This application is a divisional application of U.S. patent application Ser. No. 09/931,433 filed on Aug. 16, 2001, entitled “Biaxially Textured Articles Formed by Powder Metallurgy”, the entire disclosure of which is incorporated herein by reference, which is a divisional application of U.S. patent application Ser. No. 09/570,289 entitled Biaxially Textured Articles Formed by Powder Metallurgy, filed on May 15, 2000, which issued as U.S. Pat. No. 6,331,199 on Dec. 18, 2001, hereby incorporated by reference. The following relate to the present invention and are hereby incorporated by reference: U.S. patent application Ser. No. 09/571,561 Method for Forming Biaxially Textured Articles by Powder Metallurgy by Goyal, filed on May 15, 2000; U.S. Pat. No. 5,739,086 Structures Having Enhanced Biaxial Texture and Method of Fabricating Same by Goyal et al., issued Apr. 14, 1998; U.S. Pat. No. 5,741,377 Structures Having Enhanced Biaxial Texture and Method of Fabricating Same by Goyal et al., issued Apr. 21, 1998; U.S. Pat. No. 5,898,020 Structures Having biaxial Texture and Method of Fabricating Same by Goyal et al., issued Apr, 27, 1999; U.S. Pat. No. 5,958,599 Structures Having Enhanced Biaxial Texture by Goyal et al., issued Sept. 28, 1999; U.S. Pat. No. 5,964,966 Method of Forming Biaxially Textured Substrates and Devices Thereon by Goyal et al., issued Oct. 21, 1999; and U.S. Pat. No. 5,968,877 High Tc YBCO Superconductor Deposited on Biaxially Textured Ni Substrate by Budai et al., issued Oct. 19, 1999.
This invention was made with Government support under Contract No. DE-AC05-960R22464 awarded by the United States Department of Energy. The Government has certain rights in this invention.
Number | Name | Date | Kind |
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5739086 | Goyal et al. | Apr 1998 | A |
5741377 | Goyal et al. | Apr 1998 | A |
5898020 | Goyal et al. | Apr 1999 | A |
5958599 | Goyal et al. | Sep 1999 | A |
5964966 | Goyal et al. | Oct 1999 | A |
5968877 | Budai et al. | Oct 1999 | A |
6458223 | Hans Thieme et al. | Oct 2002 | B1 |
6475311 | Fritzemeier et al. | Nov 2002 | B1 |
Entry |
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