Claims
- 1. A method of improving the adhesion between a wood phase and a polymer phase and improving the rate of degradation of such phases comprising:
- a. applying a grafted lignin-containing material onto a surface of wood, the grafted lignin-containing material having a lignin-containing constituent with an aromatic ring and a graft constituent connected by carbon--carbon bond to the lignin aromatic ring or connected by carbon--carbon bond to a carbon bonded by one or more carbon bonds to the aromatic ring,
- b. applying a polymer to the wood such that the polymer overlies the applied graft lignin-containing material.
- 2. The method according to claim 1, wherein the lignin-containing material is at least one of: grass, softwood, hardwood, groundwood pulp, refiner mechanical pulp, thermomechanical pulp, chemithermomechanical pulp, chemical pulp, wood chips, wood, wood meal, wood fiber, bark, leaves, branches, veneer, and lignin.
- 3. The method according to claim 2, wherein the graft part,
- �--(R.sub.u).sub.m --!.sub.n
- is at least one polymerized, substituted ethene or ethyne chain, --(R.sub.u).sub.m --, containing "m" repeat units, R.sub.u, in "n" grafted polymeric chains where "m" is m=1 to m=500,000 and "n" is n=1 to n=500 such that ##STR20## and R.sub.i, with i=1, 2, 3, or 4 is an organic or inorganic functional group which does not interfere with free radical polymerization and chosen from among:
- (1) hydrogen;
- (2) a halogen;
- (3) the group consisting of an organic acid, an organic alcohol, an aldehyde, an alkane, an alkene, an alkyne, an amide, an aromatic, a cycloalkane, an ester, an ether, an organic halogen, a ketone, an organic nitrile, a phenol, an organophosphate, and an organic sulfonic acid;
- (4) the group specified at 3 substituted in at least one carbon atom by a heteroatom with the atomic symbol S, Se, Te, N, P, As, Sb, Bi, Si, Ge, Sn, Pb, or B; and
- (5) the groups specified at (3) and (4) further substituted by members of the groups specified at (3) and (4).
RELATED APPLICATION
This is a divisional of application(s) Ser. No. 08/400,891 filed on Mar. 8, 1995 now U.S. Pat. No. 5,741,875; which is a continuation-in-part (CIP of Ser. No. 08/080,006, filed Jun. 21, 1993, now U.S. Pat. No. 5,424,382; which is a CIP of U.S. Ser. No. 07/789,360, filed Nov. 8, 1991, now Abandoned
US Referenced Citations (11)
Non-Patent Literature Citations (2)
| Entry |
| R. Narayan, Inda-Journal of Nonwovens Research, 1991. |
| R. Narayan, Sci & Eng. of Compositing, Renaissance Pub., OH 1993, pp. 339-362 |
Divisions (1)
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Number |
Date |
Country |
| Parent |
400891 |
Mar 1995 |
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Continuation in Parts (2)
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Number |
Date |
Country |
| Parent |
80006 |
Jun 1993 |
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| Parent |
789360 |
Nov 1991 |
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