and the second bipolar transistor, Q2 has its emitter coupled to the non-inverting terminal of the op-amp A. The collector and base of the first bipolar transistor Q1, and the collector of the second bipolar transistor Q2 are coupled to a ground node gnd. The emitters of the bipolar transistors Q1 and Q2 are biased with current from a current mirror comprising four PMOS transistor MP1, MP2, MP3, and MP4 each of which have their source coupled to a power supply Vdd and their gates coupled together. The aspect ratios of the PMOS transistors MP1, MP2, MP3 and MP4 are similar so that MP1, MP2 and MP3 mirror the drain current of MP4. The drain of the PMOS transistor MP1 is coupled to the emitter of the first bipolar transistor Q1, and the drain of the PMOS transistor MP2 is coupled to the emitter of the second bipolar transistor Q2. It will be appreciated by those skilled in the art that the collector current density difference between Q1 and Q2 can also be achieved by having the aspect ratio (Width/Length (W/L) of the MOS device) of MP1 greater than the aspect ratio (W/L) of MP2 so that the drain current of MP1 is greater than the drain current of MP1.
The output of the op-amp A drives the gates of two NMOS transistors, a load NMOS device MN1 and a biasing NMOS device MN2, which have different aspect ratios. The sources of both MN1 and MN2 are coupled to ground. The drain of MN1 is coupled to the base of the second bipolar transistor Q2 which is also coupled to the drain of the PMOS transistor MP3. The drain of MN2 is coupled to the drain of the PMOS transistor MP4 which is in a diode configuration. In this example, MN1 consists of a plurality “n1” unity stripe NMOS transistor coupled together in parallel, and MN2 consists of a plurality “n2” unity stripe NMOS transistor coupled together in parallel so that MN1 and MN2 have different aspect ratios. Alternatively, and as was mentioned above, the difference in aspect ratios between MN1 and MN2 may be achieved by appropriately varying the “Lengths” and “Widths” of the transistors. It will be appreciated by those skilled in the art that varying the aspect ratios may be achieved in any one of a number of different ways and it is not intended to limit the teaching of the present invention to any one specific arrangement.
In operation, the amplifier A forces its inverting and non-inverting inputs to the same voltage level, via MN2, MP4, MP3, MP2, MP1, such that the base-emitter voltage difference from Q1 to Q2 is reflected across MN1 from drain to source. For n1>n2 MN2 operates in the saturation region and MN1 operates in the triode region. The load NMOS transistor MN1 is driven by the amplifier A so that it operates in the triode region with a corresponding drain-source resistance ron. As the drain of the load NMOS transistor MN1 is coupled to the base of the second bipolar transistor Q2 a base-emitter voltage difference (ΔVbe) resulting from the collector current density differences between the first and second bipolar transistors Q1, Q2 is developed across the drain-source resistance ron of MN1. The base-emitter voltage difference (ΔVbe) from Q1 to Q2 is reflected across ron of MN1 which results in generation of a bias current Ibias.
Referring now to
Referring now to
Referring now to
A biasing device, in this case, a diode connected NMOS transistor MN2 is connected in a cascoded manner intermediate the NMOS transistor MN1 and the PMOS transistor MP2. The load NMOS transistor MN1 is biased to operate in the triode region such that the NMOS transistor MN1 has a corresponding drain-source resistance ron. In this arrangement MN1 operates as a linear resistor. The NMOS transistor MN2 is biased to operate in the saturation region. MN1 and MN2 are biased with the drain current from MP2.
The biasing of MN1 and MN2 is achieved by operably coupling MN1 to MN2 such that MN2 is forced to operate in saturation, and MN1 in the triode region (linear) region. In this embodiment, the gate and drain of MN2 are coupled to the drain of the PMOS transistor MP2, while the source of MN2 is coupled to the inverting input of the amplifier A. The drain of MN1 is also coupled to the inverting input of the amplifier A, and the source of MN1 is coupled to the emitter of the bipolar transistor Q2. The gate of MN1 is tied to the gate and drain of MN2.
The collector current density difference between Q1 and Q2 may be established by having the emitter area of the second bipolar transistor Q2 larger than the emitter area of the first bipolar transistor Q1. Alternatively multiple transistors may be provided in each leg, with the sum of the collector currents of each of the transistors in a first leg being greater than that in a second leg. As a consequence of the differences in collector current densities between the bipolar transistors Q1 and Q2 a base-emitter voltage difference (ΔVbe) is developed across the drain-source resistance ron of MN1 resulting in a PTAT bias current:
The bias current Ibias generated may be used to bias sub-circuits of an integrated circuit by mirroring the current which flows through MN1.
A trimming circuit Tr is coupled in parallel to the NMOS transistor MN2. This circuit provides for a varying of the gate source voltage of MN2 which in turn varies the gate source voltage of MN1. The resistance ron of MN1 changes as the gate source voltage of MN1 changes which allows the bias current to be tuned to a desired value. In this exemplary arrangement of a suitable trimming circuit, the trimming circuit Tr comprises a plurality of binary weighted NMOS transistors MNs selectively coupled in parallel with the biasing device MN2. For convenience only one NMOS transistor MNs is shown in
Referring now to
Referring now to
Referring now to
A trimming circuit Tr is operably coupled to the diode configured NMOS transistor MN2 for varying the resistance ron of the load MOS device MN1. It will be appreciated by those skilled in the art that by varying the resistance of MN1 that the bias current can be tuned to a desired value. The trimming circuit Tr is substantially similar to the trimming circuit of
A second amplifier A2 which has an inverting input, non-inverting input and an output drives three PMOS transistors, namely, MP1, MP2 and MP3. The three PMOS transistors are also part of the current mirror arrangement. The output of the second amplifier A2 is coupled to the gates of MP1, MP2 and MP3. The drain of MN3 is coupled to the inverting input of the amplifier A2, and the drain of MN4 is coupled to the non-inverting input of the amplifier A2. The sources of both MN3 and MN4 are coupled to ground. The drain of MP1 is coupled to the gate-drain of MN2. The drain of MP2 is coupled to the emitter of Q1. The drain of MP3 is coupled to the drain of MN4. The non-inverting input of amplifier A1 is coupled to the inverting input of the amplifier A2.
As a consequence of the differences in collector current densities between the bipolar transistors Q1 and Q2 a base-emitter voltage difference (ΔVbe) is developed across the drain-source resistance ron of MN1 resulting in a PTAT bias current:
The bias current flows from MN1 to the drain of MN3. The second amplifier A2 forces the voltages at its inverting and non-inverting inputs of A2 to be the same. As MN3 and MN4 have the same aspect ratios and their drain source voltages as well as their gate source voltages are the same, their drain current will also be the same. In other words, the drain current of MN4 will track the drain current of MN3. The drain current of MN4 is mirrored by each of the PMOS transistors MP1, MP2 and MP3. The aspect ratios of MP3 and MP2 are substantially similar, and therefore they provide substantially the same bias current. However, MP1 supplies bias current to the emitter of Q1 as well as the drain of MN1. Therefore, if Q1 and Q2 are to be biased with same amount of current the aspect ratio of MP1 must be greater than the aspect ratio of MP2 to account for some of the current which flows through MN1.
The bias current generator 700 has a high power supply rejection ratio due to the logarithmic relationship of base-emitter voltage of Q1 and Q2 versus their emitter currents. Thus, the bias current Ibias is less dependent in variations in the power supply. Furthermore, as the drain current of MN4 tracks the drain current of MN3 even slight variations in the supply voltage is inherently compensated.
It will be understood that what has been described herein are exemplary embodiments of circuits which have many advantages over the bias current generators known heretofore. By providing a transistor operating in the triode region circuits provided in accordance with the teaching of the invention are less sensitive to process variations compared to circuits using resistors. A further advantage is that the generator occupies less silicon area as the MOS devices used within the context of the present invention may be implemented in smaller silicon area than resistors.
While the present invention has been described with reference to exemplary arrangements and circuits it will be understood that it is not intended to limit the teaching of the present invention to such arrangements as modifications can be made without departing from the spirit and scope of the present invention. In this way it will be understood that the invention is to be limited only insofar as is deemed necessary in the light of the appended claims.
It will be understood that the use of the term “coupled” is intended to mean that the two transistor s are configured to be in electric communication with one another. This may be achieved by a direct link between the two transistors or may be via one or more intermediary electrical transistors or other electrical elements.
Similarly the words “comprises” and “comprising” when used in the specification are used in an open-ended sense to specify the presence of stated features, integers, steps or components but do not preclude the presence or addition of one or more additional features, integers, steps, components or groups thereof.
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