This disclosure generally relates to photovoltaic devices, and more particularly to bifacial thin-film photovoltaic cells.
A typical photovoltaic cell includes a p-n junction, which can be formed by a layer of n-type semiconductor in direct contact with a layer of p-type semiconductor. The electronic differences between these two materials create a built-in electric field and potential difference. When a p-type semiconductor is placed in intimate contact with an n-type semiconductor, then a diffusion of electrons can occur from the region of high electron-concentration (the n-type side of the junction) into the region of low electron-concentration (the p-type side of the junction). The diffusion of carriers does not happen indefinitely, however, because of an opposing electric field created by the charge imbalance. The electric field established across the p-n junction induces separation of charge carriers that are created as result of photon absorption. When light is incident on this junction, the photons can be absorbed to excite pairs of electrons and holes, which are “split” by the built-in electric field, creating a current and voltage.
The majority of photovoltaic cells today are made using relatively thick pieces of high-quality silicon (approximately 200 μm) that are doped with p-type and n-type dopants. The large quantities of silicon required, coupled with the high purity requirements, have led to high prices for solar panels. Thin-film photovoltaic cells have been developed as a direct response to the high costs of silicon technology. Thin-film photovoltaic cells typically use a few layers of thin-films (≦5 μm) of low-quality polycrystalline materials to mimic the effect seen in a silicon cell. A basic thin-film device consists of a substrate (e.g., glass, metal foil, plastic), a metal-back contact, a 1-5 μm semiconductor layer to absorb the light, another semiconductor layer to create a p-n junction and a transparent top conducting electrode to carry current. Since very small quantities of low-quality material are used, costs of thin-film photovoltaic cells can be lower than those for silicon.
Thin-film photovoltaic cells are often manufactured using chalcogenide materials (sulfides, selenides, and tellurides). A chalcogenide is a chemical compound consisting of at least one chalcogen ion (group 16 (VIA) elements in the periodic table, e.g., sulfur (S), selenium (Se), and tellurium (Te)) and at least one more electropositive element. Chalcogenide (both single and mixed) semiconductors have optical band gaps well within the terrestrial solar spectrum, and hence, may be used as photon absorbers in thin-film photovoltaic cells to generate electron-hole pairs and convert light energy to usable electrical energy. The two primary chalcogenide technologies in the thin-film solar space are copper-indium/gallium-sulfide/selenide (CIGS) and cadmium-tellurium (CdTe). CIGS and CdTe photovoltaic cells have lower costs-per-watt produced than silicon-based cells and are making significant inroads into the photovoltaic market. However, CIGS and CdTe technologies are likely to be limited by the potential higher costs, lower material availability, and toxicity of some of their constituent elements (e.g., indium, gallium, tellurium, cadmium). More recently, chalcogenide thin-films using copper-zinc-tin-sulfide/selenide (CZTS) have been developed.
The present disclosure is illustrated for example, and not by way of limitation, in the figures of the accompanying drawings and in which like reference numerals refer to similar elements and in which:
In the typical photovoltaic-cell design, light can only penetrate through the top transparent-conducting-oxide layer (composed of materials such as ZNO, AZO, or ITO) to be absorbed by the photovoltaic-absorber layer, with no light from the bottom of the photovoltaic cell reaching the photovoltaic-absorber layer. Even in designs where a transparent glass substrate is used, the typical conductive back contact layer such as molybdenum (Mo) is opaque and does not allow light to reach the photovoltaic-absorber layer from the bottom of the photovoltaic-cell. As such, only light that is directly incident to the front of the photovoltaic cell is absorbed in these designs, and any scattered and/or reflected light (for example, light reflected from a surface that the photovoltaic-cell is mounted on) that reaches the back of the photovoltaic cell cannot reach the photovoltaic-absorber layer.
Single-Stack Bifacial Photovoltaic Cells
In particular embodiments, the substrate 107 may be any suitable transparent substrate capable of withstanding high temperatures and/or pressures. The substrate 107 may provide structural support for the film stack. As an example and not by way of limitation, the substrate 107 may be soda-lime glass, a polymer such as polyethylene terephthalate (“PET”), polyacrylates, polycarbonates, polyesters, polysulfones, polyetherimides, silicon, epoxy resin, or silicon-functionalized epoxy resin, another suitable substrate, or any combination thereof, and may have a thickness in the range of approximately 0.7 to 2.3 millimeters (mm), although other thicknesses may be suitable. The substrate 107 may receive incident light 101 on its bottom exposed side and transmit it through to the absorber layer 106 (via one or more intermediate layers) as transmitted light 102. In particular embodiments, the substrate 107 may be replaced by another suitable transparent protective layer or coating, or may be added during construction of a solar module or panel. Alternatively, the layers of the photovoltaic cell 100 may be deposited on a flat substrate (such as a glass substrate intended for window installations), or directly on one or more surfaces of a non-imaging solar concentrator, such as a trough-like or Winston optical concentrator.
In particular embodiments, the substrate 107 may be coated with an electrical contact, such as a transparent-conducting-oxide layer 103. The transparent-conducting-oxide layer 103 may be any suitable electrode material, such as, for example, titanium oxide (e.g., one or more of TiO, TiO2, Ti2O3, or Ti3O5), aluminum oxide (e.g., Al2O3), cobalt oxide (e.g., one or more of CoO, Co2O3, or Co3O4), silicon oxide (e.g., SiO2), tin oxide (e.g., one or more of SnO or SnO2), zinc oxide (e.g., ZnO), molybdenum oxide (e.g., one or more of Mo, MoO2, or MoO3), tantalum oxide (e.g., one or more of TaO, TaO2, or Ta2O5), tungsten oxide (e.g., one or more of WO2 or WO3), indium oxide (e.g., one or more of InO or In2O3), magnesium oxide (e.g., MgO), bismuth oxide (e.g., Bi2O3), copper oxide (e.g., CuO), vanadium oxide (e.g., one or more of VO, VO2, V2O3, V2O5, or V3O5), chromium oxide (e.g., one or more of CrO2, CrO3, Cr2O3, or Cr3O4), zirconium oxide (e.g., ZrO2), or yttrium oxide (e.g., Y2O3). Additionally, in particular embodiments, transparent-conducting-oxide layer 103 may be doped with one or more of a variety of suitable elements or compounds. For example, transparent-conducting-oxide layer 103 may comprise ZnO or In2O3 doped with one or more of aluminum oxide, titanium oxide, zirconium oxide, vanadium oxide, or tin oxide. In another particular embodiment, transparent-conducting-oxide layer 103 may be a multi-layer structure comprising a first layer comprising one or more of zinc oxide, aluminum oxide, titanium oxide, zirconium oxide, vanadium oxide, or tin oxide, and a second layer comprising ZnO or In2O3 doped with one or more of aluminum oxide, titanium oxide, zirconium oxide, vanadium oxide, or tin oxide. The transparent-conducting-oxide layer 103 may have a thickness in the range of approximately 500 to 2000 nanometers (nm), although other thicknesses may be suitable. The transparent-conducting-oxide layer 103 and other layers may be transparent to allow light penetration into the absorber layer 106 (directly or via one or more intermediate layers).
In particular embodiments, the absorber layer 106 may be a chalcogenide thin-film, such as, for example, a CIS layer, a CIS2 layer, a CIGS layer, a CZTS layer, another suitable photoactive conversion layer, or any combination thereof. The absorber layer 106 may be either a p-type or an n-type semiconductor layer. Because the conducting layers on both sides of the p-n junction formed by absorber layer 106 and buffer layer 105 are transparent, the photovoltaic cell 100 may be operable to transmit the incident light 101 to both the top side and the bottom side of the absorber layer 106. Consequently, transmitted light 102 may be absorbed on both the top side and bottom side of the photovoltaic-absorber layer, which may increase electrical energy produced by the photovoltaic cell 100. In particular embodiments, absorber layer 106 may actually include a plurality of stacked layers. In particular embodiments, the photovoltaic cell 100 may include multiple absorber layers 106. The plurality of absorber layers 106 or the plurality of stacked layers may vary between, for example, CIS, CIS2, CIGS, CZTS layers. In particular embodiments, absorber layer 106 may have a total thickness in the range of approximately 0.5 to 3 micrometers (μm), although other thicknesses may be suitable. Although this disclosure describes particular types of absorber layers 106, this disclosure contemplates any suitable type of absorber layers 106.
In particular embodiments, a buffer (window) layer 105 may be grown or otherwise deposited over absorber layer 106. The buffer layer 105 may form a p-n junction with the absorber layer 106. The buffer layer 105 may be either a p-type or an n-type semiconducting layer. In particular embodiments, buffer layer 105 may include one or more of the following semiconductor materials: silicon (Si), germanium (Ge), tin (Sn), beta iron silicide (β-FeSi2), indium antimony (InSb), indium arsenic (InAs), indium phosphate (InP), gallium phosphate (GaP), aluminum phosphate (AlP), gallium arsenic (GaAs), gallium antimony (GaSb), aluminum antimony (AlSb), silicon carbide (SiC), tellurium (Te), zinc antimony (ZnSb), mercury telluride (HgTe), led sulfide (PbS), led selenide (PbSe), led telluride (PbTe), cadmium sulfide (CdS), cadmium selenide (CdSe), cadmium telluride (CdTe), zinc sulfide (ZnS), zinc selenide (ZnSe), zinc telluride (ZnTe), tin telluride (SnTe), copper sulfide (Cu1-xS (x varies from 1 to 2)), copper selenide (Cu1-xSe (x varies from 1 to 2)), copper indium disulfide (CuInS2), copper gallium disulfide (CuGaS2), copper indium gallium disulfide, (Cu(In1-xGax)S2 (x varies from 0 to 1)), copper indium diselenide (CuInSe2), copper gallium diselenide (CuGaSe2), copper indium gallium diselenide (Cu(In1-xGax)Se2 (x varies from 0 to 1)), copper silver indium gallium disulfide-(Cu1-xAgx)(In1-yGay)S2 (x varies from 0 to 1, y varies from 0 to 1)), copper silver indium gallium diselenide (Cu1-xAgx)(In1-yGay)Se2 (x varies from 0 to 1, y varies from 0 to 1)), (Cu1-xAux)InS2 (x varies from 0 to 1), (Cu1-xAux)CuGaS2 (x varies from 0 to 1), (Cu1-xAux)(In1-yGay)S2 (x varies from 0 to 1, y varies from 0 to 1), (Cu1-xAux)InSe2(x varies from 0 to 1), (Cu1-xAux)GaSe2 (x varies from 0 to 1), (Cu1-xAux)(In1-xGax)Se2 (x varies from 0 to 1), (Ag1-xAux)(In1-xGax)Se2 (x varies from 0 to 1), (Cu1-x-yAgxAuy)(In1-zGaz)Se2 (x varies from 0 to 1, y varies from 0 to 1, z varies from 0 to 1), (Cu1-xAux)2S (x varies from 0 to 1), (Ag1-xAux)2S (x varies from 0 to 1), (Cu1-x-y AgxAuy)2S (x varies from 0 to 1, y varies from 0 to 1), indium sulfide (In2S3), indium selenide (In2Se3), aluminum nitride (AlN), indium nitride (InN), gallium nitride (GaN), bismuth sulfide (Bi2S3), antimony sulfide (Sb2S3), silver sulfide (Ag2S), tungsten sulfide (WS2), tungsten selenide (WSe2), molybdenum sulfide (MoS2), molybdenum selenide (MoSe2), tin sulfide (SnSx (x varies from 1 to 2)), tin selenide (SnSex (x varies from 1 to 2)), or copper tin sulfide (Cu4SnS4). Buffer layer 105 may have a thickness in the range of approximately 30 to 70 nm, although other thicknesses may be suitable.
In particular embodiments, an insulating layer 104 may be grown or otherwise deposited over buffer layer 105. The insulating layer may improve the efficiency of the photovoltaic cell 100 by limiting the detrimental effects of any non-uniformity in the thin-film layer. For example, insulating layer 104 may be formed from ZnO and have a thickness in the range of approximately 70 to 100 nm, although other thicknesses may be suitable. Another transparent-conducting-oxide layer 103 may then be deposited over the insulating layer 104. In particular embodiments. This top transparent-conducting oxide layer 103 may have a thickness in the range of approximately 0.2 to 1.5 μm, although other thicknesses may be suitable. The top transparent-conducting-oxide layer 103 may receive incident light 101 and transmit it down towards the absorber layer 106 as transmitted light 102 (directly or via one or more intermediate layers).
In particular embodiments, the photovoltaic cell 100 may be coated with a transparent protective layer on the top side, the bottom side, or both. The protective layer may protect the photovoltaic cell 100 from weathering and other physical damage without interfering with the collection of incident light 101. As an example and not by way of limitation, the transparent protective layer may comprise ethylene-vinyl acetate (EVA), another suitable transparent protective material, or any combination thereof
Those of skill in the art will appreciate that
Double-Stack Bifacial Photovoltaic Cells
In particular embodiments, the substrate 107 may be any suitable substrate capable of withstanding high temperatures and/or pressures, as described previously. Furthermore, in particular embodiments, the substrate 107 in double-stack cell 200 may be an electrically-conducting material, such as, for example, stainless steel, aluminum, tungsten, molybdenum, copper, a semiconducting material, another suitable electrically-conducting material, or any combination thereof. A substrate 107 comprising electrically-conducting material may function as a hole-conducting layer for the double-stack cell 200. In such embodiments, an electrically-conducting substrate 107 may act as a hole-transport layer for both the absorber layer 106 above the substrate 107 as well as the absorber layer 106 below the substrate 107. Alternatively, in particular embodiments, the substrate 107 may be a substantially non-conducting or insulating material, such as, for example, glass, Si, Ge, GaAs, Al2O3, graphite, another material unsuitable for conducting electricity, or any combination thereof. If the substrate 107 is not electrically conducting, the substrate 107 may be coated on the top and bottom sides with an electrical contact consisting of any suitable electrode material, such as, for example, Mo, W, Al, Fe, Cu, Sn, Zn, another suitable electrode material, or any combination thereof, having a thickness in the range of approximately 500 to 5000 nanometers (nm), although other thicknesses may be suitable. In particular embodiments, the layers of the double-stack cell 200 may be deposited on a flat substrate (such as a glass substrate intended for window installations), or directly on one or more surfaces of a non-imaging solar concentrator, such as a trough-like or Winston optical concentrator.
In particular embodiments, a barrier layer 201 may be grown or otherwise deposited over both the top side and the bottom side of the substrate 107. The barrier layer 201 may function as a barrier between the substrate 107 and the absorber layer 106 to prevent the substrate 107 or any coatings on the substrate 107 from contaminating the absorber layer 106. The barrier layer 201 may consist of Cr, Mo, Cu, TiN, TiO2, SiN, SiC, W, another suitable material, or any combination thereof, having a thickness in the range of approximately 5 to 500 nanometers (nm), although other thicknesses may be suitable.
In particular embodiments, an absorber layer 106 is then deposited on each barrier layer 201 on either side of the substrate 107. The absorber layer 106 in double-stack cell 200 may be any suitable photoactive conversion layer, as described previously. Because both sides of the double-stack cell 200 are exposed able to receive incident light 101, the double-stack cell 200 may be operable to transmit the incident light 101 to both the top and bottom absorber layers 106. Consequently, transmitted light 102 may be absorbed on both the top side and bottom side of the double-stack cell 200, which may increase electrical energy produced by the double-stack cell 200.
In particular embodiments, a buffer (window) layer 105 may be grown or otherwise deposited over each absorber layer 106. The buffer layer 105 may form a p-n junction with the absorber layers 106, and may comprise any suitable semiconductor materials, as described previously.
In particular embodiments, an insulating layer 104 may be grown or otherwise deposited between the buffer layers 105 and the transparent-conducting-oxide layers 103, as described previously.
Those of skill in the art will appreciate that
Solar Module System Using Bifacial Photovoltaic Cells
Although
In particular embodiments, reflective surface 305 may be comprised of a mirrored surface, lightly-colored or otherwise reflective cement, metal (e.g., stainless steel, aluminum, etc.), any other suitably reflective material, or any combination thereof. In particular embodiments, mounting structure 304 may be a rod, spacer, mount, or other rigid structure attached capable of supporting the weight of the photovoltaic cells 100/200 and maintaining their position at a fixed-distance from reflective surface 305 such that the reflective surface 305 may catch incident light 101 not absorbed by the front side of photovoltaic cells 100/200 and reflect it back toward the back side of photovoltaic cells 100/200 as reflected incident light 301. Although this disclosure describes particular types of mounting structures 304 and reflective surfaces 305, this disclosure contemplates any suitable type of mounting structures 304 and reflective surfaces 305.
Miscellaneous
Herein, “or” is inclusive and not exclusive, unless expressly indicated otherwise or indicated otherwise by context. Therefore, herein, “A or B” means “A, B, or both,” unless expressly indicated otherwise or indicated otherwise by context. Moreover, “and” is both joint and several, unless expressly indicated otherwise or indicated otherwise by context. Therefore, herein, “A and B” means “A and B, jointly or severally,” unless expressly indicated otherwise or indicated otherwise by context. Furthermore, “a”, “an,” or “the” is intended to mean “one or more,” unless expressly indicated otherwise or indicated otherwise by context. Therefore, herein, “an A” or “the A” means “one or more A,” unless expressly indicated otherwise or indicated otherwise by context.
This disclosure encompasses all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Similarly, where appropriate, the appended claims encompass all changes, substitutions, variations, alterations, and modifications to the example embodiments herein that a person having ordinary skill in the art would comprehend. Moreover, this disclosure encompasses any suitable combination of one or more features from any example embodiment with one or more features of any other example embodiment herein that a person having ordinary skill in the art would comprehend. Furthermore, reference in the appended claims to an apparatus or system or a component of an apparatus or system being adapted to, arranged to, capable of, configured to, enabled to, operable to, or operative to perform a particular function encompasses that apparatus, system, component, whether or not it or that particular function is activated, turned on, or unlocked, as long as that apparatus, system, or component is so adapted, arranged, capable, configured, enabled, operable, or operative.