Claims
- 1. A process for increasing the green cohesion of cellulosic material in the form of granulates, chips, fiber or meal, comprising treatment of the cellulosic material with an essentially totally water-based polyisocyanic binding composition, useful to give green tack cohesion values greater than 1.0 kg to lignocellulosic materials in the form of granulates, chips, fibers or meal, said binding composition comprising an aqueous emulsion containing at least one polyisocyanate and at least one water-dispersed acetovinylic resin having a glass transition temperature (Tg) less than 5.degree. C.
- 2. A process according to claim 1, wherein the binding composition is used in a quantity between 2 and 50% by weight, calculated on the chip, and with green cohesion values of the resinated material higher than 1 Kg.
- 3. A process according to claim 1, wherein the binding composition is used in a quantity between 5 and 20% by weight, calculated on the chip, and with green cohesion values of the resinated material between 2.0 and 3.5 Kg.
- 4. A process according to claim 1, wherein the binding compositions is prepared in situ on the lignocellulosic material.
- 5. A process according to claim 1, wherein the quantity of acetovinylic resin is 1 to 15% by weight based on the dry lignocellulosic material.
- 6. A process according to claim 1, wherein the acetovinylic resins have a glass transition temperature between -15.degree. and 0.degree. C. and a minimum film forming temperature of about 0.degree. C.
- 7. A process for increasing the green cohesion of cellulosic material in the form of granulates, chips, fiber or meal, comprising treatment of the cellulosic material with an essentially water-based polyisocyanic binding composition, useful to give green tack cohesion values greater than 1.0 kg to lignocellulosic materials in the form of granulates, chips, fibers or meal, said binding composition consisting essentially of an aqueous emulsion containing at least one polyisocyante and at least one water-dispersed acetovinylic resin having a glass transition temperature (T.sub.g) less than about 5.degree. C.
Priority Claims (1)
Number |
Date |
Country |
Kind |
21682 A/88 |
Aug 1988 |
ITX |
|
Parent Case Info
This is a divisional of co-pending application Ser. No. 07/765,507 filed Sep. 26, 1991, now allowed, which is a continuation of U.S. patent application Ser. No. 07/389,886, filed Aug. 4, 1989, abandoned.
US Referenced Citations (2)
Number |
Name |
Date |
Kind |
3931088 |
Sakurada et al. |
Jan 1976 |
|
4295910 |
Cooley et al. |
Oct 1981 |
|
Foreign Referenced Citations (1)
Number |
Date |
Country |
2090261 |
Nov 1981 |
GBX |
Non-Patent Literature Citations (4)
Entry |
Patent Abstracts of Japan, vol. 10, No. 131, (c-346)[2188] May 1986. |
Chem. Abstr., vol. 93, No. 26, Dec. 1980, p. 57, Abstr. No. 240715a. |
Chem. Abstr., vol. 91, No. 22, Nov. 1979, p. 81, Abstr. No. 176846y. |
Chem. Abstr., vol. 83, No. 18, Nov. 1975, p. 57, Abstr. No. 148457p. |
Divisions (1)
|
Number |
Date |
Country |
Parent |
765507 |
Sep 1991 |
|
Continuations (1)
|
Number |
Date |
Country |
Parent |
389886 |
Aug 1989 |
|