Patent Application
20210154666
The subject matter herein generally relates to biochips, and more particularly to a biochip packaging structure.
Biochips are used for rapid detection of DNA, RNA, peptides, proteins, and other biological components on a surface of the biochip. The biochips are widely used in the biomedical field to rapidly obtain disease detection results.
At present, the biochip is generally connected to a substrate by wire bonding, but this causes the surface of the biochip to be uneven. After a microfluidic channel is affixed to the surface of the biochip, liquid leakage may occur due to unevenness of the microfluidic channel on the surface of the biochip, thereby affecting the detection results.
Implementations of the present disclosure will now be described, by way of embodiments, with reference to the attached figures.
It will be appreciated that for simplicity and clarity of illustration, where appropriate, reference numerals have been repeated among the different figures to indicate corresponding or analogous elements. Additionally, numerous specific details are set forth in order to provide a thorough understanding of the embodiments described herein. However, it will be understood by those of ordinary skill in the art that the embodiments described herein can be practiced without these specific details. In other instances, methods, procedures and components have not been described in detail so as not to obscure the related relevant feature being described. The drawings are not necessarily to scale and the proportions of certain parts may be exaggerated to better illustrate details and features. The description is not to be considered as limiting the scope of the embodiments described herein.
Several definitions that apply throughout this disclosure will now be presented.
The term “coupled” is defined as connected, whether directly or indirectly through intervening components, and is not necessarily limited to physical connections. The connection can be such that the objects are permanently connected or releasably connected. The term “substantially” is defined to be essentially conforming to the particular dimension, shape, or other word that “substantially” modifies, such that the component need not be exact. For example, “substantially cylindrical” means that the object resembles a cylinder, but can have one or more deviations from a true cylinder. The term “comprising” means “including, but not necessarily limited to”; it specifically indicates open-ended inclusion or membership in a so-described combination, group, series and the like.
The chip packaging layer 23 includes a resin layer 22. The resin layer 22 includes at least one biochip 20 and a conductive pillar 21 located on each of two sides of each biochip 20. In one embodiment, a material of the resin layer 22 is polyimide.
The biochips 20 are arranged at intervals in the resin layer 22. The biochip 20 includes a first surface 201 and a second surface 202 opposite to the first surface 201. The first surface 201 is flush with a side of the resin layer 22 and exposed from the resin layer 22. The first surface 201 is provided with a sensing area (not shown), and the sensing area is also exposed from the resin layer 22. The biochip 20 can be applied to various medical and biochemical tests, such as obtaining gene sequences, analyzing protein composition, checking pH values, and the like, so as to realize detection of biological body fluids.
The conductive pillar 21 includes a first end 211 and a second end 212 opposite to the first end 211. The first end 211 is flush with a side of the resin layer 22 opposite the first surface 201. The second end 212 is flush with the side of the resin layer 22 flush with the biochip 20. In one embodiment, the conductive pillar 21 is arranged perpendicular to the first surface 201 and the second surface 202. A material of the conductive pillar 21 is a metal with high conductivity such as copper, silver, gold, or tungsten. In one embodiment, the material of the conductive pillar 21 is metallic copper.
The redistribution layer 40 is formed on the chip packaging layer 23. At least one metal winding 30 is located in the redistribution layer 40. Each of the metal windings 30 is electrically connected to the sensing region of each of the biochips 20 and the conductive pillar located adjacent to the metal winding 30. Each of the metal windings 30 includes a first winding portion 301 connected to the sensing area, and a second winding portion 302 connected between the first winding portion 301 and the conductive pillar 21. The first winding portion 301 may be substantially perpendicular to the first surface 201. The second winding portion 302 may be substantially parallel to the first surface 201. Therefore, a surface of the redistribution layer 40 is substantially flat.
A material of the metal winding 30 is a metal having high conductivity, such as copper, silver, gold, or tungsten. In one embodiment, the material of the metal winding 30 is metal copper.
The microfluidic channel 50 is formed on the redistribution layer 40 and corresponds to the sensing area of the biochip 20. In one embodiment, the microfluidic channel 50 is a thin film. The microfluidic channel 50 can be used for mixing, transmission, and separation of biological fluids. Through the use of the biochip 20, the microfluidic channel 50 can reduce error of manual operation experiments, reduce energy consumption and the required amount of biological fluids, and save manpower and time.
The metal winding 30 ensures the flatness of the redistribution layer 40, so that the microfluidic channel 50 can be integrated on the surface of the redistribution layer 40. The related art uses a wire bonding method, which makes the surface of the redistribution wiring layer 40 uneven, so that the microfluidic channel 50 will leak when the biological liquid is injected due to the unevenness of the redistribution wiring layer 40.
Each of the solder balls 60 is connected to the second end 212 of a respective one of the conductive pillars 21.
The solder ball 60 is used to connect with an external device (not shown), so as to realize signal transmission between the biochip package structure 100 and the external device.
In use, a biological fluid is injected into the microfluidic channel 50, and the biological fluid is detected by the sensing area of the biochip 20. A detection result of the biochip 20 is transmitted to the external device through the redistribution layer 40, the conductive pillars 21, and the solder balls 60 for analysis.
In the biochip packaging structure, by using the metal winding 30 between the sensing area of each of the biochips 20 and the adjacent conductive pillar 21, the metal winding 30 is arranged parallel to the surface of the biochip 20, so that the redistribution layer 40 and the microfluidic channel 50 are flat, thereby preventing the microfluidic channel 50 on the surface of the biochip 20 from leaking when a biological fluid is injected, and thereby improving a detection result. Furthermore, the biochip packaging structure 100 does not use a substrate, which reduces a thickness of the biochip packaging structure 100. In addition, the microfluidic channel 50 is a thin film, which further reduces the thickness of the biochip packaging structure 100 and further expands an application range of the biochip packaging structure 100.
The embodiments shown and described above are only examples. Even though numerous characteristics and advantages of the present technology have been set forth in the foregoing description, together with details of the structure and function of the present disclosure, the disclosure is illustrative only, and changes may be made in the detail, including in matters of shape, size and arrangement of the parts within the principles of the present disclosure up to, and including, the full extent established by the broad general meaning of the terms used in the claims.
| Number | Date | Country | Kind |
|---|---|---|---|
| 201911154919.5 | Nov 2019 | CN | national |
